Patents by Inventor Daisuke Nakagawa

Daisuke Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100008391
    Abstract: A nitride based semiconductor device includes: an n-type cladding layer; an n-type GaN based guide layer placed on the n-type cladding layer; an active layer placed on the n-type GaN based guide layer; a p-type GaN based guide layer placed on the active layer; an electron block layer placed on the p-type GaN based guide layer; a stress relaxation layer placed on the electron block layer; and a p-type cladding layer placed on the stress relaxation layer, and the nitride based semiconductor device alleviates the stress occurred under the influence of the electron block layer, does not affect light distribution by the electron block layer, reduces threshold current, can suppress the degradation of reliability, can suppress degradation of the emitting end surface of the laser beam, can improve the far field pattern, and is long lasting, and fabrication method of the device is also provided.
    Type: Application
    Filed: March 4, 2009
    Publication date: January 14, 2010
    Applicant: ROHM CO., LTD.
    Inventors: Daisuke Nakagawa, Yoshinori Tanaka, Masahiro Murayama, Takao Fujimori, Shinichi Kohda
  • Publication number: 20090308517
    Abstract: The invention provides a laminated body (1) having a good workability during the production and an excellent peeling resistance, which is formed by joining a resin film layer (D) (2) comprising at least a layer composed of a resin composition (C) in which a soft resin (B) having a Young's modulus at 23° C. lower than that of a thermoplastic resin (A) is dispersed in a matrix made from the thermoplastic resin (A) and a rubbery elastomer layer (E) (3) through an adhesive layer (F) (4), wherein an adhesive composition (I) formed by compounding not less than 0.1 part by mass of at least one of a maleimide derivative (H) having not less than two reaction sites in a molecule thereof and poly-p-dinitrosobenzene based on 100 parts by mass of a rubber component (G) is applied to the adhesive layer (F) (4).
    Type: Application
    Filed: July 23, 2007
    Publication date: December 17, 2009
    Applicants: BRIDGESTONE CORPORTAION, KURARAY CO., LTD.
    Inventors: Daisuke Nohara, Daisuke Katou, Yuwa Takahashi, Daisuke Nakagawa, Kota Isoyama, Tomoyuki Watanabe, Kaoru Ikeda
  • Publication number: 20090242094
    Abstract: A pneumatic tire in which the average peel strength between the surface of (A) a layer of a single-layered or multi-layered film of a thermoplastic resin and (B) a rubbery elastic layer, which are used as the inner liner layer, is 6 kN/m or greater at ?20° C., i.e., a pneumatic tire exhibiting excellent average peel strength between the surface of layer (A) and layer (B), which are used in combination as the inner liner layer exhibiting excellent gas barrier property and flexibility, at a low temperature and at the room temperature, is provided.
    Type: Application
    Filed: April 27, 2007
    Publication date: October 1, 2009
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Daisuke Kato, Daisuke Nohara, Yuwa Takahashi, Daisuke Nakagawa
  • Publication number: 20090141765
    Abstract: A nitride semiconductor laser device has a group III nitride semiconductor multilayer structure. The group III nitride semiconductor multilayer structure includes an n-type semiconductor layer, a p-type semiconductor layer and a light emitting layer held between the n-type semiconductor layer and the p-type semiconductor layer, and the p-type semiconductor layer is formed by successively stacking a p-side guide layer, a p-type electron blocking layer in contact with the p-side guide layer and a p-type cladding layer in contact with the p-type electron blocking layer from the side closer to the light emitting layer. The p-side guide layer is formed by stacking a layer made of a group III nitride semiconductor containing Al and a layer made of a group III nitride semiconductor containing no Al.
    Type: Application
    Filed: November 12, 2008
    Publication date: June 4, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Shinichi KOHDA, Daisuke NAKAGAWA
  • Publication number: 20090114328
    Abstract: An innerliner for tire is formed by laminating a composition containing an elastomer component onto a resin layer and then irradiating energy beams required for generating partial crosslinking between the resin layer and the elastomer component.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 7, 2009
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Yuuwa Takahashi, Daisuke Nohara, Daisuke Nakagawa, Kentaro Fujino
  • Patent number: 7488970
    Abstract: The semiconductor device according to the present invention includes a semiconductor layer containing plural band gap change thin films in which a band gap is continuously monotonously changed in a laminating direction. Therefore, the present invention provides a semiconductor device having high reliability and low electric resistance.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 10, 2009
    Assignee: Rohm Co., Ltd.
    Inventors: Hiroaki Ohta, Toshio Nishida, Daisuke Nakagawa
  • Publication number: 20070108519
    Abstract: A semiconductor lamination portion (6) is formed by laminating at least an n-type layer (3) and a p-type layer (5) made of gallium nitride based compound semiconductor so as to form a light emitting portion, and a light transmitting conductive layer (7) is formed on a surface of the semiconductor lamination portion. An upper electrode (8) is formed so as to adhere to an exposed surface of the semiconductor lamination portion exposed by etching a part of the light transmitting conductive layer, and to the light transmitting conductive layer. An electric current blocking means (10) is formed on the exposed surface of the semiconductor lamination portion which is exposed through an opening (7a) of the light transmitting conductive layer, thereby significantly preventing electric current from flowing into a part under the upper electrode while ensuring good adhesion between the upper electrode and the surface of the semiconductor lamination portion.
