Patents by Inventor Daisuke Kanda

Daisuke Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260196944
    Abstract: A controller for a multilevel power conversion system performs processing of generating a modulated wave based on a voltage command value of each phase, processing of generating carrier waves having a predetermined carrier cycle, processing of generating an injection carrier which changes in a predetermined amplitude range and which is a signal having the same carrier cycle as the carrier cycle of the carrier waves and having a phase opposite to a phase of the carrier waves, processing of generating a modulated wave subjected to carrier injection control of superimposing the modulated wave and the injection carrier, and processing of generating a gate signal that controls operation of the plurality of semiconductor switching elements and a plurality of neutral point elements in the multilevel power converter based on a result of comparing the modulated wave subjected to the carrier injection control with a plurality of the carrier waves.
    Type: Application
    Filed: November 1, 2023
    Publication date: July 9, 2026
    Applicant: TMEIC CORPORATION
    Inventors: Daisuke KANDA, Issei FUKASAWA, Masakazu OKAYASU
  • Publication number: 20250346850
    Abstract: The automatic culture device includes an incubator capable of accommodating at least one cell culture vessel, and a flow path unit configured to supply gas and liquid necessary for cell culture to the cell culture vessel. The incubator and the flow path unit are arranged horizontally in parallel. The automatic culture device includes a front door capable of covering front surfaces of both the incubator and the flow path unit. The front door has a structure divided into upper and lower parts, the front door on an upper side can be lifted upward and includes a display unit capable of displaying a state of the automatic culture device and/or an operation unit capable of operating the automatic culture device, and the front door on a lower side can be opened by being pulled downward.
    Type: Application
    Filed: February 12, 2025
    Publication date: November 13, 2025
    Inventors: Shuhei HASHIBA, Toyoshige KOBAYASHI, Kensuke AMEMIYA, Kunihiro FUJIKI, Katsura NORIMATSU, Yosuke INOSHITA, Masakazu KAWANO, Makoto ABE, Masaaki SUGIYAMA, Daisuke KANDA
  • Patent number: 10968980
    Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 6, 2021
    Assignee: LIFE ROBOTICS INC.
    Inventors: Woo-Keun Yoon, Daisuke Kanda, Hiroaki Matsuda
  • Publication number: 20190093734
    Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.
    Type: Application
    Filed: November 23, 2018
    Publication date: March 28, 2019
    Inventors: Woo-Keun YOON, Daisuke KANDA, Hiroaki MATSUDA
  • Patent number: 9756761
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 5, 2017
    Assignees: SONY CORPORATION, SONY INTERACTIVE ENTERTAINMENT INC.
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Publication number: 20140036440
    Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.
    Type: Application
    Filed: April 18, 2012
    Publication date: February 6, 2014
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
  • Publication number: 20120262880
    Abstract: A heat sink 161 includes a heat receiving block 61a; a plurality of fins 61b respectively extending upward from the heat receiving block 61a and lined up with intervals therebetween; and a coupling member 163 attached to the plurality of fins 61b and capable of reducing the vibrations of the plurality of fins 61b. According to the above structure, the vibrations of the fins of a heat sink can be reduced.
    Type: Application
    Filed: April 18, 2012
    Publication date: October 18, 2012
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Shinya Tsuchida, Daisuke Kanda
  • Patent number: D1133202
    Type: Grant
    Filed: August 30, 2024
    Date of Patent: July 7, 2026
    Assignee: Hitachi High-Tech Corporation
    Inventors: Toyoshige Kobayashi, Kensuke Amemiya, Kunihiro Fujiki, Shuhei Hashiba, Katsura Norimatsu, Yosuke Inoshita, Masakazu Kawano, Makoto Abe, Masaaki Sugiyama, Daisuke Kanda