Abstract: A woven fabric for airbags has a high quality that can suppress generation of creases during refining, heat setting, and coating steps to be performed after weaving, has an excellent uniform applicability, and can suppress misalignment during cutting. A woven fabric for airbags consists of synthetic fibers, wherein a ratio of a selvedge flare amount R represented by equation (1) is 5.0% or less S=?k=1n(Wk×Hk)/2 R=S/(200×F)×100??(1) wherein, S=selvedge flare amount, in cm2, Wk=selvedge flare width, in cm, Hk=selvedge flare depth, in cm, n is the number of selvedge flares, R is a ratio of a selvedge flare amount, in %, and F is a base fabric width, in cm.

Abstract: Provided are an underfill material capable of realizing low-pressure mounting and voidless mounting, and a method for manufacturing a semiconductor device using the same. The underfill material includes a main composition containing an acrylic polymer, an acrylic monomer, and a maleimide compound, and the acrylic polymer is contained in a range of 10 parts by mass or more and 60 parts by mass or less in 100 parts by mass of the main composition, and the maleimide compound is contained in a range of 20 parts by mass or more and 70 parts by mass or less in 100 parts by mass of the main composition. Low-pressure mounting and the voidless mounting can be realized.

Abstract: Provided are an underfill material capable of realizing low-pressure mounting and voidless mounting, and a method for manufacturing a semiconductor device using the same. The underfill material includes a main composition containing an acrylic polymer, an acrylic monomer, and a maleimide compound, and the acrylic polymer is contained in a range of 10 parts by mass or more and 60 parts by mass or less in 100 parts by mass of the main composition, and the maleimide compound is contained in a range of 20 parts by mass or more and 70 parts by mass or less in 100 parts by mass of the main composition. Low-pressure mounting and the voidless mounting can be realized.

Abstract: A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.

Abstract: A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.

Abstract: A novel compound of the formula (I): wherein R1 is alkoxycarbonyl or the like, R2 is alkyl or the like; R3 is hydrogen or the like; R4 is alkylene or the like; R5 is optionally substituted heterocyclic group; R6, R7, R8 and R9 are independently hydrogen; alkyl, alkoxy, or the like; R10 is optionally substituted aromatic ring, or the like; or a pharmaceutically acceptable salt thereof, which has an inhibitory activity against cholesteryl ester transfer protein (CETP).

Abstract: A novel compound of the formula (I): wherein R1 is alkoxycarbonyl or the like, R2 is alkyl or the like; R3 is hydrogen or the like; R4 is alkylene or the like; R5 is optionally substituted heterocyclic group; R6, R7, R8 and R9 are independently hydrogen; alkyl, alkoxy, or the like; R10 is optionally substituted aromatic ring, or the like; or a pharmaceutically acceptable salt thereof, which has an inhibitory activity against cholesteryl ester transfer protein (CETP).

Abstract: A novel compound of the formula (I): wherein R1 is alkoxycarbonyl or the like, R2 is alkyl or the like; R3 is hydrogen or the like; R4 is alkylene or the like; R5 is optionally substituted heterocyclic group; R6, R7, R8 and R9 are independently hydrogen; alkyl, alkoxy, or the like; R10 is optionally substituted aromatic ring, or the like; or a pharmaceutically acceptable salt thereof, which has an inhibitory activity against cholesteryl ester transfer protein (CETP).

Abstract: A novel compound of the formula (I): wherein R1 is alkoxycarbonyl or the like, R2 is alkyl or the like; R3 is hydrogen or the like; R4 is alkylene or the like; R5 is optionally substituted heterocyclic group; R6, R7, R8 and R9 are independently hydrogen; alkyl, alkoxy, or the like; R10 is optionally substituted aromatic ring, or the like; or a pharmaceutically acceptable salt thereof, which has an inhibitory activity against cholesteryl ester transfer protein (CETP).