Patents by Inventor Daisuke KITAGUCHI

Daisuke KITAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microphone assembly and headlining assembly
    Patent number: 11956580
    Abstract: A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: April 9, 2024
    Assignee: HOSIDEN CORPORATION
    Inventors: Shunji Muraoka, Shushin Noda, Yoshifumi Yamanaka, Kouta Onoyama, Daisuke Kitaguchi, Jun Miyajima
  • MICROPHONE ASSEMBLY AND HEADLINING ASSEMBLY
    Publication number: 20220321985
    Abstract: A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
    Type: Application
    Filed: March 28, 2022
    Publication date: October 6, 2022
    Applicant: HOSIDEN CORPORATION
    Inventors: Shunji MURAOKA, Shushin NODA, Yoshifumi YAMANAKA, Kouta ONOYAMA, Daisuke KITAGUCHI, Jun MIYAJIMA