Patents by Inventor Daisuke Ninomiya
Daisuke Ninomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11602819Abstract: A polishing method using a polishing pad including a specific adsorption layer. The polishing pad has an adsorption layer including a silicone including linear polyorganosiloxane having vinyl groups only at both ends, and the like. The polishing pad is fixed to a surface plate, and a product to be polished is pressed against the polishing pad, and simultaneously slid to polish the product to be polished. In this case, the surface roughness (Ra) of the surface plate is set to 0.01 to 0.7 ?m, and the adsorption layer of the polishing pad is then adsorbed and fixed to the surface plate to perform polishing work. By adjusting the surface roughness of the surface plate as described above, a surface of the product to be polished can be inhibited from being unpredictably scratched or roughened. The method for adjusting the surface roughness of the surface plate is preferably a method in which a film having a surface roughness as described above is bonded to a surface of the surface plate.Type: GrantFiled: June 1, 2018Date of Patent: March 14, 2023Assignee: MARUISHI SANGYO CO., LTD.Inventors: Toshiyasu Yajima, Daisuke Ninomiya
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Publication number: 20220063052Abstract: The present invention relates to improvement of a surface plate to be used in a polishing apparatus, with a polishing pad to be attached on the surface plate. The surface plate of the present invention includes: a surface plate body; and a release layer including a release film or release paper formed on a surface of the surface plate body on which the polishing pad is to be attached. The release layer has a peel force of a surface thereof of 0.08 N/50 mm or more and 5.0 N/50 mm or less. The present invention can be suitably used in a polishing apparatus utilizing a general polishing pad including a pressure-sensitive adhesive. The present invention allows polishing pad fixing work and replacement work to be performed more easily than in a conventional technique.Type: ApplicationFiled: March 2, 2020Publication date: March 3, 2022Applicant: MARUISHI SANGYO CO., LTD.Inventors: MATSUO IIDA, TOSHIYASU YAJIMA, DAISUKE NINOMIYA, SHIMPEI TATSUNO
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Patent number: 11232007Abstract: A server system includes a primary server, at least one synchronous backup server, and at least one asynchronous backup server. The primary server includes a first processor. The at least one synchronous backup server, each includes a second processor configured to back up data of the primary server in a synchronous manner. The at least one asynchronous backup server, each includes a third processor configured to back up data of the primary server in an asynchronous manner. The first processor is configured to control each of one or more of the at least one asynchronous backup server to operate as a synchronous backup server when a number of the at least one synchronous backup server decreases due to a failure in at least one server included in the server system.Type: GrantFiled: March 26, 2019Date of Patent: January 25, 2022Assignee: FUJITSU LIMITEDInventors: Naoki Hashimoto, Takashi Tokuda, Daisuke Ninomiya, Kazuhiro Taniguchi
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Publication number: 20200147749Abstract: A polishing method using a polishing pad including a specific adsorption layer. The polishing pad has an adsorption layer including a silicone including linear polyorganosiloxane having vinyl groups only at both ends, and the like. The polishing pad is fixed to a surface plate, and a product to be polished is pressed against the polishing pad, and simultaneously slid to polish the product to be polished. In this case, the surface roughness (Ra) of the surface plate is set to 0.01 to 0.7 ?m, and the adsorption layer of the polishing pad is then adsorbed and fixed to the surface plate to perform polishing work. By adjusting the surface roughness of the surface plate as described above, a surface of the product to be polished can be inhibited from being unpredictably scratched or roughened. The method for adjusting the surface roughness of the surface plate is preferably a method in which a film having a surface roughness as described above is bonded to a surface of the surface plate.Type: ApplicationFiled: June 1, 2018Publication date: May 14, 2020Applicant: MARUISHI SANGYO CO., LTD.Inventors: TOSHIYASU YAJIMA, DAISUKE NINOMIYA
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Patent number: 10449653Abstract: The present invention is a holding pad including a holding layer for holding a member to be polished, in which the holding layer includes on a part of a surface thereof a template fixing portion for sticking a template for preventing lateral displacement of the member to be polished, the template fixing portion has on a surface thereof an adsorption layer for adsorbing and fixing the template the template fixing portion, and the adsorption layer is formed of a composition which is formed by crosslinking a silicone composed of a predetermined siloxane.Type: GrantFiled: November 26, 2014Date of Patent: October 22, 2019Assignee: MARUISHI SANGYO CO. LTD.Inventors: Toshiyasu Yajima, Daisuke Ninomiya
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Publication number: 20190310926Abstract: A server system includes a primary server, at least one synchronous backup server, and at least one asynchronous backup server. The primary server includes a first processor. The at least one synchronous backup server, each includes a second processor configured to back up data of the primary server in a synchronous manner. The at least one asynchronous backup server, each includes a third processor configured to back up data of the primary server in an asynchronous manner. The first processor is configured to control each of one or more of the at least one asynchronous backup server to operate as a synchronous backup server when a number of the at least one synchronous backup server decreases due to a failure in at least one server included in the server system.Type: ApplicationFiled: March 26, 2019Publication date: October 10, 2019Applicant: FUJITSU LIMITEDInventors: Naoki Hashimoto, Takashi Tokuda, Daisuke Ninomiya, Kazuhiro Taniguchi
