Patents by Inventor Daisuke Masuko
Daisuke Masuko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9926475Abstract: The invention provides a resin composition capable of achieving excellent chromaticity and a sufficient degree of cure, an adhesive tape, and a method for producing an adhesive tape. The adhesive tape has at least one layer formed by making a resin composition undergo a polymerization reaction, the adhesive composition including: an acrylic monomer; a photopolymerization initiator; and a coloring agent which has a mean volume particle diameter of not less than 1 ?m and not more than 20 ?m and in which a pigment is encapsulated in a resin, in which the coloring agent is contained so that the pigment content is not less than 0.25 wt % and not more than 1.0 wt %. This allows aggregation of the coloring agent to be prevented and inhibition of the polymerization reaction to be prevented, and therefore, excellent chromaticity and a sufficient degree of cure can be achieved.Type: GrantFiled: January 28, 2014Date of Patent: March 27, 2018Assignee: DEXERIALS CORPORATIONInventors: Daisuke Masuko, Takayuki Matsushima
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Publication number: 20150376470Abstract: The invention provides a resin composition capable of achieving excellent chromaticity and a sufficient degree of cure, an adhesive tape, and a method for producing an adhesive tape. The adhesive tape has at least one layer formed by making a resin composition undergo a polymerization reaction, the adhesive composition including: an acrylic monomer; a photopolymerization initiator; and a coloring agent which has a mean volume particle diameter of not less than 1 ?m and not more than 20 ?m and in which a pigment is encapsulated in a resin, in which the coloring agent is contained so that the pigment content is not less than 0.25 wt % and not more than 1.0 wt %. This allows aggregation of the coloring agent to be prevented and inhibition of the polymerization reaction to be prevented, and therefore, excellent chromaticity and a sufficient degree of cure can be achieved.Type: ApplicationFiled: January 28, 2014Publication date: December 31, 2015Applicant: DEXERIALS CORPORATIONInventors: Daisuke MASUKO, Takayuki MATSUSHIMA
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Patent number: 9155207Abstract: An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 ?m or less based on 10-point average.Type: GrantFiled: September 7, 2012Date of Patent: October 6, 2015Assignee: DEXERIALS CORPORATIONInventors: Masahiko Ito, Daisuke Masuko
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Publication number: 20120328794Abstract: An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 ?m or less based on 10-point average.Type: ApplicationFiled: September 7, 2012Publication date: December 27, 2012Applicant: Sony Chemical & Information Device CorporationInventors: Masahiko ITO, Daisuke Masuko
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Patent number: 8211330Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct.Type: GrantFiled: March 27, 2008Date of Patent: July 3, 2012Assignee: Sony Chemical & Information Device CorporationInventors: Daisuke Masuko, Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima
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Patent number: 8147720Abstract: An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.Type: GrantFiled: December 27, 2007Date of Patent: April 3, 2012Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Katsuhiko Komuro, Masahiko Ito, Daisuke Masuko
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Patent number: 8128837Abstract: A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.Type: GrantFiled: March 27, 2008Date of Patent: March 6, 2012Assignees: Sony Corporation, Sony Corporation & Information Device CorporationInventors: Daisuke Masuko, Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima
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Publication number: 20100188829Abstract: An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 ?m or less based on 10-point average.Type: ApplicationFiled: March 19, 2010Publication date: July 29, 2010Applicant: Sony Chemical & Information Device CorporationInventors: Masahiko Ito, Daisuke Masuko
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Publication number: 20090230360Abstract: An aluminum chelate-based latent curing agent, which can cure a thermosetting epoxy resin at a relatively low temperature in a short time, is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound, and then further reacting the resultant mixture with a liquid epoxy resin and an imidazole compound or with an aromatic vinyl compound and a radical polymerization initiator.Type: ApplicationFiled: January 17, 2008Publication date: September 17, 2009Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima, Daisuke Masuko
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Patent number: 7557230Abstract: An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily. The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.Type: GrantFiled: June 2, 2006Date of Patent: July 7, 2009Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Katsuhiko Komuro, Tadasu Kawashima, Masahiko Ito, Daisuke Masuko
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Publication number: 20090152504Abstract: An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.Type: ApplicationFiled: December 27, 2007Publication date: June 18, 2009Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Katsuhiko Komuro, Masahiko Ito, Daisuke Masuko
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Publication number: 20080249258Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct.Type: ApplicationFiled: March 27, 2008Publication date: October 9, 2008Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Daisuke Masuko, Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima
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Publication number: 20080249257Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct.Type: ApplicationFiled: March 27, 2008Publication date: October 9, 2008Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Daisuke Masuko, Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima
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Publication number: 20080161589Abstract: An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily. The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.Type: ApplicationFiled: June 2, 2006Publication date: July 3, 2008Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Katsuhiko Komuro, Tadasu Kawashima, Masahiko Ito, Daisuke Masuko