Patents by Inventor Daisuke Inoki

Daisuke Inoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymerizable compound, polymerizable composition, polymer, and photoresist composition
    Patent number: 11312804
    Abstract: A polymerizable compound represented by formula (1). In formula (1), one of eight hydrogen atoms is substituted by a (meth)acryloyloxy group, and the rest seven hydrogen atoms are independently non-substituted or substituted by a saturated hydrocarbon group having 1 to 10 carbons.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 26, 2022
    Assignee: JNC CORPORATION
    Inventors: Koichi Shibata, Teizi Satou, Daisuke Inoki, Hideki Hayashi
  • (Meth)acrylate compound, polymer, resist material, and method for producing (meth)acrylate compound
    Patent number: 11021433
    Abstract: A (meth)acrylate compound excellent in compatibility with other photosensitive resins and capable of providing a polymer with high transparency, a polymer, a resist material, and a method for producing the (meth)acrylate compound. The (meth)acrylate compound is represented by formula (1).
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: June 1, 2021
    Assignee: JNC CORPORATION
    Inventors: Daisuke Inoki, Teizi Satou, Hideki Hayashi
  • POLYMERIZABLE COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, AND PHOTORESIST COMPOSITION
    Publication number: 20210009546
    Abstract: A polymerizable compound represented by formula (1). In formula (1), one of eight hydrogen atoms is substituted by a (meth)acryloyloxy group, and the rest seven hydrogen atoms are independently non-substituted or substituted by a saturated hydrocarbon group having 1 to 10 carbons.
    Type: Application
    Filed: February 13, 2019
    Publication date: January 14, 2021
    Applicant: JNC CORPORATION
    Inventors: Koichi SHIBATA, Teizi SATOU, Daisuke INOKI, Hideki HAYASHI
  • Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
    Patent number: 8952108
    Abstract: A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is ? and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is ?, the ratio of ? and n×? (?:n×?) meets 1:3 to 1:100.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: February 10, 2015
    Assignee: JNC Corporation
    Inventors: Daisuke Inoki, Kiichi Kawabata, Akio Tajima, Takashi Matsuo
  • ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID ORGANIC SILICON COMPOUND, AND SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR
    Publication number: 20120149819
    Abstract: A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is ? and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is ?, the ratio of ? and n×? (?:n×?) meets 1:3 to 1:100.
    Type: Application
    Filed: June 2, 2010
    Publication date: June 14, 2012
    Inventors: Daisuke Inoki, Kiichi Kawabata, Akio Tajima, Takashi Matsuo