Abstract: The power semiconductor module includes a base plate, a semiconductor chip mounted on a first main surface of the base plate, and a heat sink connected to a second main surface of the base plate, wherein: a chamfered part is provided at an end portion of at least one side of the second main surface; and, when the cross section of the base plate is viewed in a state in which the base plate is fixed to the heat sink, the slope of the second main surface of the base plate is discontinuous at the boundary between the chamfered part and an area of the second main surface other than the chambered part, and the angle between the bottom surface of the chamfered part of the base plate and the surface on the side of the heat sink where the base plate is fixed is 5° to 30°.

Abstract: A termination structure in which a semiconductor active region is surrounded with a guard ring and capable of preventing corrosion of a metal layer connected to the guard ring includes: an active region and a guard ring region surrounding the active region. A guard ring is formed on the semiconductor substrate, and an interlayer insulating film is formed on the semiconductor substrate so as to cover the guard ring. A field plate is disposed on the interlayer insulating film and is electrically connected to the guard ring via a contact penetrating the interlayer insulating film. A protective film covers the field plate, which has a laminated structure including a first metal in contact with the guard ring and a second metal which is disposed in contact with the first metal and has a lower standard potential than the first metal.

Abstract: Provided is a semiconductor module comprising a power semiconductor chip, a base, an insulating substrate bonded to the base, a semiconductor chip bonded to the insulating substrate, and a case adhered to the base by means of an adhesive. The semiconductor module has a low variability but a high assembly quality and reliability enabling a decrease in stress between the case and an adhered portion of the base. The base includes a plate-like first material, and a second material coating the first material and having a linear coefficient of expansion greater than that of the first material. The case covers at least part of a side surface of the base and is adhered to the base at least on an upper surface of the base by means of the adhesive, and a linear expansion coefficient of the case is larger than the linear expansion coefficient of the first material.

Abstract: A termination structure in which a semiconductor active region is surrounded with a guard ring and capable of preventing corrosion of a metal layer connected to the guard ring includes: an active region and a guard ring region surrounding the active region. A guard ring is formed on the semiconductor substrate, and an interlayer insulating film is formed on the semiconductor substrate so as to cover the guard ring. A field plate is disposed on the interlayer insulating film and is electrically connected to the guard ring via a contact penetrating the interlayer insulating film. A protective film covers the field plate, which has a laminated structure including a first metal in contact with the guard ring and a second metal which is disposed in contact with the first metal and has a lower standard potential than the first metal.

Abstract: A PON system according to one manner of the present invention includes an optical line terminal (OLT), at least one optical network unit (ONU), and an optical fiber that connects the optical line terminal and the optical network unit to each other. A reception level category for categorizing a reception level in the optical network unit, of an optical signal sent from the optical line terminal through the optical fiber is set. In discovery processing for searching for and registering an unregistered optical network unit, the optical line terminal registers an optical network unit corresponding to the reception level category.

Abstract: A robot has a vertical 6-axis articulated arm having an offset arm having a fifth axis and length link, and mutually linking fourth and sixth axes. The fourth and sixth axes shaft centers are parallel. The articulated arm has a head portion designated as a control point. A position and an orientation targeted to the control point is processed by an inverse transform to calculate angles of the axes. A provisional target position of the sixth axis is obtained by subtracting the link length from a target position of the sixth axis. The link length to the provisional target position is given zero to perform the inverse transform process. Processed results are evaluated. Until a difference between a calculated sixth-axis angles and provisionally decided sixth-axis angles becomes equal to or less than a predetermined value, processes started from the angle provisional decision of the sixth axis are repeatedly performed.

