Abstract: A substrate processing device of the present disclosure is provided with: a plurality of processing modules, each of which is provided with a processing vessel for storing a substrate and performing the same type of processing and each of which performs conditioning on the interior of the processing vessel; a transport mechanism for transporting the substrates to each of the plurality of processing modules; and a control unit for determining, from among the plurality of processing modules, a processing module to which to transport the substrates, such determination made on the basis of the run time for the conditioning, the processing time per substrate in the processing modules, and a parameter corresponding to the cumulative number of substrates processed after the conditioning with respect to each of the processing modules.

Abstract: A method of processing a target substrate includes a process of serially executing multiple processes including a main process and first to M-th subprocesses (where M is a positive integer). An index value indicating one execution of the main process is accumulated for each execution of the main process. The main process is executed multiple times in the process of serially executing multiple processes. An i-th subprocess (where i is a positive integer that satisfies 1?i?M) is executed once or multiple times in the process of serially executing multiple processes, and is executed subsequent to one or multiple consecutive executions of the main process. The i-th application and execution conditions are changeable.

Abstract: A method of processing a target substrate includes a process of serially executing multiple processes including a main process and first to M-th subprocesses (where M is a positive integer). An index value indicating one execution of the main process is accumulated for each execution of the main process. The main process is executed multiple times in the process of serially executing multiple processes. An i-th subprocess (where i is a positive integer that satisfies 1?i?M) is executed once or multiple times in the process of serially executing multiple processes, and is executed subsequent to one or multiple consecutive executions of the main process. The i-th application and execution conditions are changeable.

Abstract: A substrate processing apparatus is provided with a process module including a processing container, a rotary table installed within the processing container, the rotary table having a plurality of placing regions to receive substrates, and a process gas supply unit supplying a process gas to the placing regions, a load port in which a transfer container is placed, a dummy substrate receiving unit, a transfer chamber including a transfer mechanism delivering the product substrates or the dummy substrates between the transfer container or the dummy substrate receiving unit and the rotary table, a setting unit setting a placing region to which one of the product substrates is to be transferred, and a control unit outputting a control signal such that the dummy substrates are carried into the remaining placing regions.

Abstract: A substrate processing system for sequentially processing substrates includes processing chambers, a transfer unit, and a control unit controlling the processing chambers and the transfer unit. The control unit includes a transfer control unit controlling an operation of the transfer unit, a transfer order setting unit setting a transfer order of substrates to the processing chambers, an accumulation unit for accumulating a film thickness of a formed thin film or the number of processed substrates after completion of previous cleaning or previous pre-coating in the processing chambers, a processing chamber priority determination unit for determining priority of processing the substrates in the processing chambers based on predetermined rules, and an execution instruction unit for executing conditioning in the processing chambers.

Abstract: Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.

Abstract: A substrate processing system includes a plurality of processing chambers configured to perform a predetermined processing with respect to substrates, a transfer device configured to transfer the substrates to the processing chambers in a predetermined order, and a delivery unit configured to deliver the substrates between the delivery unit and the transfer device. The substrate processing system configured to sequentially process the substrates by repeating an operation in a predetermined transfer order. The substrate processing system includes a transfer order setting unit and a transfer control unit configured to switch the first transfer order to the second transfer order.

Abstract: A substrate processing system includes a processing unit having one or more processing chambers each of which includes a mounting table configured to mount thereon a substrate and is configured to perform predetermined processing on the substrate, a loading/unloading unit configured to load/unload a substrate container accommodating a plurality of substrates, one or more transfer units configured to transfer a substrate between the loading/unloading unit and the processing chambers, and a control unit configured to control the processing unit, the loading/unloading unit and the transfer units. The control unit controls a simulated operation, which does not include the predetermined processing in the processing chamber, to be performed on a plurality of dummy substrates in parallel. The simulated operation is a simulated transfer operation of the dummy substrates and includes a operation without transferring the dummy substrates from the loading/unloading unit into the processing chamber.

Abstract: Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.

Abstract: A substrate processing system for sequentially processing substrates includes processing chambers, a transfer unit, and a control unit controlling the processing chambers and the transfer unit. The control unit includes a transfer control unit controlling an operation of the transfer unit, a transfer order setting unit setting a transfer order of substrates to the processing chambers, an accumulation unit for accumulating a film thickness of a formed thin film or the number of processed substrates after completion of previous cleaning or previous pre-coating in the processing chambers, a processing chamber priority determination unit for determining priority of processing the substrates in the processing chambers based on predetermined rules, and an execution instruction unit for executing conditioning in the processing chambers.

Abstract: A substrate processing apparatus is provided with a process module including a processing container, a rotary table installed within the processing container, the rotary table having a plurality of placing regions to receive substrates, and a process gas supply unit supplying a process gas to the placing regions, a load port in which a transfer container is placed, a dummy substrate receiving unit, a transfer chamber including a transfer mechanism delivering the product substrates or the dummy substrates between the transfer container or the dummy substrate receiving unit and the rotary table, a setting unit setting a placing region to which one of the product substrates is to be transferred, and a control unit outputting a control signal such that the dummy substrates are carried into the remaining placing regions.