    Type: Application
    Filed: December 16, 2004
    Publication date: May 17, 2007
    Inventors: Norikazu Ito, Masayuki Sonobe, Daisuke Nakagawa
  • Publication number: 20070026550
    Abstract: A method of manufacturing a semiconductor light emitting apparatus according to the invention includes: the mask layer forming step of forming two mask layers in descending order of etching rates from a side near a p-type semiconductor layer; the mask layer etching step; the semiconductor layer etching step; the side etching step of selectively etching a side surface of a mask layer having a high etching rate to form a groove portion in the p-type semiconductor layer; the insulating film forming step of forming an insulating film so as to cover the p-type semiconductor layer; the mask layer removing step; and the electrode layer forming step. A semiconductor light emitting apparatus according to the invention includes: a substrate; an n-type semiconductor layer; an active layer; a p-type semiconductor layer on which a mesa portion projecting above the active layer is formed; an insulating film which covers the mesa portion to expose an upper surface of the mesa portion; and an electrode layer.
    Type: Application
    Filed: July 6, 2006
    Publication date: February 1, 2007
    Inventors: Masahiro Murayama, Daisuke Nakagawa, Shinichi Kohda, Toshio Nishida
  • Publication number: 20060273329
    Abstract: The semiconductor device according to the present invention includes a semiconductor layer containing plural band gap change thin films in which a band gap is continuously monotonously changed in a laminating direction. Therefore, the present invention provides a semiconductor device having high reliability and low electric resistance.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 7, 2006
    Inventors: Hiroaki Ohta, Toshio Nishida, Daisuke Nakagawa
  • Patent number: 7114588
    Abstract: A vehicle body frame structure for a two-wheeler provides a sufficient distance between exhaust pipes and a front wheel, to facilitate the arrangement of a heat-discharging member such as a radiator or an oil cooler, or other auxiliary components, to increase heat-discharging property by increasing the capacity of the heat-discharging member, and improving flexibility in design such as the shape or the layout of the vehicle body frame and the exhaust pipes. In a two-wheel vehicle having an engine mounted to a vehicle body frame, the engine having exhaust pipes extending forwardly and downwardly and a pair of left and right down tubes extending substantially downwardly from a head pipe provided at the front end of the vehicle body frame, the vehicle body frame includes a first cross member for connecting the left and right down tubes, and the first cross member is formed with arcuate recesses for allowing part of the exhaust pipes to pass therethrough.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: October 3, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takashi Kudo, Daisuke Nakagawa
  • Publication number: 20050040406
    Abstract: In a gallium nitride compound semiconductor, making small the thickness of a metal electrode layer in order to enhance the efficiency of taking light out relatively increases the resistance value of the metal electrode layer as measured in a direction that is parallel with this layer compared to that of it in a direction that is vertical with respect thereto. As a result of this, when a voltage has been applied across relevant electrodes, electric current ceases to be sufficiently supplied to the entire metal electrode layer. The semiconductor light emitting device of the invention is equipped, between the metal electrode layer and an active layer, with a superlattice layer for enhancing the efficiency of taking out the light that has been emitted in the active layer.
    Type: Application
    Filed: July 12, 2004
    Publication date: February 24, 2005
    Inventor: Daisuke Nakagawa
  • Publication number: 20050029032
    Abstract: A vehicle body frame structure for a two-wheeler provides a sufficient distance between exhaust pipes and a front wheel, to facilitate the arrangement of a heat-discharging member such as a radiator or an oil cooler, or other auxiliary components, to increase heat-discharging property by increasing the capacity of the heat-discharging member, and improving flexibility in design such as the shape or the layout of the vehicle body frame and the exhaust pipes. In a two-wheel vehicle having an engine mounted to a vehicle body frame, the engine having exhaust pipes extending forwardly and downwardly and a pair of left and right down tubes extending substantially downwardly from a head pipe provided at the front end of the vehicle body frame, the vehicle body frame includes a first cross member for connecting the left and right down tubes, and the first cross member is formed with arcuate recesses for allowing part of the exhaust pipes to pass therethrough.
    Type: Application
    Filed: June 24, 2004
    Publication date: February 10, 2005
    Inventors: Takashi Kudo, Daisuke Nakagawa
  • Patent number: 4141911
    Abstract: Polynuclear dicarboxylatotetrachromium (III) complexes are produced by reacting a dicarboxylic acid with a monobasic chromic (III) salt in a proportion of 4 moles of monobasic chromic (III) salt to 1 mole of dicarboxylic acid. Surface treating agents comprising these complexes provide a surface with desirable properties such as durable water repellency, adhesiveness, antistatic properties, etc.
    Type: Grant
    Filed: April 26, 1977
    Date of Patent: February 27, 1979
    Assignee: Tokyo Shibaura Electric Co., Ltd.
    Inventors: Shoichi Matsumoto, Daisuke Nakagawa, Nagao Kaneko