Patents by Inventor Daisuke Nakajima

Daisuke Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260140372
    Abstract: An information display device (19) of the present invention includes a windshield (11) and a light source (13) irradiating the windshield (11) with light and displays at least one of information for outside a vehicle or information for inside the vehicle on a windshield (11) using light from the light source (13). Additionally, an information display device (69) of the present invention includes a light source (63) that irradiates a vehicle interior surface of a roof portion (61) of a vehicle with light, the information display device (69) displaying information on the vehicle interior surface of the roof portion (61) using light from the light source (63).
    Type: Application
    Filed: October 17, 2023
    Publication date: May 21, 2026
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuusuke OOTA, Masashi YANAI, Kazuhiro TOMURA, Daisuke NAKAJIMA, Yasuyuki IZU
  • Patent number: 12526929
    Abstract: Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: January 13, 2026
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Daisuke Nakajima, Shota Kawaguchi
  • Publication number: 20250364644
    Abstract: An exterior material having an opening portion for a power storage device includes a base layer, a metal foil layer, a heat-resistant gas barrier layer, and a sealant layer laminated in this order. An opening portion is formed in the sealant layer to expose the gas barrier layer. The exterior material is configured such that ?T=(|T0?T1|/T0)×100?10%, where T0 is the thickness of the gas barrier layer in an opening-portion-side standard region defined as a region extending from 1 mm to 1.5 mm toward the opening portion from the edge portion of the opening portion, and T1 is the thickness of the same layer in an opening-portion-side evaluation region defined as a region extending from 0 mm to 0.5 mm toward the opening portion from the edge portion of the opening portion.
    Type: Application
    Filed: August 8, 2025
    Publication date: November 27, 2025
    Applicant: DNP HIGH-PERFORMANCE MATERIALS HIKONE CO., LTD.
    Inventors: Daisuke NAKAJIMA, Terutoshi KUMAKI
  • Publication number: 20250364640
    Abstract: A power storage device case includes a case body having a top wall, a sidewall at an outer peripheral edge portion of the top wall, and a flange on the outer periphery of the sidewall, and a housing portion enclosed by the top wall and the sidewall. The case body is formed of a power storage device exterior material including a resin base layer, a metal foil layer laminated on an inner surface side of the base layer, a resin heat-resistant barrier layer laminated on an inner surface side of the metal foil layer, and a resin sealant layer and laminated on an inner surface side of the heat-resistant gas barrier layer. An opening portion is formed in the sealant layer to expose the heat-resistant gas barrier layer inside the housing portion, with the outer peripheral edge portion of the opening portion set on the sidewall.
    Type: Application
    Filed: August 8, 2025
    Publication date: November 27, 2025
    Applicant: DNP HIGH-PERFORMANCE MATERIALS HIKONE CO., LTD.
    Inventors: Daisuke NAKAJIMA, Terutoshi KUMAKI
  • Publication number: 20250364641
    Abstract: A power storage device case includes a case body having a top wall, a sidewall at an outer peripheral edge portion of the top wall, and a flange on the outer periphery of the sidewall, and a housing portion enclosed by the top wall and the sidewall. The case body is formed of a power storage device exterior material including a resin base layer, a metal foil layer laminated on an inner surface side of the base layer, a resin heat-resistant barrier layer laminated on an inner surface side of the metal foil layer, and a resin sealant layer and laminated on an inner surface side of the heat-resistant gas barrier layer. An opening portion is formed in the sealant layer to expose the heat-resistant gas barrier layer inside the housing portion, with the outer peripheral edge portion of the opening portion set on the top wall.
    Type: Application
    Filed: August 8, 2025
    Publication date: November 27, 2025
    Applicant: DNP HIGH-PERFORMANCE MATERIALS HIKONE CO., LTD.
    Inventors: Daisuke NAKAJIMA, Terutoshi KUMAKI
  • Publication number: 20250364642
    Abstract: A power storage device case having excellent insulating and heat-dissipating properties is provided. The power storage device case includes a case body having a recessed housing portion and a flange provided around the periphery of the housing portion. The case body is made of a power storage device exterior material. The exterior material includes a resin base layer, a metal foil layer laminated on the inner surface side of the base layer, a gas barrier layer laminated on the inner surface side of the metal foil layer, and a sealant layer laminated on the inner surface side of the gas barrier layer. The gas barrier layer and the sealant layer are made of resins that are thermally fusible to each other. An opening portion is provided in the sealant layer to expose the gas barrier layer inside the housing portion.
    Type: Application
    Filed: August 8, 2025
    Publication date: November 27, 2025
    Applicant: DNP HIGH-PERFORMANCE MATERIALS HIKONE CO., LTD.
