Patents by Inventor Daisuke Kunimatsu

Daisuke Kunimatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8228677
    Abstract: A second output wiring and a third output wiring enter into a chip mounting portion while coming across a second side and a third side of the chip mounting portion. The other end portions of the second output wiring and the third output wiring enter into the chip mounting portion are bent toward a fourth side of the chip mounting portion, and are connected to an output pad and an output pad provided along a fourth side of the semiconductor chip. An input wiring extends along the fourth side of the chip mounting portion, is bent from a midstream to enter into the chip mounting portion while coming across the fourth side of the chip mounting portion, and is connected to an input pad provided along the fourth side of the semiconductor chip.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: July 24, 2012
    Assignee: Lapis Semiconductor Co., Ltd.
    Inventors: Daisuke Kunimatsu, Takehiro Takayanagi
  • Publication number: 20090231823
    Abstract: A second output wiring and a third output wiring enter into a chip mounting portion while coming across a second side and a third side of the chip mounting portion. The other end portions of the second output wiring and the third output wiring enter into the chip mounting portion are bent toward a fourth side of the chip mounting portion, and are connected to an output pad and an output pad provided along a fourth side of the semiconductor chip. An input wiring extends along the fourth side of the chip mounting portion, is bent from a midstream to enter into the chip mounting portion while coming across the fourth side of the chip mounting portion, and is connected to an input pad provided along the fourth side of the semiconductor chip.
    Type: Application
    Filed: February 19, 2009
    Publication date: September 17, 2009
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventors: Daisuke Kunimatsu, Takehiro Takayanagi
  • Patent number: 7497630
    Abstract: A sealed rolling bearing has sealing devices with both the functions of high sealing ability and small sliding resistance, which are antipodal to each other. The sealed rolling bearing has an outer member (1, 30) formed with an outer raceway surface (8, 29) on its inner circumferential surface. An inner member (4, 5, 32) is formed with an inner raceway surface (9a, 9b, 31) on its outer circumferential surface. The inner raceway surface (9a, 9b, 31) is arranged opposite to the outer raceway surface (8, 29). Rolling elements (10, 34) are freely rollably contained between the outer and inner raceway surfaces. Sealing devices (12, 13, 35) are arranged in an annular space formed between the outer and inner members (1, 30 and 4, 5, 32). Each of the sealing devices (12, 13; 35) has elastic sealing lips (27a˜27c, 23˜25, 37a, 37b).
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: March 3, 2009
    Assignee: NTN Corporation
    Inventors: Makoto Muramatsu, Daisuke Kunimatsu
  • Publication number: 20070031077
    Abstract: A sealed rolling bearing has sealing devices with both the functions of high sealing ability and small sliding resistance, which are antipodal to each other. The sealed rolling bearing has an outer member (1, 30) formed with an outer raceway surface (8, 29) on its inner circumferential surface. An inner member (4, 5, 32) is formed with an inner raceway surface (9a, 9b, 31) on its outer circumferential surface. The inner raceway surface (9a, 9b, 31) is arranged opposite to the outer raceway surface (8, 29). Rolling elements (10, 34) are freely rollably contained between the outer and inner raceway surfaces. Sealing devices (12, 13, 35) are arranged in an annular space formed between the outer and inner members (1, 30 and 4, 5, 32). Each of the sealing devices (12, 13; 35) has elastic sealing lips (27a˜27c, 23˜25, 37a, 37b).
    Type: Application
    Filed: October 22, 2004
    Publication date: February 8, 2007
    Applicant: NTN Corporation
    Inventors: Makoto Muramatsu, Daisuke Kunimatsu