Patents by Inventor Daisuke Kawada

Daisuke Kawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120673
    Abstract: Provided are a metal material and a connection terminal with which the characteristics of In can be obtained on the surface even after experiencing a high-temperature environment, and a method with which it is possible to manufacture such a metal material. The metal material 1 includes: a substrate 2; an intermediate layer 3 that contains at least Ni and that covers the surface of the substrate 2; and an In coating layer 4 comprising In or an In alloy that does not contain Ni other than as unavoidable impurities, the In coating layer 4 coating the surface of the intermediate layer 3 and being exposed on the outermost surface, In being contained at an amount greater than 7/3 times the amount of Ni as a ratio of the number of atoms in the intermediate layer 3 and the In coating layer 4 combined.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 11, 2024
    Inventors: Daisuke KAWADA, Kingo FURUKAWA, Hajime WATANABE, Michitake KAMAMOTO
  • Patent number: 10879682
    Abstract: An electrical connection box includes a case including a frame that holds electronic components and a cover that blocks an opening portion of the frame, a power supply connection portion provided inside the case, an external power supply being connected to the power supply connection portion, and a cover portion that covers the power supply connection portion from above, in which the cover portion has a hole portion that communicates a space portion on a side of the power supply connection portion with respect to the cover portion with a space portion above the cover portion inside the case, and is configured to detachably hold a component.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: December 29, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Daisuke Kawada, Yuki Komiya, Hirotaka Kiyota
  • Publication number: 20200267826
    Abstract: There is provision of a substrate processing apparatus including a processing vessel, a radio frequency power supply configured to supply radio frequency (RF) current, and a member connected to the processing vessel electrically. The member is configured such that a surface area per unit volume of a first region of the member corresponding to a particular structure of the processing vessel differs from a surface area per unit volume of a second region of the member other than the first region, in order to adjust impedance of the member.
    Type: Application
    Filed: February 18, 2020
    Publication date: August 20, 2020
    Inventors: Daisuke KAWADA, Koichi KAZAMA, Dong suk KIM, Namho YUN, Jisoo SUH
  • Patent number: 10333287
    Abstract: An accommodation chamber includes an internal wall surface to be disposed to face an accommodation target object at an interval, the accommodation target object includes an external wall surface to be disposed to face the internal wall surface at an interval, one wall surface of the internal wall surface and the external wall surface includes a plurality of projecting portions that project toward another wall surface thereof, and extend along an insertion direction of the accommodation target object to the accommodation chamber, and contact the other wall surface, and the projecting portions are formed so that a demolding direction from a molding die forming the one wall surface corresponds to an extending direction, and the one wall surface is divided into a plurality of regions along the insertion direction.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 25, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Akinori Nakashima, Daisuke Kawada, Masahiro Wada
  • Patent number: 10305267
    Abstract: An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: May 28, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Daisuke Kawada, Yuki Komiya
  • Publication number: 20190123537
    Abstract: An accommodation chamber includes an internal wall surface to be disposed to face an accommodation target object at an interval, the accommodation target object includes an external wall surface to be disposed to face the internal wall surface at an interval, one wall surface of the internal wall surface and the external wall surface includes a plurality of projecting portions that project toward another wall surface thereof, and extend along an insertion direction of the accommodation target object to the accommodation chamber, and contact the other wall surface, and the projecting portions are formed so that a demolding direction from a molding die forming the one wall surface corresponds to an extending direction, and the one wall surface is divided into a plurality of regions along the insertion direction.
    Type: Application
    Filed: July 19, 2018
    Publication date: April 25, 2019
    Applicant: Yazaki Corporation
    Inventors: Akinori NAKASHIMA, Daisuke KAWADA, Masahiro WADA
  • Patent number: 10137561
    Abstract: An electrical connection box includes a housing, a tool and a tool holding portion. The tool includes a main body in which a holding hole is formed, and a pinching portion. The tool holding portion includes a holding main body, a rotation regulating portion and a protrusion protruding on an opposite side from a side of the rotation regulating portion with the holding main body interposed therebetween. The protrusion is formed to face an opposite side from a side of the pinching portion with the holding hole interposed therebetween in the main body in an insertion direction in the holding state, and comes into contact with the main body in a state in which the pinching portion is positioned in a pulling direction compared to a position of the main body from the holding state.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: November 27, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Daisuke Kawada, Yuki Komiya
  • Patent number: 9815134
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 14, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
  • Publication number: 20170144241
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kazutoshi YOKOO, Daisuke TANAKA, Daisuke KAWADA, Koshiro NIIHARA, Hiroki TAKAGI, Yujiro WATANABE, Hiroshi NAKAJIMA
  • Publication number: 20170066113
    Abstract: An electrical connection box includes a housing, a tool and a tool holding portion. The tool includes a main body in which a holding hole is formed, and a pinching portion. The tool holding portion includes a holding main body, a rotation regulating portion and a protrusion protruding on an opposite side from a side of the rotation regulating portion with the holding main body interposed therebetween. The protrusion is formed to face an opposite side from a side of the pinching portion with the holding hole interposed therebetween in the main body in an insertion direction in the holding state, and comes into contact with the main body in a state in which the pinching portion is positioned in a pulling direction compared to a position of the main body from the holding state.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 9, 2017
    Inventors: Daisuke Kawada, Yuki Komiya
  • Publication number: 20170070040
    Abstract: An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 9, 2017
    Inventors: Daisuke Kawada, Yuki Komiya
  • Publication number: 20170063069
    Abstract: An electrical connection box includes a case including a frame that holds electronic components and a cover that blocks an opening portion of the frame, a power supply connection portion provided inside the case, an external power supply being connected to the power supply connection portion, and a cover portion that covers the power supply connection portion from above, in which the cover portion has a hole portion that communicates a space portion on a side of the power supply connection portion with respect to the cover portion with a space portion above the cover portion inside the case, and is configured to detachably hold a component.
    Type: Application
    Filed: August 24, 2016
    Publication date: March 2, 2017
    Inventors: Daisuke Kawada, Yuki Komiya, Hirotaka Kiyota
  • Patent number: 9566655
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: February 14, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
  • Publication number: 20130320073
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Application
    Filed: November 22, 2011
    Publication date: December 5, 2013
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Nihara, Hiroki Tagagi, Yujiro Watanabe, Hiroshi Nakajima