Patents by Inventor Daisuke Kishikawa
Daisuke Kishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12243972Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.Type: GrantFiled: April 19, 2022Date of Patent: March 4, 2025Assignee: NICHIA CORPORATIONInventors: Daisuke Kishikawa, Takaaki Tada, Tomohisa Toda, Naoki Ishida, Yoshiki Endo
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Publication number: 20250043096Abstract: A method for producing a low-molecular fluorine compound, including a decomposition step for heating a microwave absorber by the irradiation with microwaves in a reaction vessel provided with a carrier gas inlet and a decomposed gas outlet and then bringing the heated microwave absorber into contact with particles of a material containing a fluororesin to decompose the fluororesin into the low-molecular fluorine compound, wherein the carrier gas temperature TI (° C.) at the inlet is set to a temperature lower than the temperature TR (° C.) of the heated microwave absorber. Accordingly, a temperature difference can be provided such that the temperature of a produced gas discharged from the reaction vessel becomes lower than the temperature in the decomposition reaction system, i.e., the temperature of the heated microwave absorber.Type: ApplicationFiled: October 25, 2024Publication date: February 6, 2025Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yasunori TSUKAHARA, Tamotsu TAKAMOTO, Toshihiko OGATA, Masahiro KANNO, Yukari DEGUCHI, Kazuaki FUKUSHIMA, Yosuke KISHIKAWA, Shinya HANDA, Motoshi MATSUI, Daisuke SHIRAKAWA, Yasushi YAMAKI, Masahito YAGISHITA
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Publication number: 20250039212Abstract: A fraud detection method includes: determining whether a period of a message repeatedly transmitted in an in-vehicle network is anomalous; detecting whether arbitration occurs when the message is transmitted in the in-vehicle network; and determining that the message is an anomalous message, in the case where the period of the message is anomalous and no arbitration occurs when the message is transmitted in the in-vehicle network.Type: ApplicationFiled: October 16, 2024Publication date: January 30, 2025Inventors: Manabu MAEDA, Takeshi KISHIKAWA, Daisuke KUNIMUNE
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Publication number: 20230100081Abstract: A light emitting device includes a light emitting element and a light reflecting member that reflects light emitted from the light emitting element. The light reflecting member comprises plate-shaped light reflective particles, silica, and an alkali metal. An average particle size of the light reflective particles is 0.6 ?m to 43 ?m, and an average aspect ratio of the light reflective particles is 10 or higher.Type: ApplicationFiled: September 28, 2022Publication date: March 30, 2023Applicant: NICHIA CORPORATIONInventors: Taekshi KUSUSE, Kazuya TAMURA, Daisuke KISHIKAWA, Takuya YAMANOI, Takaaki TADA, Kenji OZEKI
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Publication number: 20220336722Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.Type: ApplicationFiled: April 19, 2022Publication date: October 20, 2022Applicant: NICHIA CORPORATIONInventors: Daisuke KISHIKAWA, Takaaki TADA, Tomohisa TODA, Naoki ISHIDA, Yoshiki ENDO
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Patent number: 10683987Abstract: A light emitting device includes a substrate, a plurality of light emitting elements arranged in three or more rows on the substrate, and a light-transmissive member including a cylindrical lens portion having an array of three or more cylindrical lenses arranged parallel to each other along the rows of the light emitting elements so that each of the cylindrical lenses is on one of the three or more rows of light emitting elements. The rows of the light emitting elements are arranged with substantially uniform intervals. The cylindrical lens portion includes first cylindrical lens portions including at least cylindrical lenses at outermost sides of the array, and a second cylindrical lens portion arranged at an inner side of the first cylindrical lens portions and having a height greatest in the cylindrical lens portion.Type: GrantFiled: April 27, 2017Date of Patent: June 16, 2020Assignee: NICHIA CORPORATIONInventors: Daisuke Kishikawa, Toshihiko Aizawa, Masato Ono
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Patent number: 10411173Abstract: A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element provided on the substrate, and a light transmissive sealing member covering the light-emitting element on the substrate. The light transmissive sealing member includes a body portion and a lens portion that are sequentially disposed from a substrate side.Type: GrantFiled: March 31, 2016Date of Patent: September 10, 2019Assignee: NICHIA CORPORATIONInventors: Takanori Aruga, Yoshiki Endo, Takuya Yamanoi, Daisuke Kishikawa, Yoshitaka Tanaka
