Patents by Inventor Daisuke Matsude

Daisuke Matsude has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glass cloth for printed wiring board
    Patent number: 9161441
    Abstract: The present invention provides a glass cloth suitable for producing a printed wiring board to be used in the electronics and electric fields, which has small anisotropy in dimensional change and is free from warpage and twist, a prepreg using said glass cloth, and a printed wiring board using said glass cloth. The glass cloth relevant to the present invention is characterized in that the warp yarn and the weft yarn are configured with a glass yarn of 1.8×10?6 kg/m to 14×10?6 kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 ?m to 40 ?m.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: October 13, 2015
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Masaaki Endo, Daisuke Matsude, Susumu Ohigashi
  • GLASS CLOTH FOR PRINTED WIRING BOARD
    Publication number: 20120156955
    Abstract: The present invention provides a glass cloth suitable for producing a printed wiring board to be used in the electronics and electric fields, which has small anisotropy in dimensional change and is free from warpage and twist, a prepreg using said glass cloth, and a printed wiring board using said glass cloth. The glass cloth relevant to the present invention is characterized in that the warp yarn and the weft yarn are configured with a glass yarn of 1.8×10?6 kg/m to 14×10?6 kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 ?m to 40 ?m.
    Type: Application
    Filed: August 25, 2010
    Publication date: June 21, 2012
    Inventors: Masaaki Endo, Daisuke Matsude, Susumu Ohigashi