    Inventors: Daisuke NAKAJIMA, Terutoshi KUMAKI
  • Patent number: 12343977
    Abstract: An interlayer film structure is configured to be sandwiched between two transparent panels. The interlayer film structure includes a first light-modulating film capable of switching between light transmission and light scattering, and a second light-modulating film capable of adjusting a visible light transmittance. The first light-modulating film and the second light-modulating film are arranged in a thickness direction.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: July 1, 2025
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuyuki Izu, Daisuke Nakajima, Masashi Yanai
  • Patent number: 12344953
    Abstract: Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 ?m or larger and 2.0 ?m or smaller on at least one surface, has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mm2 or more and less than 65 kgf/mm2 in an unannealed original state, and has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mm2 or more and less than 25 kgf/mm2 after annealing at 180° C. for 1 hour.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: July 1, 2025
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Daisuke Nakajima, Yasuji Hara, Mitsuyoshi Matsuda, Mitsuhiro Wada
  • Patent number: 12333184
    Abstract: There is provided a recording apparatus that records data to a memory card, comprising: a control unit configured to repeatedly transmit a data recording instruction that includes information designating recording target data and a recording destination to the memory card which manages a memory for data recording in the memory card as a plurality of recording areas and which can execute data recording with a guaranteed minimum recording speed in units of recording areas, wherein when transmitting a first data recording instruction that designates a start portion of a first recording area as a recording destination, the control unit requests the memory card to execute data recording with the guaranteed minimum recording speed with respect to the first recording area by including a speed guarantee request in the first data recording instruction.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: June 17, 2025
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yasuhiro Shiraishi, Akio Fujii, Hiroshi Noda, Ryo Akamatsu, Tsutomu Ando, Hitoshi Kimura, Daisuke Nakajima, Toshifumi Nishiura, Naoki Yamagata, Yoshihisa Ishikawa
  • Patent number: 12311636
    Abstract: There is provided an interlayer film for laminated glass which is high in heat shielding properties. The interlayer film for laminated glass according to the present invention includes an infrared ray reflection layer which reflects infrared rays, a first resin layer which is arranged on a first surface side of the infrared ray reflection layer and contains a thermoplastic resin and a second resin layer which is arranged on a second surface side of the infrared ray reflection layer and contains a thermoplastic resin, and the infrared ray transmittance in the wavelength of 780 to 2100 nm of the first resin layer is higher by 10% or more than the infrared ray transmittance in the wavelength of 780 to 2100 nm of the second resin layer.
    Type: Grant
    Filed: January 3, 2024
    Date of Patent: May 27, 2025
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kouhei Yamaguchi, Masaki Yamamoto, Daisuke Nakajima, Izumi Matsumoto
  • Publication number: 20250104242
    Abstract: A medical support device includes a communication device and a processor. The communication device transmits a first medical image to a processing apparatus and receives a processing result obtained by executing processing on the first medical image by the processing apparatus. The processor performs a first control of outputting time information related to a time taken from transmission of the first medical image to the processing apparatus by the communication device to reception of the processing result, and/or a second control of making an output aspect of the processing result different depending on the time.
    Type: Application
    Filed: September 10, 2024
    Publication date: March 27, 2025
    Inventor: Daisuke NAKAJIMA
  • Patent number: 12262469
    Abstract: Provided is a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin is used. This copper-clad laminate includes a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil; and a sheet-shaped fluororesin on the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by GD-OES, the emission intensity ratio IZn/ICu of the emission intensity of Zn to that of Cu is 3.0×10?3 or less, and the emission intensity ratio IZn/IM of the emission intensity of Zn to that of the transition element M is 0.30 to 0.50.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: March 25, 2025
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Daisuke Nakajima, Shota Kawaguchi
  • Patent number: 12168838
    Abstract: Provided is an electrodeposited copper foil having high smoothness and exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has an Rz of 0.1 to 2.0 ?m on at least one surface. In cross-sectional analysis by EBSD, a proportion of an area occupied by copper crystal grains satisfying the following conditions relative to an area of an observation field occupied by copper crystal grains is 63% or more. The conditions are as follows: i) (101) orientation; ii) an aspect ratio of 0.500 or less; iii) |sin ?| of 0.001 to 0.707, where ? (°) is an angle between a normal line of an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 ?m or smaller.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: December 17, 2024
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Daisuke Nakajima, Mitsuyoshi Matsuda, Yasuji Hara, Mitsuhiro Wada
  • Publication number: 20240336039
    Abstract: A composite interlayer film (10) for a laminated panel is a composite interlayer film for a laminated panel for use in an application in which the composite interlayer film is sandwiched between a pair of transparent panels and integrated therewith to manufacture the laminated panel, and includes a thermoplastic resin sheet (11) and a sheet-shaped object (12) that is embedded in the thermoplastic resin sheet (11) and is electrically controllable.
