Patents by Inventor Daisuke Kawada
Daisuke Kawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120673Abstract: Provided are a metal material and a connection terminal with which the characteristics of In can be obtained on the surface even after experiencing a high-temperature environment, and a method with which it is possible to manufacture such a metal material. The metal material 1 includes: a substrate 2; an intermediate layer 3 that contains at least Ni and that covers the surface of the substrate 2; and an In coating layer 4 comprising In or an In alloy that does not contain Ni other than as unavoidable impurities, the In coating layer 4 coating the surface of the intermediate layer 3 and being exposed on the outermost surface, In being contained at an amount greater than 7/3 times the amount of Ni as a ratio of the number of atoms in the intermediate layer 3 and the In coating layer 4 combined.Type: ApplicationFiled: February 17, 2022Publication date: April 11, 2024Inventors: Daisuke KAWADA, Kingo FURUKAWA, Hajime WATANABE, Michitake KAMAMOTO
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Patent number: 10879682Abstract: An electrical connection box includes a case including a frame that holds electronic components and a cover that blocks an opening portion of the frame, a power supply connection portion provided inside the case, an external power supply being connected to the power supply connection portion, and a cover portion that covers the power supply connection portion from above, in which the cover portion has a hole portion that communicates a space portion on a side of the power supply connection portion with respect to the cover portion with a space portion above the cover portion inside the case, and is configured to detachably hold a component.Type: GrantFiled: August 24, 2016Date of Patent: December 29, 2020Assignee: YAZAKI CORPORATIONInventors: Daisuke Kawada, Yuki Komiya, Hirotaka Kiyota
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Publication number: 20200267826Abstract: There is provision of a substrate processing apparatus including a processing vessel, a radio frequency power supply configured to supply radio frequency (RF) current, and a member connected to the processing vessel electrically. The member is configured such that a surface area per unit volume of a first region of the member corresponding to a particular structure of the processing vessel differs from a surface area per unit volume of a second region of the member other than the first region, in order to adjust impedance of the member.Type: ApplicationFiled: February 18, 2020Publication date: August 20, 2020Inventors: Daisuke KAWADA, Koichi KAZAMA, Dong suk KIM, Namho YUN, Jisoo SUH
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Patent number: 10333287Abstract: An accommodation chamber includes an internal wall surface to be disposed to face an accommodation target object at an interval, the accommodation target object includes an external wall surface to be disposed to face the internal wall surface at an interval, one wall surface of the internal wall surface and the external wall surface includes a plurality of projecting portions that project toward another wall surface thereof, and extend along an insertion direction of the accommodation target object to the accommodation chamber, and contact the other wall surface, and the projecting portions are formed so that a demolding direction from a molding die forming the one wall surface corresponds to an extending direction, and the one wall surface is divided into a plurality of regions along the insertion direction.Type: GrantFiled: July 19, 2018Date of Patent: June 25, 2019Assignee: YAZAKI CORPORATIONInventors: Akinori Nakashima, Daisuke Kawada, Masahiro Wada
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Patent number: 10305267Abstract: An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.Type: GrantFiled: August 26, 2016Date of Patent: May 28, 2019Assignee: YAZAKI CORPORATIONInventors: Daisuke Kawada, Yuki Komiya
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Publication number: 20190123537Abstract: An accommodation chamber includes an internal wall surface to be disposed to face an accommodation target object at an interval, the accommodation target object includes an external wall surface to be disposed to face the internal wall surface at an interval, one wall surface of the internal wall surface and the external wall surface includes a plurality of projecting portions that project toward another wall surface thereof, and extend along an insertion direction of the accommodation target object to the accommodation chamber, and contact the other wall surface, and the projecting portions are formed so that a demolding direction from a molding die forming the one wall surface corresponds to an extending direction, and the one wall surface is divided into a plurality of regions along the insertion direction.Type: ApplicationFiled: July 19, 2018Publication date: April 25, 2019Applicant: Yazaki CorporationInventors: Akinori NAKASHIMA, Daisuke KAWADA, Masahiro WADA
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Patent number: 10137561Abstract: An electrical connection box includes a housing, a tool and a tool holding portion. The tool includes a main body in which a holding hole is formed, and a pinching portion. The tool holding portion includes a holding main body, a rotation regulating portion and a protrusion protruding on an opposite side from a side of the rotation regulating portion with the holding main body interposed therebetween. The protrusion is formed to face an opposite side from a side of the pinching portion with the holding hole interposed therebetween in the main body in an insertion direction in the holding state, and comes into contact with the main body in a state in which the pinching portion is positioned in a pulling direction compared to a position of the main body from the holding state.Type: GrantFiled: August 26, 2016Date of Patent: November 27, 2018Assignee: YAZAKI CORPORATIONInventors: Daisuke Kawada, Yuki Komiya
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Patent number: 9815134Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.Type: GrantFiled: January 10, 2017Date of Patent: November 14, 2017Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATIONInventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
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Publication number: 20170144241Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.Type: ApplicationFiled: January 10, 2017Publication date: May 25, 2017Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Kazutoshi YOKOO, Daisuke TANAKA, Daisuke KAWADA, Koshiro NIIHARA, Hiroki TAKAGI, Yujiro WATANABE, Hiroshi NAKAJIMA
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Publication number: 20170066113Abstract: An electrical connection box includes a housing, a tool and a tool holding portion. The tool includes a main body in which a holding hole is formed, and a pinching portion. The tool holding portion includes a holding main body, a rotation regulating portion and a protrusion protruding on an opposite side from a side of the rotation regulating portion with the holding main body interposed therebetween. The protrusion is formed to face an opposite side from a side of the pinching portion with the holding hole interposed therebetween in the main body in an insertion direction in the holding state, and comes into contact with the main body in a state in which the pinching portion is positioned in a pulling direction compared to a position of the main body from the holding state.Type: ApplicationFiled: August 26, 2016Publication date: March 9, 2017Inventors: Daisuke Kawada, Yuki Komiya
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Publication number: 20170070040Abstract: An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.Type: ApplicationFiled: August 26, 2016Publication date: March 9, 2017Inventors: Daisuke Kawada, Yuki Komiya
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Publication number: 20170063069Abstract: An electrical connection box includes a case including a frame that holds electronic components and a cover that blocks an opening portion of the frame, a power supply connection portion provided inside the case, an external power supply being connected to the power supply connection portion, and a cover portion that covers the power supply connection portion from above, in which the cover portion has a hole portion that communicates a space portion on a side of the power supply connection portion with respect to the cover portion with a space portion above the cover portion inside the case, and is configured to detachably hold a component.Type: ApplicationFiled: August 24, 2016Publication date: March 2, 2017Inventors: Daisuke Kawada, Yuki Komiya, Hirotaka Kiyota
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Patent number: 9566655Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.Type: GrantFiled: November 22, 2011Date of Patent: February 14, 2017Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
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Publication number: 20130320073Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.Type: ApplicationFiled: November 22, 2011Publication date: December 5, 2013Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Nihara, Hiroki Tagagi, Yujiro Watanabe, Hiroshi Nakajima