Abstract: A reflective optical encoder has a hub member mounted on a rotation shaft, and a circular scale plate fixed to the hub member by an adhesive and having, on a front surface thereof, a pattern composed of high reflection portions having a high light reflectance and low reflection portions having a low light reflectance. Further, a step is provided at an outer peripheral portion of the hub member, and an outer diameter of the scale plate is larger than an outer diameter at an outermost peripheral portion of an adhesive surface of the hub member in which the scale plate and the hub member are bonded.

Abstract: An encoder includes: a magnet rotatably supported; a control board including a magnetic field sensor that detects a magnetic field produced by the magnet and outputs a signal, and an arithmetic unit that detects rotation of the magnet on the basis of the output of the magnetic field sensor; a magnetic shielding cover made of a soft magnetic material; an encoder bracket used to fix the magnetic shielding cover; a protective cover fixed with being sandwiched between the magnetic shielding cover and the encoder bracket to cover the magnet and the control board to prevent entry of foreign substances; and a sealing member sandwiched between the protective cover and the encoder bracket. The magnetic shielding cover covers the magnet, the control board, and the protective cover, and the sealing member is compressed between the encoder bracket and the protective cover.

Abstract: A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol·cm).

Abstract: An encoder includes a magnetic sensor having higher detection sensitivity to a magnetic field applied in a reading direction, while having lower detection sensitivity to a magnetic field applied in a direction forming a greater angle with respect to the reading direction, an encoder substrate having the magnetic sensor mounted thereon, a magnetic shield to shield against a magnetic field including a side portion covering sides of the magnetic sensor and a top-side portion covering a top of the magnetic sensor, a permanent magnet located to face the encoder substrate, a shaft having the permanent magnet attached to a tip end of the shaft, and a bracket to support the shaft in a rotatable manner, wherein on the side portion of the magnetic shield, a notch as a connector insertion portion is located not to overlap an extended area of the magnetic sensor in the reading direction.

Abstract: A reflective optical encoder has a hub member mounted on a rotation shaft, and a circular scale plate fixed to the hub member by an adhesive and having, on a front surface thereof, a pattern composed of high reflection portions having a high light reflectance and low reflection portions having a low light reflectance. Further, a step is provided at an outer peripheral portion of the hub member, and an outer diameter of the scale plate is larger than an outer diameter at an outermost peripheral portion of an adhesive surface of the hub member in which the scale plate and the hub member are bonded.

Abstract: An encoder includes a magnetic sensor having higher detection sensitivity to a magnetic field applied in a reading direction, while having lower detection sensitivity to a magnetic field applied in a direction forming a greater angle with respect to the reading direction, an encoder substrate having the magnetic sensor mounted thereon, a magnetic shield to shield against a magnetic field including a side portion covering sides of the magnetic sensor and a top-side portion covering a top of the magnetic sensor, a permanent magnet located to face the encoder substrate, a shaft having the permanent magnet attached to a tip end of the shaft, and a bracket to support the shaft in a rotatable manner, wherein on the side portion of the magnetic shield, a notch as a connector insertion portion is located not to overlap an extended area of the magnetic sensor in the reading direction.

Abstract: An encoder includes: a magnet rotatably supported; a control board including a magnetic field sensor that detects a magnetic field produced by the magnet and outputs a signal, and an arithmetic unit that detects rotation of the magnet on the basis of the output of the magnetic field sensor; a magnetic shielding cover made of a soft magnetic material; an encoder bracket used to fix the magnetic shielding cover; a protective cover fixed with being sandwiched between the magnetic shielding cover and the encoder bracket to cover the magnet and the control board to prevent entry of foreign substances; and a sealing member sandwiched between the protective cover and the encoder bracket. The magnetic shielding cover covers the magnet, the control board, and the protective cover, and the sealing member is compressed between the encoder bracket and the protective cover.

Abstract: With a virtual plane defined as a plane that passes through end points of abutting ends of first brim portions of a back yoke portion and is perpendicular to side surfaces on both sides in a circumferential direction of a tooth portion, first inner circumferential surfaces on an inner side in a radial direction of the first brim portions are formed on an outer side in the radial direction with respect to the virtual plane, except for the end points. Insulation sheets are mounted to the side surfaces of the tooth portion. An insulation resin portion covers both end surfaces in an axial direction of the tooth portion, the first inner circumferential surfaces of the first brim portions, and second outer circumferential surfaces of second brim portions, and is molded integrally with the tooth portion, the back yoke portion, and the insulation sheets.

Abstract: A photosensitive resin composition contains an alkali-soluble polyimide (a), an unsaturated bond-containing compound (b), a heat-crosslinkable compound (c), and a photopolymerization initiator (d) having a structure represented by the following general formula (1): wherein, R1 to R3 each independently represents a halogen atom, a hydroxy group, a carboxy group, a nitro group, a cyano group, —NR13R14, a monovalent hydrocarbon group having a carbon number of 1 to 20, an acyl group having a carbon number of 1 to 20, or an alkoxy group having a carbon number of 1 to 20; R13 and R14 each independently represents a hydrogen atom or an alkyl group having a carbon number of 1 to 10; R15 represents an alkyl group having a carbon number of 1 to 5; a represents an integer of 0 to 5 and b represents an integer of 0 to 4; and A represents CO or a direct bond.

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.