Abstract: A substrate processing system includes a plurality of processing chambers configured to perform a predetermined processing with respect to substrates, a transfer device configured to transfer the substrates to the processing chambers in a predetermined order, and a delivery unit configured to deliver the substrates between the delivery unit and the transfer device. The substrate processing system configured to sequentially process the substrates by repeating an operation in a predetermined transfer order. The substrate processing system includes a transfer order setting unit and a transfer control unit configured to switch the first transfer order to the second transfer order.

Abstract: A control unit of a substrate processing apparatus controls a process to be performed in a chamber. The process includes a step of performing a preceding first process; a step of performing a subsequent second process after performing the first process; a step of determining whether to perform an inter-process conditioning, for arranging the environment in the chamber, during a period between the end of the first process and the start of the second process, based on information on the first process and information on the second process; and a step of performing the inter-process conditioning prior to the second process when it is determined in the determining step that the inter-process conditioning is to be performed.

Abstract: A control device is provided that flexibly controls a substrate processing apparatus for each product process. Four process recipes PM 1 to PM 4 are stored in a first storage unit 255a. Corresponding to each of the process recipes, a high temperature, a medium temperature, and a low temperature pre-recipe are stored in a second storage unit 255b. A process recipe determination unit 260 determines, in response to a recipe specified by the operator, a process recipe corresponding to the specified recipe from the first storage unit 255a. A stage temperature acquisition unit 265 acquires, from the determined process recipe, a stage temperature. A pre-recipe selection unit 270 selects, from the three types of pre-recipes stored in the second storage unit 255b, one pre-recipe corresponding to the stage temperature. Before the wafer W is deposition-processed, therefore, the PM may be well-conditioned according to the selected pre-recipe.

Abstract: The control valve comprises a valve rod having a valve body part; a valve main body provided with a valve chamber having a valve port to/from which the valve body part contacts/separates, a discharge pressure refrigerant inlet for introducing the refrigerant from a compressor, and a refrigerant outlet communicating with a crank chamber of the compressor; an electromagnetic actuator having a plunger for moving the valve rod in the valve closing direction; a pressure sensing chamber in which suction pressure is introduced from the compressor; and a pressure sensitive response member for pressing the valve rod in the valve opening direction corresponding to the pressure in the pressure sensing chamber, wherein the valve rod is fitted to the plunger having a predetermined diametrical directional clearance so as not to be influenced from the lateral deviation and inclination of the plunger.

Abstract: A control unit of a substrate processing apparatus controls a process to be performed in a chamber. The process includes a step of performing a preceding first process; a step of performing a subsequent second process after performing the first process; a step of determining whether to perform an inter-process conditioning, for arranging the environment in the chamber, during a period between the end of the first process and the start of the second process, based on information on the first process and information on the second process; and a step of performing the inter-process conditioning prior to the second process when it is determined in the determining step that the inter-process conditioning is to be performed.

Abstract: A control valve for a variable capacity compressor, which makes it possible to increase the full open flow rate so as to make it applicable to even a compressor of large capacity without inviting any substantial increase in size and weight, and to minimize the quantity of leakage of cooling medium from the valve chamber into the suction pressure cooling medium-introducing chamber to thereby make it possible to enhance the accuracy of control and to suppress the occurrence of operational failure including the clogging due to foreign substances, the locking of valve rod, etc.

Abstract: A control device is provided that flexibly controls a substrate processing apparatus for each product process. Four process recipes PM 1 to PM 4 are stored in a first storage unit 255a. Corresponding to each of the process recipes, a high temperature, a medium temperature, and a low temperature pre-recipe are stored in a second storage unit 255b. A process recipe determination unit 260 determines, in response to a recipe specified by the operator, a process recipe corresponding to the specified recipe from the first storage unit 255a. A stage temperature acquisition unit 265 acquires, from the determined process recipe, a stage temperature. A pre-recipe selection unit 270 selects, from the three types of pre-recipes stored in the second storage unit 255b, one pre-recipe corresponding to the stage temperature. Before the wafer W is deposition-processed, therefore, the PM may be well-conditioned according to the selected pre-recipe.

Abstract: The control valve comprises a valve rod having a valve body part; a valve main body provided with a valve chamber having a valve port to/from which the valve body part contacts/separates, a discharge pressure refrigerant inlet for introducing the refrigerant from a compressor, and a refrigerant outlet communicating with a crank chamber of the compressor; an electromagnetic actuator having a plunger for moving the valve rod in the valve closing direction; a pressure sensing chamber in which suction pressure is introduced from the compressor; and a pressure sensitive response member for pressing the valve rod in the valve opening direction corresponding to the pressure in the pressure sensing chamber, wherein the valve rod is fitted to the plunger having a predetermined diametrical directional clearance so as not to be influenced from the lateral deviation and inclination of the plunger.

Abstract: A substrate processing apparatus, which includes a plurality of process chambers for processing a substrate and a transfer part for carrying in and carrying out the substrate to and from the plurality of process chambers, includes a transfer history recording part, a process history recording part, and an alarm history recording part. The transfer history recording part relates history information concerning a transfer of the substrate by the transfer part to each substrate, and records the history information as first history information. The process history recording part relates history information concerning a process state of the substrate in each of the plurality of process chambers to each substrate subject to be processed, and records the history information as second history information.