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Patent number: 10293369Abstract: A light emitting device is provided which includes a printed board, light emitting elements, and a light-transmissive member. The light emitting elements are arranged in three or more rows, and mounted on the printed board. The light-transmissive member includes three or more semi-semi-cylindrical lens portions that are arranged side by side transversely to cover the three or more rows. The heights of the tops of the semi-cylindrical lens portions are substantially equal to each other. The semi-cylindrical lens portions include first semi-cylindrical lens portions which are arranged to cover at least the both end rows, and a second semi-cylindrical lens portion which is arranged on the interior sides relative to the first semi-cylindrical lens portions in the transverse direction. The radius of curvature of the second semi-cylindrical lens portion is smaller than the first semi-cylindrical lens portions.Type: GrantFiled: December 27, 2017Date of Patent: May 21, 2019Assignee: NICHIA CORPORATIONInventors: Toshihiko Aizawa, Masato Ono, Daisuke Kishikawa
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Patent number: 10014457Abstract: A light emitting device includes light emitting elements. A substrate includes electrically conductive layers each having a first region in which the light emitting elements are arranged and a second region connected to the first region and provided at a position higher than the first region. An electrically conductive wire electrically connects the light emitting elements arranged on the electrically conductive layer and the second region of the adjacent electrically conductive layer. A resin molded portion is formed of a light-transmissive resin that seals the light emitting elements and the electrically conductive wire. The resin molded portion has a shape in which centrally projected cylindrical lens portions is aligned, and in each of the cylindrical lens portions, the light emitting elements is arranged in a line shape. The second region is arranged between the light emitting elements in the light emitting element array.Type: GrantFiled: December 22, 2016Date of Patent: July 3, 2018Assignee: NICHIA CORPORATIONInventors: Masato Ono, Daisuke Kishikawa, Toshihiko Aizawa
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Publication number: 20180178247Abstract: A light emitting device is provided which includes a printed board, light emitting elements, and a light-transmissive member. The light emitting elements are arranged in three or more rows, and mounted on the printed board. The light-transmissive member includes three or more semi-semi-cylindrical lens portions that are arranged side by side transversely to cover the three or more rows. The heights of the tops of the semi-cylindrical lens portions are substantially equal to each other. The semi-cylindrical lens portions include first semi-cylindrical lens portions which are arranged to cover at least the both end rows, and a second semi-cylindrical lens portion which is arranged on the interior sides relative to the first semi-cylindrical lens portions in the transverse direction. The radius of curvature of the second semi-cylindrical lens portion is smaller than the first semi-cylindrical lens portions.Type: ApplicationFiled: December 27, 2017Publication date: June 28, 2018Applicant: NICHIA CORPORATIONInventors: Toshihiko AIZAWA, Masato ONO, Daisuke KISHIKAWA
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Patent number: 9941451Abstract: A light emitting device includes a wiring board, a light emitting element, and a protection film. The wiring board includes a base member, and positive and negative wiring layer parts. The positive and negative wiring layer parts are arranged on or above the upper surface of the base member. The light emitting element is mounted on the wiring layer parts in a flip-chip manner. The protection film covers the base member, the wiring layer parts and the light emitting element, and is formed of an inorganic material for serving as the exterior surface of the light emitting device. Each of the wiring layer parts has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.Type: GrantFiled: October 28, 2016Date of Patent: April 10, 2018Assignee: NICHIA CORPORATIONInventor: Daisuke Kishikawa
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Publication number: 20170314764Abstract: A light emitting device includes a substrate, a plurality of light emitting elements arranged in three or more rows on the substrate, and a light-transmissive member including a cylindrical lens portion having an array of three or more cylindrical lenses arranged parallel to each other along the rows of the light emitting elements so that each of the cylindrical lenses is on one of the three or more rows of light emitting elements. The rows of the light emitting elements are arranged with substantially uniform intervals. The cylindrical lens portion includes first cylindrical lens portions including at least cylindrical lenses at outermost sides of the array, and a second cylindrical lens portion arranged at an inner side of the first cylindrical lens portions and having a height greatest in the cylindrical lens portion.Type: ApplicationFiled: April 27, 2017Publication date: November 2, 2017Applicant: NICHIA CORPORATIONInventors: Daisuke KISHIKAWA, Toshihiko AIZAWA, Masato ONO