    Type: Application
    Filed: December 7, 2022
    Publication date: October 10, 2024
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuyuki IZU, Daisuke NAKAJIMA, Yuusuke OOTA, Masashi YANAI
  • Publication number: 20240291080
    Abstract: A packaging material for a power storage device includes a metal foil layer, a resin substrate layer, an adhesive layer, and a heat-fusible layer. The heat-fusible layer includes a metal foil side layer portion and a seal layer portion arranged on an innermost surface. When particles with an average particle size of 0.05 ?m or more and less than 5 ?m are defined as “micro particles,” and particles with an average particle size of 5 ?m or more and 20 ?m or less are defined as “coarse particles,” the seal layer portion is configured by a layer containing the micro particles and the coarse particles. The metal foil side layer portion is configured by a layer that contains the micro particles and does not contain particles with an actual particle size of 5 ?m or more.
    Type: Application
    Filed: May 8, 2024
    Publication date: August 29, 2024
    Applicant: Resonac Packaging Corporation
    Inventors: Naoya KODA, Kenji YOSHINO, Daisuke NAKAJIMA
  • Publication number: 20240186623
    Abstract: A packaging material for all-solid-state batteries for encapsulating a solid-state battery body, includes a substrate layer, a metal foil layer laminated on an inner surface side of the substrate layer, a sealant layer laminated on an inner surface side of the metal foil layer, and a heat-resistant gas barrier layer made of resin, the heat-resistant gas barrier layer being provided between the metal foil layer and the sealant layer. The sealant layer is provided with an opening portion formed in a portion corresponding to the solid-state battery body to be encapsulated. The heat-resistant gas barrier layer is exposed on an inner side in the opening portion.
    Type: Application
    Filed: February 15, 2024
    Publication date: June 6, 2024
    Applicant: Resonac Packaging Corporation
    Inventors: Terutoshi KUMAKI, Daisuke NAKAJIMA
  • Publication number: 20240140074
    Abstract: There is provided an interlayer film for laminated glass which is high in heat shielding properties. The interlayer film for laminated glass according to the present invention includes an infrared ray reflection layer which reflects infrared rays, a first resin layer which is arranged on a first surface side of the infrared ray reflection layer and contains a thermoplastic resin and a second resin layer which is arranged on a second surface side of the infrared ray reflection layer and contains a thermoplastic resin, and the infrared ray transmittance in the wavelength of 780 to 2100 nm of the first resin layer is higher by 10% or more than the infrared ray transmittance in the wavelength of 780 to 2100 nm of the second resin layer.
    Type: Application
    Filed: January 3, 2024
    Publication date: May 2, 2024
    Inventors: Kouhei Yamaguchi, Masaki Yamamoto, Daisuke Nakajima, Izumi Matsumoto
  • Publication number: 20240047794
    Abstract: Provided is a packaging material for a power storage device excellent in workability and piercing resistance. The present invention relates to a packaging material for a power storage device, including a base material layer 51, a barrier layer 52 laminated on an inner side of the base material layer 51, and a sealant layer 53 laminated an inner side of the barrier layer 52. The base material layer 51 is formed of a polyamide film and is 2.0% to 5.0% both in hot water shrinkage in a transverse direction (TD) and a machine direction (MD), 1.5% or less in a difference between the hot water shrinkage in the TD and the MD, 1.5 GPa to 3 GPa in elastic modulus in both the TD and the MD, and 320 MPa or more in at least one of breaking strengths in the TD and the MD.
    Type: Application
    Filed: December 13, 2021
    Publication date: February 8, 2024
    Applicant: Resonac Packaging Corporation
    Inventors: Daisuke NAKAJIMA, Yuuji MINAMIBORI
  • Publication number: 20240017523
    Abstract: An interlayer film structure (11) is used with being sandwiched between two transparent panels (12) and (13), and comprises a first light-modulating film (21) capable of switching between light transmission and light scattering, and a second light-modulating film (22) capable of adjusting a visible light transmittance, and the first and second light-modulating films (21) and (22) are arranged in a thickness direction.
    Type: Application
    Filed: November 5, 2021
    Publication date: January 18, 2024
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuyuki IZU, Daisuke NAKAJIMA, Masashi YANAI
  • Patent number: 11833784
    Abstract: A thermoplastic film 10 is a thermoplastic film comprising a light-emitting layer 11, wherein the light-emitting layer 11 comprises a thermoplastic resin and a light-emitting material that emits light by being irradiated with excitation light, and a change in yellowness of laminated glass obtained by bonding two sheets of clear glass in accordance with JIS R 3211 (1998) having a thickness of 2.5 mm with the thermoplastic film interposed therebetween after conducting a light resistance test for 2000 hours based on JIS R3205 2005 is 4 or less. The present invention provides a thermoplastic film comprising a light-emitting material, in which the emission intensity is unlikely to lower even when the thermoplastic film is exposed to ultraviolet rays for a long period of time.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 5, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuusuke Oota, Kinryou Chou, Daisuke Nakajima, Takanori Hamada