Abstract: A display manufacturing device sticks a transparent panel to a display panel, the display panel including a front surface having a periphery covered by a bezel. The display manufacturing device includes: a dispenser that makes a dam by dispensing a light curable resin to straddle the front surface of the display panel and the bezel, and be along an inner peripheral edge of the bezel to stick the transparent panel to the front surface of the display panel; and at least one light irradiation device that emits light that cures the dam. The at least one light irradiation device emits the light in a direction that forms an acute angle between the direction and the front surface of the display panel, the direction being a direction that allows the light to reach the light curable resin that has entered a gap between the front surface and the bezel.

Abstract: Provided are a bonding device and a bonding method capable of precisely positioning both workpieces and bonding both workpieces more accurately even when a bonding surface of each workpiece includes a concavo-convex curved surface in which a protruding curved surface and a recessed curved surface are continuous. The bonding device includes an upper suction base 4 that sucks and holds a first workpiece W1 molded in advance into a concavo-convex curved shape, and a lower suction base 6 that sucks and holds a flat second workpiece W2. The lower suction base 6 includes a fixed suction base 16 and a movable suction base 17, and an upper opening surface of the movable suction base 17 is covered with a suction screen 8. The movable suction base 17 can elevate and lower between a workpiece supporting position where the flat second workpiece W2 is sucked and held and a workpiece transfer position where the movable suction base lowers downward from an upper opening surface of the fixed suction base 16.

Abstract: A display manufacturing device sticks a transparent panel to a display panel, the display panel including a front surface having a periphery covered by a bezel. The display manufacturing device includes: a dispenser that makes a dam by dispensing a light curable resin to straddle the front surface of the display panel and the bezel, and be along an inner peripheral edge of the bezel to stick the transparent panel to the front surface of the display panel; and at least one light irradiation device that emits light that cures the dam. The at least one light irradiation device emits the light in a direction that forms an acute angle between the direction and the front surface of the display panel, the direction being a direction that allows the light to reach the light curable resin that has entered a gap between the front surface and the bezel.

Abstract: The present invention is to provide an attachment device of a display panel capable of, while solving enclosure of bubbles in an attachment surface at the time of attachment, reliably removing bubbles generated even after attachment, and remarkably lowering a defectiveness ratio of an attachment body to improve productivity of attachment tasks. A vacuum chamber unit 3 is formed by a chamber main body 10 and a chamber lid body 11. A fixed attachment base 12 including a dam jig 13 is provided in an interior of the chamber main body 10, and a movable attachment base 16 is provided in an interior of the chamber lid body 11.

Abstract: The present invention is to provide an attachment device of a display panel capable of, while solving enclosure of bubbles in an attachment surface at the time of attachment, reliably removing bubbles generated even after attachment, and remarkably lowering a defectiveness ratio of an attachment body to improve productivity of attachment tasks. A vacuum chamber unit 3 is formed by a chamber main body 10 and a chamber lid body 11. A fixed attachment base 12 including a dam jig 13 is provided in an interior of the chamber main body 10, and a movable attachment base 16 is provided in an interior of the chamber lid body 11.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space to between the lateral surfaces of the recess and the support member.