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Publication number: 20170186928Abstract: A light emitting device includes light emitting elements. A substrate includes electrically conductive layers each having a first region in which the light emitting elements are arranged and a second region connected to the first region and provided at a position higher than the first region. An electrically conductive wire electrically connects the light emitting elements arranged on the electrically conductive layer and the second region of the adjacent electrically conductive layer. A resin molded portion is formed of a light-transmissive resin that seals the light emitting elements and the electrically conductive wire. The resin molded portion has a shape in which centrally projected cylindrical lens portions is aligned, and in each of the cylindrical lens portions, the light emitting elements is arranged in a line shape. The second region is arranged between the light emitting elements in the light emitting element array.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Applicant: NICHIA CORPORATIONInventors: Masato ONO, Daisuke KISHIKAWA, Toshihiko AIZAWA
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Publication number: 20170125651Abstract: A light emitting device includes a wiring board, a light emitting element, and a protection film. The wiring board includes a base member, and positive and negative wiring layer parts. The positive and negative wiring layer parts are arranged on or above the upper surface of the base member. The light emitting element is mounted on the wiring layer parts in a flip-chip manner. The protection film covers the base member, the wiring layer parts and the light emitting element, and is formed of an inorganic material for serving as the exterior surface of the light emitting device. Each of the wiring layer parts has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.Type: ApplicationFiled: October 28, 2016Publication date: May 4, 2017Applicant: NICHIA CORPORATIONInventor: Daisuke KISHIKAWA
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Publication number: 20160293813Abstract: A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element provided on the substrate, and a light transmissive sealing member covering the light-emitting element on the substrate. The light transmissive sealing member includes a body portion and a lens portion that are sequentially disposed from a substrate side.Type: ApplicationFiled: March 31, 2016Publication date: October 6, 2016Inventors: Takanori ARUGA, Yoshiki ENDO, Takuya YAMANOI, Daisuke KISHIKAWA, Yoshitaka TANAKA
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Patent number: 7771093Abstract: A light emitting device comprises a first metal member, a light emitting element mounted at one end of the first metal member, and a translucent covering material that covers at least the light emitting element, wherein the surface of the first metal member has a depression that determines the region where the translucent covering material is formed, and the inner wall of the depression is continuous.Type: GrantFiled: August 6, 2007Date of Patent: August 10, 2010Assignee: Nichia CorporationInventors: Daisuke Kishikawa, Keisuke Tokuda, Naoki Nishiuchi
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Publication number: 20080180959Abstract: A light emitting device comprises a first metal member, a light emitting element mounted at one end of the first metal member, and a translucent covering material that covers at least the light emitting element, wherein the surface of the first metal member has a depression that determines the region where the translucent covering material is formed, and the inner wall of the depression is continuous.Type: ApplicationFiled: August 6, 2007Publication date: July 31, 2008Applicant: NICHIA CORPORATIONInventors: Daisuke KISHIKAWA, Keisuke Tokuda, Naoki Nishiuchi
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Patent number: D612817Type: GrantFiled: March 4, 2008Date of Patent: March 30, 2010Assignee: Nichia CorporationInventors: Keisuke Tokuda, Daisuke Kishikawa, Naoki Nishiuchi
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Patent number: D662901Type: GrantFiled: February 11, 2010Date of Patent: July 3, 2012Assignee: Nichia CorporationInventors: Keisuke Tokuda, Daisuke Kishikawa, Naoki Nishiuchi
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Patent number: D728491Type: GrantFiled: June 10, 2013Date of Patent: May 5, 2015Assignee: Nichia CorporationInventors: Takuya Nakabayashi, Masaki Hayashi, Daisuke Kishikawa