Patents by Inventor Daisuke Mizumaki

Daisuke Mizumaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20210090903
    Abstract: A method for manufacturing a semiconductor device includes forming a bonding layer on a back-surface of a semiconductor element, mounting the semiconductor element on a base member, and bonding the semiconductor element to the base member by pressing the semiconductor element on the base member. The bonding layer includes tin. The base member includes a plating layer that includes silver and tin. The base member is heated at a prescribed temperature. The semiconductor element is placed on the base member so that the bonding layer contacts the plating layer on the base member.
    Type: Application
    Filed: March 10, 2020
    Publication date: March 25, 2021
    Inventors: Tatsuo Fukuda, Daisuke Mizumaki