Abstract: When contents of UFSHCI standard are directly implemented in a UFS host, a problem may occur such that read/write operations of a UFS device stop or contents of data are destroyed. A semiconductor device has a UFS host controller that performs data transfer with a universal flash storage (UFS) device. The semiconductor device includes a Run-Stop register that sets the UFS host controller into a processing possible state, a Door bell register that instructs the UFS host controller to perform transfer, and a ready bit that indicates whether or not the UFS host controller can perform processing of transfer request. When the Run-Stop register is cleared while the data transfer is in process, the UFS host controller prevents a next data transfer from being registered until the data transfer is completed.

Abstract: When contents of UFSHCI standard are directly implemented in a UFS host, a problem may occur such that read/write operations of a UFS device stop or contents of data are destroyed. A semiconductor device has a UFS host controller that performs data transfer with a universal flash storage (UFS) device. The semiconductor device includes a Run-Stop register that sets the UFS host controller into a processing possible state, a Door bell register that instructs the UFS host controller to perform transfer, and a ready bit that indicates whether or not the UFS host controller can perform processing of transfer request. When the Run-Stop register is cleared while the data transfer is in process, the UFS host controller prevents a next data transfer from being registered until the data transfer is completed.

Abstract: The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probe 15 is caused to intervene in a communications channel composed by inductive coupling based on the first and second transmitter coils 21a, 21b; and the first and second receiver coils 23a, 23b, and an LSI is tested by a tester 11, buffers 12 and 13, and a Tx/Rx switch 14. Accordingly, it is not be necessary for that the electronic circuit testing apparatus is provided with a needle that touches pads and leads of the electronic circuit, and the service life there can be lengthened.

Abstract: An electronic circuit capable of reducing crosstalk to such a degree that the crosstalk can be substantially disregarded even where a plurality of communications channels are juxtaposed in close proximity to each other when achieving communications between substrates by inductive coupling. The transmitter coils 11 are placed on a lower chip and the receiver coils 12 are placed on an upper chip, and where it is assumed that the distance between the chips is X, and the distance between the communications channels is Y (that is, the horizontal distance between the coil centers), there exists a position, where the magnetic flux density in the receiver coils 12 resulting from the transmitter coils 11 becomes zero (0), at a predetermined Yo.

Abstract: An electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three chips. The first through the third transmitter coils 13a, 13b, 13c and the first through the third receiver coils 15a, 15b, 15c are formed by wiring on the first through the third LSI chips 11a, 11b, 11c. These three pairs of transmitter and receiver coils are disposed so that the centers of the openings thereof are coincident with each other, whereby three pairs of transmitter and receiver coils 13 and 15 form inductive coupling to enable communications.

Abstract: An electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. Although the amplification factor of the amplifier 10a is 1, the amplification factors of the amplifiers 10b through 10d are, respectively, 2, 4 and 8. Amplification is carried out at the amplification factors 1 through 15 (=1+2+4+8) as a whole by a combination thereof. The transmit power control register 21 outputs ON and OFF signals to the respective amplifiers 10a through 10d so as to bring about transmit power responsive to the distance to a substrate having a receiver coil which is a destination of transmission (that is, the distance between a transmitter coil and a receiver coil), in further detail, so as to have an amplification factor by which transmit power proportionate to the distance can be obtained, and selects a combination of the amplifiers 10b through 10d.

Abstract: The invention provides an electronic circuit capable of simplifying a transmitter circuit and yet realizing low-voltage drive and low power consumption where communications between substrates are realized by inductive coupling. As the transmission data Txdata are turned from LOW to HIGH, the transistor T1 is turned from OFF to ON, and at the same time, the transistor T2 is turned from ON to OFF, wherein the current IT is caused to flow to the transmitter coil 14, and the capacitor 15 is charged. As the capacitor 15 is sufficiently charged, the current IT stops flowing. As a result, a pulse current of a triangular waveform is flown to the transmitter coil 14. Next, as the transmission data Txdata are turned from HIGH to LOW, the current IT is inversely flown to the transmitter coil 14, and the capacitor 15 is discharged, wherein a pulse current having a triangular waveform of reversed polarity is flown to the transmitter coil 14.

Abstract: The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probe 15 is caused to intervene in a communications channel composed by inductive coupling based on the first and second transmitter coils 21a, 21b; and the first and second receiver coils 23a, 23b, and an LSI is tested by a tester 11, buffers 12 and 13, and a Tx/Rx switch 14. Accordingly, it is not be necessary for that the electronic circuit testing apparatus is provided with a needle that touches pads and leads of the electronic circuit, and the service life there can be lengthened.

Abstract: The present invention has an object to provide an electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three chips. The first through the third transmitter coils 13a, 13b, 13c and the first through the third receiver coils 15a, 15b, 15c are formed by wiring on the first through the third LSI chips 11a, 11b, 11c. These three pairs of transmitter and receiver coils are disposed so that the centers of the openings thereof are coincident with each other, whereby three pairs of transmitter and receiver coils 13 and 15 form inductive coupling to enable communications.

Abstract: The invention provides an electronic circuit capable of reducing crosstalk to such a degree that the crosstalk can be substantially disregarded even where a plurality of communications channels are juxtaposed in close proximity to each other when achieving communications between substrates by inductive coupling. The transmitter coils 11 are placed on a lower chip and the receiver coils 12 are placed on an upper chip, and where it is assumed that the distance between the chips is X, and the distance between the communications channels is Y(that is, the horizontal distance between the coil centers), there exists a position, where the magnetic flux density in the receiver coils 12 resulting from the transmitter coils 11 becomes zero (0), at a predetermined Yo.

Abstract: The invention provides an electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. In the electronic circuit according to the invention, although the amplification factor of the amplifier 10a is 1, the amplification factors of the amplifiers 10b through 10d are, respectively, 2, 4 and 8. Amplification is carried out at the amplification factors 1 through 15 (=1+2+4+8) as a whole by a combination thereof. The transmit power control register 21 outputs ON and OFF signals to the respective amplifiers 10a through 10d so as to bring about transmit power responsive to the distance to a substrate having a receiver coil which is a destination of transmission (that is, the distance between a transmitter coil and a receiver coil), in further detail, so as to have an amplification factor by which transmit power proportionate to the distance can be obtained, and selects a combination of the amplifiers 10a through 10d.

Abstract: Where communications between substrates are formed by inductive coupling, the invention provides an electronic circuit that is less influenced by magnetic fluxes from a noise source. In the electronic circuit according to the invention, in regard to the transmitter coils and the receiver coils, one coil thereof is composed of the first coil 11a and the second coil 11b. The first coil 11a and the second coil 11b are wound by the same number of times and are connected to each other in series. When a current flows in the arrow direction, if observed so as to face the paper surface of the drawing, the second coil 11b is wound in the left direction while the first coil 11a is wound in the right direction.