Abstract: In an eccentricity error correction method for an angle detector, an output shaft angle is determined in at least three measurement positions. A difference between an arm angle value at each measurement position and the output shaft angle detected at each measurement position is determined as an eccentricity error. An error curve indicates a relationship between the arm angle value and the eccentricity error, and is determined as a function of the arm angle value by approximating the eccentricity error at each measurement position with a sine wave of which a single cycle is a single rotation of the arm. A correction formula that associates the output shaft angle and the arm angle value is determined using the error curve. A correction value corresponds to the detected output shaft angle, and is determined based on the correction formula and correcting the eccentricity error when the arm is rotated.

Abstract: An image processing apparatus capable of easily generating a two-dimensional panoramic image at a high speed from a plurality of three-dimensional images includes an acquisition unit configured to acquire a generation condition of a first en-face image generated from a first three-dimensional image of an target eye, a first generation unit configured to generate a second en-face image from a second three-dimensional image of the target eye by applying the generation condition acquired by the acquisition unit to the second three-dimensional image, and a second generation unit configured to generate a combined image by combining the first en-face image with the second en-face image.

Abstract: A semiconductor device including: a semiconductor element; and a first electrode formed on a first surface of the semiconductor element. The first electrode has a stacked structure including a first electroless Ni plating layer. The first electroless Ni plating layer contains nickel (Ni) and phosphorus (P) as a composition. A phosphorus (P) concentration of the first electroless Ni plating layer is 2.5 wt % to 6 wt % inclusive, and a crystallization rate of Ni3P in the first electroless Ni plating layer is 0% to 20% inclusive.

Abstract: A PON system according to one manner of the present invention includes an optical line terminal (OLT), at least one optical network unit (ONU), and an optical fiber that connects the optical line terminal and the optical network unit to each other. A reception level category for categorizing a reception level in the optical network unit, of an optical signal sent from the optical line terminal through the optical fiber is set. In discovery processing for searching for and registering an unregistered optical network unit, the optical line terminal registers an optical network unit corresponding to the reception level category.

Abstract: A pluggable optical module includes: a circuit board insertable to and removable from a connector of a host board; a plurality of first electrodes arranged in a first direction, which crosses an insert direction of the pluggable optical module, on a first surface of the circuit board; and a plurality of second electrodes arranged in the first direction on the first surface of the circuit board, the second electrodes being arranged on a host board side associated with the host board, with respect to the plurality of first electrodes. The first and second electrodes are arranged in accordance with a layout rule for tolerating electrical impact occurring when at least one of a plurality of terminals of the connector configured to be brought into contact with respective first electrodes of the plurality of first electrodes contacts any electrode of the plurality of second electrodes.

Abstract: In an industrial robot, correction is made for change in position and attitude of an arm distal end due to mechanical deflection of the robot. In the robot, a moment applied to the first axis in its non-rotation direction opposite to its rotation direction is calculated from a load torque applied to the second axis in its rotation direction, a moment due to a second-axis-side self-weight, and a ratio of a distance between the rotation centers of the first and second axes, to a distance between the rotation centers of the second axis and a tool. A deflection amount indicating an angle of the first axis tilting in the non-rotation direction is calculated from the moment applied to the first axis and the rigidity of the first axis in the non-rotation direction. A control value is corrected based on the deflection amount to control the robot.

Abstract: A deflection angle detection device includes an input shaft encoder, a disk attached to an output shaft of a speed reducer, an output shaft encoder having detection elements disposed at mutually different positions with respect to the disk to detect angular positions of the disk. A basic angular position of the output shaft is calculated based on an angular position of the input shaft detected by the input shaft encoder, a first, a second, and a third angular positions of the output shaft are calculated based on the angular positions of the disk detected by a plurality of detecting elements, and the deflection angle of the output shaft is calculated based on a first, a second, and a third differences, which are differences between the basic angular position and the first, the second, and the third angular positions, respectively, and positions of the detection elements with respect to the disk.

