Patents by Inventor Daisuke Kanda
Daisuke Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240118014Abstract: Provided is an electric device made more convenient by being configured such that the temperature of a wide area in each accommodation section can be individually adjustable. In an electric device, a first refrigerant pipe is provided to a right-side member constituting a side surface of a first accommodation chamber, and a second refrigerant pipe is provided to a left-side member constituting a side surface of a second accommodation chamber. The first refrigerant pipe and the second refrigerant pipe are independent of each other. A regulating valve includes: a first regulating valve provided to the first refrigerant pipe, and a second regulating valve provided to the second refrigerant pipe.Type: ApplicationFiled: January 28, 2022Publication date: April 11, 2024Applicant: Koki Holdings Co., Ltd.Inventors: Yuji KISHIMA, Takuya KATAOKA, Kazuki NOGUCHI, Akihiro KOBAYASHI, Daisuke NITAWAKI, Ibuki KANDA, Shingo KOSUGI, Yoshiki AOKI
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Publication number: 20240102718Abstract: Provided is an electrical device. In a setting unit, a right-room temperature display unit displays a set temperature or the current temperature of a first housing room. A left-room temperature display unit displays a set temperature or the current temperature of a second housing room. A right-room temperature setting button is an operation unit for a user to switch the set temperature of the first housing room. A left-room temperature setting button is an operation unit for a user switch the set temperature of the second housing room. The set temperature difference between the first and second housing rooms is controlled to be within a prescribed value. When the set temperature of one of the first and second housing rooms is changed so that the set temperature exceeds a prescribed value, a microcomputer automatically changes the other set temperature so that the set temperature difference is within a prescribed value.Type: ApplicationFiled: January 28, 2022Publication date: March 28, 2024Applicant: Koki Holdings Co., Ltd.Inventors: Yuji KISHIMA, Takuya KATAOKA, Kazuki NOGUCHI, Akihiro KOBAYASHI, Daisuke NITAWAKI, Ibuki KANDA, Shingo KOSUGI, Yoshiki AOKI
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Patent number: 10968980Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.Type: GrantFiled: November 23, 2018Date of Patent: April 6, 2021Assignee: LIFE ROBOTICS INC.Inventors: Woo-Keun Yoon, Daisuke Kanda, Hiroaki Matsuda
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Publication number: 20190093734Abstract: A linear extension and retraction mechanism that is mounted in a robot arm mechanism includes: a plurality of first pieces having a flat plate shape which are bendably connected to each other at front and rear end faces; a plurality of second pieces having a groove shape which are bendably connected to each other at front and rear end faces of a bottom part, with the first and second pieces becoming linearly rigid when superposed, and the first and second pieces returning to a bent state when separated from each other; a head section which joins a leading first piece of the plurality of first pieces and a leading second piece of the plurality of second pieces; and a sending-out mechanism section including a plurality of rollers and for firmly superposing the first and second pieces and supporting the first and second pieces movably to front and rear. At least one groove section that extends from front to rear is formed in the surfaces of the first and second pieces that contact the rollers.Type: ApplicationFiled: November 23, 2018Publication date: March 28, 2019Inventors: Woo-Keun YOON, Daisuke KANDA, Hiroaki MATSUDA
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Patent number: 9756761Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.Type: GrantFiled: April 18, 2012Date of Patent: September 5, 2017Assignees: SONY CORPORATION, SONY INTERACTIVE ENTERTAINMENT INC.Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
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Publication number: 20140036440Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.Type: ApplicationFiled: April 18, 2012Publication date: February 6, 2014Applicant: SONY COMPUTER ENTERTAINMENT INC.Inventors: Yukito Inoue, Kensuke Ikeda, Daisuke Kanda, Yasuhiro Ootori
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Publication number: 20120262880Abstract: A heat sink 161 includes a heat receiving block 61a; a plurality of fins 61b respectively extending upward from the heat receiving block 61a and lined up with intervals therebetween; and a coupling member 163 attached to the plurality of fins 61b and capable of reducing the vibrations of the plurality of fins 61b. According to the above structure, the vibrations of the fins of a heat sink can be reduced.Type: ApplicationFiled: April 18, 2012Publication date: October 18, 2012Applicant: SONY COMPUTER ENTERTAINMENT INC.Inventors: Shinya Tsuchida, Daisuke Kanda