Patents by Inventor Daisuke MATSUSHIMA

Daisuke MATSUSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180015497
    Abstract: According to one embodiment, an imprint template manufacturing apparatus includes a stage, a supply head, a moving mechanism, and a controller. The stage supports a template that includes a base having a main surface, and a convex portion provided on the main surface and having an end surface on a side opposite to the main surface. A concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The supply head supplies a liquid-repellent material in a liquid form to the template on the stage. The moving mechanism moves the stage and the supply head relative to each other in a direction along the stage. The controller controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least the side surface of the convex portion so as to avoid the concavo-convex pattern.
    Type: Application
    Filed: September 27, 2017
    Publication date: January 18, 2018
    Applicants: Shibaura Mechatronics Corporation, Toshiba Memory Corporation
    Inventors: Satoshi Nakamura, Kensuke Demura, Daisuke Matsushima, Masayuki Hatano, Hiroyuki Kashiwagi
  • Patent number: 9586391
    Abstract: A bonding apparatus includes a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher. The pusher pushes one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: March 7, 2017
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Konosuke Hayashi, Daisuke Matsushima
  • Publication number: 20170017151
    Abstract: A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer. A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.
    Type: Application
    Filed: February 19, 2015
    Publication date: January 19, 2017
    Inventors: Daisuke Matsushima, Kensuke Demura, Masafumi Suzuki, Satoshi Nakamura
  • Publication number: 20160009070
    Abstract: According to the embodiment of the present invention, a bonding apparatus comprising: a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher, the pusher pushing one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Konosuke Hayashi, Daisuke Matsushima
  • Publication number: 20120192953
    Abstract: A plasma processing apparatus includes a processing vessel, a depressurizing part, a placing part, a discharge tube, an introduction waveguide, a gas-supplying part, a transport tube, and a first temperature-detecting part. The processing vessel is able to maintain an atmosphere. The depressurizing part reduces the internal pressure of the processing vessel. The placing part places an object to be processed. The discharge tube has a region generating plasma therein and being provided at a position separated from the processing vessel. The introduction waveguide causes microwave emitted from a microwave-generating part to propagate therethrough to introduce the microwave into the region generating the plasma. The gas-supplying part supplies a process gas to the region generating the plasma. The transport tube communicates the discharge tube with the processing vessel. The first temperature-detecting part detects temperature of the discharge tube.
    Type: Application
    Filed: July 28, 2010
    Publication date: August 2, 2012
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventor: Daisuke Matsushima
  • Publication number: 20120132617
    Abstract: A plasma etching apparatus includes a processing container, a depressurization unit, a placement unit, a discharge tube, an introduction waveguide tube, a gas supply unit, a transport tube, a detection window, a coherent light detection unit, and a control unit. The control unit is configured to detect an end point of etching based on an output from the coherent light detection unit. The control unit is configured to use an output from the light receiving devices of a detection region of the coherent light detection unit to extract an output of the light receiving device of a portion of the detection region corresponding to an etching portion to detect the end point of the etching based on an intensity of the coherent light determined from the output of the light receiving device of the portion of the detection region corresponding to the etching portion.
    Type: Application
    Filed: August 5, 2010
    Publication date: May 31, 2012
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventor: Daisuke MATSUSHIMA