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Publication number: 20170259397Abstract: The present invention is a holding pad including a holding layer for holding a member to be polished, in which the holding layer includes on a part of a surface thereof a template fixing portion for sticking a template for preventing lateral displacement of the member to be polished, the template fixing portion has on a surface thereof an adsorption layer for adsorbing and fixing the template the template fixing portion, and the adsorption layer is formed of a composition which is formed by crosslinking a silicone composed of a predetermined siloxane.Type: ApplicationFiled: November 26, 2014Publication date: September 14, 2017Applicant: MARUISHI SANGYO CO., LTD.Inventors: TOSHIYASU YAJIMA, DAISUKE NINOMIYA
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Publication number: 20160125030Abstract: A system includes a primary control device configured to control access to a first database and a secondary control device which is a standby device of the primary control device and is configured to control access to a second database. The secondary control device is configured to: receive first access prescribing information which prescribes processing for accessing the first database, and an inquiry statement to the first database from the primary control device; store the received first access prescribing information as a second access prescribing information and the inquiry statement in a first memory of the secondary control device; and erase the second access prescribing information, which is stored in the first memory and is used for the secondary control device to access the second database, when a notification of releasing a connection is received from the primary control device, the connection being used for accessing the first database.Type: ApplicationFiled: October 28, 2015Publication date: May 5, 2016Applicant: FUJITSU LIMITEDInventors: Tsuyoshi ADACHI, Daisuke NINOMIYA
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Patent number: 9223809Abstract: A disclosed data structure of a phrase tree includes, as data of each node in the phrase tree, a data block including a first area for holding a code for a character or a character string, a second area for holding, for each character that will be used, an appearance sequential number of a second character that appears next to the character or the character string, and a third area for holding, according to the appearance sequential number, a number of appearances or a code corresponding to a character string comprising the character or the character string and the second character when the number of appearances exceeds a threshold.Type: GrantFiled: May 22, 2013Date of Patent: December 29, 2015Assignee: FUJITSU LIMITEDInventors: Daisuke Ninomiya, Masahiro Higuchi, Yutaka Koyama, Masaki Nishigaki, Ryo Matsumura, Toshirou Ono, Takaki Ozawa, Junji Kawai
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Publication number: 20140006457Abstract: A disclosed data structure of a phrase tree includes, as data of each node in the phrase tree, a data block including a first area for holding a code for a character or a character string, a second area for holding, for each character that will be used, an appearance sequential number of a second character that appears next to the character or the character string, and a third area for holding, according to the appearance sequential number, a number of appearances or a code corresponding to a character string comprising the character or the character string and the second character when the number of appearances exceeds a threshold.Type: ApplicationFiled: May 22, 2013Publication date: January 2, 2014Applicant: Fujitsu LimitedInventors: Daisuke NINOMIYA, Masahiro Higuchi, Yutaka Koyama, Masaki Nishigaki, Ryo Matsumura, Toshirou Ono, Takaki Ozawa, Junji Kawai
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Patent number: 7057011Abstract: The present invention provides a continuous resin recovery method for recovering resin from which foreign matters and volatile components are sufficiently removed and which is highly purified and suitable for optical use. The continuous resin recovery method comprises heating a resin solution in a heating pipe at a temperature at least the boiling point of the solvent, introducing the resin solution heated at a temperature at least the boiling point of the solvent into a rough drying chamber maintained at a reduced pressure, separating the resin from the solvent vapor in the rough drying chamber, melting the separated resin, introducing the molten resin in a precise drying chamber kept at a reduced pressure, and passing the molten resin through a perforated plate in the precise drying chamber.Type: GrantFiled: January 24, 2005Date of Patent: June 6, 2006Assignee: Asahi Glass Company, LimitedInventors: Kazuyoshi Kurashima, Yoshiteru Sumi, Yasuo Etoh, Kumiko Minezaki, Daisuke Ninomiya
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Publication number: 20050197487Abstract: The present invention provides a continuous resin recovery method for recovering resin from which foreign matters and volatile components are sufficiently removed and which is highly purified and suitable for optical use. The continuous resin recovery method comprises a step of heating a resin solution in a heating pipe at a temperature at least the boiling point of the solvent, a step of introducing the resin solution heated at a temperature at least the boiling point of the solvent into a rough drying chamber maintained at a reduced pressure, a step of separating the resin from the solvent vapor in the rough drying chamber, a step of melting the separated resin, a step of introducing the molten resin in a precise drying chamber kept at a reduced pressure, and a step of passing the molten resin through a perforated plate in the precise drying chamber.Type: ApplicationFiled: January 24, 2005Publication date: September 8, 2005Applicant: ASAHI GLASS COMPANY, LIMITEDInventors: Kazuyoshi Kurashima, Yoshiteru Sumi, Yasuo Etoh, Kumiko Minezaki, Daisuke Ninomiya