Abstract: In various embodiments, the present invention relates to a substrate that may include vias for communicating signals throughout the substrate. The substrate includes a plurality of dielectric layers and a stack of vias that may be formed on a core. One of the vias may be a first skip via that extends through at least two of the dielectric layers, while another via may extend through at least one other of the dielectric layers. The second via and the first skip via are stacked on top of one another. In another sample embodiment of the substrate, the second via may be a second skip via that extends through at least two dielectric layers.