Patents by Inventor Daisuke Kanda

Daisuke Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118014
    Abstract: Provided is an electric device made more convenient by being configured such that the temperature of a wide area in each accommodation section can be individually adjustable. In an electric device, a first refrigerant pipe is provided to a right-side member constituting a side surface of a first accommodation chamber, and a second refrigerant pipe is provided to a left-side member constituting a side surface of a second accommodation chamber. The first refrigerant pipe and the second refrigerant pipe are independent of each other. A regulating valve includes: a first regulating valve provided to the first refrigerant pipe, and a second regulating valve provided to the second refrigerant pipe.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: Koki Holdings Co., Ltd.
    Inventors: Yuji KISHIMA, Takuya KATAOKA, Kazuki NOGUCHI, Akihiro KOBAYASHI, Daisuke NITAWAKI, Ibuki KANDA, Shingo KOSUGI, Yoshiki AOKI
  • Publication number: 20240102718
    Abstract: Provided is an electrical device. In a setting unit, a right-room temperature display unit displays a set temperature or the current temperature of a first housing room. A left-room temperature display unit displays a set temperature or the current temperature of a second housing room. A right-room temperature setting button is an operation unit for a user to switch the set temperature of the first housing room. A left-room temperature setting button is an operation unit for a user switch the set temperature of the second housing room. The set temperature difference between the first and second housing rooms is controlled to be within a prescribed value. When the set temperature of one of the first and second housing rooms is changed so that the set temperature exceeds a prescribed value, a microcomputer automatically changes the other set temperature so that the set temperature difference is within a prescribed value.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 28, 2024
    Applicant: Koki Holdings Co., Ltd.
    Inventors: Yuji KISHIMA, Takuya KATAOKA, Kazuki NOGUCHI, Akihiro KOBAYASHI, Daisuke NITAWAKI, Ibuki KANDA, Shingo KOSUGI, Yoshiki AOKI
  • Patent number: 10968980
    Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 6, 2021
    Assignee: LIFE ROBOTICS INC.
    Inventors: Woo-Keun Yoon, Daisuke Kanda, Hiroaki Matsuda
  • Publication number: 20190093734
    Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.
    Type: Application
    Filed: November 23, 2018
    Publication date: March 28, 2019
    Inventors: Woo-Keun YOON, Daisuke KANDA, Hiroaki MATSUDA
  • Patent number: 9756761
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 5, 2017
    Assignees: SONY CORPORATION, SONY INTERACTIVE ENTERTAINMENT INC.
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Publication number: 20140036440
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Application
    Filed: April 18, 2012
    Publication date: February 6, 2014
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Publication number: 20120262880
    Abstract: A heat sink 161 includes a heat receiving block 61a; a plurality of fins 61b respectively extending upward from the heat receiving block 61a and lined up with intervals therebetween; and a coupling member 163 attached to the plurality of fins 61b and capable of reducing the vibrations of the plurality of fins 61b. According to the above structure, the vibrations of the fins of a heat sink can be reduced.
    Type: Application
    Filed: April 18, 2012
    Publication date: October 18, 2012
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Shinya Tsuchida, Daisuke Kanda