Abstract: A component mounting system reduces the waste of components while mounting components via an application material. The system determines whether or not to permit the start of the mounting process to a plurality of applying locations based on the post-application elapsed time that has elapsed after the application of the adhesive to the applying location. That is, the system predicts the post-application elapsed time exceeds the time limit at the mounting timing at which the component is mounted in the mounting process for each applying location. If the plurality of applying locations include no applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is permitted. However, if there is any applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is prohibited.

Abstract: A component mounting system reduces the waste of components while mounting components via an application material. The system determines whether or not to permit the start of the mounting process to a plurality of applying locations based on the post-application elapsed time that has elapsed after the application of the adhesive to the applying location. That is, the system predicts the post-application elapsed time exceeds the time limit at the mounting timing at which the component is mounted in the mounting process for each applying location. If the plurality of applying locations include no applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is permitted. However, if there is any applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is prohibited.

Abstract: An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step.

Abstract: An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step.