Abstract: An optical transceiver of the present disclosure includes: a first light emitting element configured to perform electric-optic conversion at a first transmission rate; a second light emitting element configured to perform electric-optic conversion at a second transmission rate higher than the first transmission rate; a light receiving element configured to perform optic-electric conversion at a predetermined transmission rate; an optical sub-assembly accommodating the light emitting elements and the light receiving element; a circuit board having a plurality of integrated circuits which are configured to drive the light emitting elements and the light receiving element; a housing accommodating the optical sub-assembly and the circuit board, the housing having a longest dimension in a longitudinal direction thereof and having thermal conductivity; a temperature sensor configured to detect a temperature inside the housing; a temperature control unit configured to determine a control value to be designated to th

Abstract: A semiconductor device including: a semiconductor element; and a first electrode formed on a first surface of the semiconductor element. The first electrode has a stacked structure including a first electroless Ni plating layer. The first electroless Ni plating layer contains nickel (Ni) and phosphorus (P) as a composition. A phosphorus (P) concentration of the first electroless Ni plating layer is 2.5 wt % to 6 wt % inclusive, and a crystallization rate of Ni3P in the first electroless Ni plating layer is 0% to 20% inclusive.

Abstract: An optical transmitter includes a plurality of light-emitting units each configured to transmit an optical signal having a different wavelength and change the wavelength of the optical signal. At least one light-emitting unit of the plurality of light-emitting units is configured to adjust the wavelength.

Abstract: A robot has a vertical 6-axis articulated arm having an offset arm having a fifth axis and length link, and mutually linking fourth and sixth axes. The fourth and sixth axes shaft centers are parallel. The articulated arm has a head portion designated as a control point. A position and an orientation targeted to the control point is processed by an inverse transform to calculate angles of the axes. A provisional target position of the sixth axis is obtained by subtracting the link length from a target position of the sixth axis. The link length to the provisional target position is given zero to perform the inverse transform process. Processed results are evaluated. Until a difference between a calculated sixth-axis angles and provisionally decided sixth-axis angles becomes equal to or less than a predetermined value, processes started from the angle provisional decision of the sixth axis are repeatedly performed.

Abstract: A semiconductor power module with which it is possible to suppress the influence of noise given from a main terminal to a control terminal is provided. At least any one of main terminals (positive electrode terminal, negative electrode terminal, alternating current terminal) is so configured that the main terminal includes two parts extended in a common direction. The two parts are, for example, formed of a single component having such as a shape that the component is bifurcated from the outside toward the inside of the semiconductor power module or two different components. The two parts are so structured that the parts are extended in a common direction. Control terminals (gate signal terminal and emitter signal terminal) are so arranged that a laminated portion of the control terminals is sandwiched between one and the other of the two parts to configure the semiconductor power module.

Abstract: An optical transceiver of the present disclosure includes: a first light emitting element configured to perform electric-optic conversion at a first transmission rate; a second light emitting element configured to perform electric-optic conversion at a second transmission rate higher than the first transmission rate; a light receiving element configured to perform optic-electric conversion at a predetermined transmission rate; an optical sub-assembly accommodating the light emitting elements and the light receiving element; a circuit board having a plurality of integrated circuits which are configured to drive the light emitting elements and the light receiving element; a housing accommodating the optical sub-assembly and the circuit board, the housing having a longest dimension in a longitudinal direction thereof and having thermal conductivity; a temperature sensor configured to detect a temperature inside the housing; a temperature control unit configured to determine a control value to be designated to th

Abstract: A robot, such an industrial robot, has an arm. The arm has a plurality of rotation members, a plurality of joints each rotatably and mutually connecting adjacent two rotation members, and a plurality of electric servo motors respectively driving the joints. In this robot, every operation cycle, an angular speed is calculated at which to drive each servo motor, and a speed of a monitoring portion set in each rotation member is calculated. It is then determined whether or not the speed at the monitoring portion is equal to or lower than a reference speed. When it is determined that the speed at the monitoring portion is over the reference speed, the angular speed of each servo motor is instructed to reduce such that the speed at each monitoring portion becomes the reference speed or lower. The servo motors are driven at the angular speed that has been reduced.