Patents by Inventor Daisuke Nishimura

Daisuke Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240201725
    Abstract: A pedal pad includes a plate part having a plate shape. When a driver performs a depression operation on a plate part from one side in a plate thickness direction, the pedal pad rotates about an axis perpendicular to an extending direction of the plate part. A shaft member is provided at a position away and downward in a vehicle from the plate part. A housing rotatably supports the shaft member. A connecting portion connects the pedal pad and the shaft member. Such a pedal device is an organ-type pedal device in which a pedal lower end is positioned below in the vehicle than a pedal upper end when the plate part is not subject to the depression operation by the driver in the non-depressed state. The pedal device is provided with a gap between the housing and the pedal lower end.
    Type: Application
    Filed: February 26, 2024
    Publication date: June 20, 2024
    Inventors: Masashi ARAO, Etsugo YANAGIDA, Daisuke HOKUTO, Atsushi NISHIMURA, Kengo ITO, Genki SUZUKI, Hiroto YOSHIDA
  • Patent number: 11990739
    Abstract: A wiring member with a fixing member includes a flat wiring member, and a fixing member. The fixing member includes an attachment part and a fixing part. The attachment part includes an annular part and an annular shape maintaining part. The annular part is capable of changing a state between an annular state and a non-annular state. The annular shape maintaining part is provided at one end portion of the annular part, fastens another end portion of the annular part, and maintains the annular part in the annular state. In a state in which the annular part is in the annular state and the attachment part is attached to the flat wiring member, a part of the flat wiring member to which the attachment part is attached is in a spread state.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: May 21, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Ryuta Takakura, Miyu Aramaki, Daisuke Ebata, Taku Umehara, Tetsuya Nishimura, Kenta Arai
  • Patent number: 11988981
    Abstract: An endless belt includes a resin and conductive particles, in which a content of the conductive particles with respect to the endless belt is 5% by volume or more and 20% by volume or less in terms of a volume ratio, a Young's modulus of the endless belt is 3,000 MPa or more, and the number of times of bending endurance of the endless belt measured by an MIT test specified in JIS P8115:2001 is 10,000 or more.
    Type: Grant
    Filed: March 26, 2023
    Date of Patent: May 21, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yosuke Kubo, Hiroaki Tanaka, Shigeru Fukuda, Daisuke Tanemura, Masato Ono, Masato Furukawa, Masayuki Seko, Koichi Matsumoto, Iori Nishimura
  • Publication number: 20240152077
    Abstract: An intermediate transfer belt has metal oxide particles as a solid lubricant on a surface of the intermediate transfer belt, in which an average spacing between the metal oxide particles on the surface is 1,000 nm or less, and an average height of the metal oxide particles from the surface is 15 nm or more and 320 nm or less.
    Type: Application
    Filed: July 17, 2023
    Publication date: May 9, 2024
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Daisuke TANEMURA, Masato ONO, Shigeru FUKUDA, Masato FURUKAWA, Hiroaki TANAKA, Yosuke KUBO, Iori NISHIMURA, Masayuki SEKO, Koichi MATSUMOTO, Satoya SUGIURA
  • Publication number: 20240136439
    Abstract: A semiconductor device includes a substrate, a semiconductor layer, an element region, and fin transistors. The substrate includes a principal surface. The semiconductor layer is formed as a surface layer or on the principal surface of the substrate, the surface layer being the principal surface of the substrate. The semiconductor layer has a crystal structure in which an angle between two of crystal orientations with equivalent relationships on a crystal plane having a correspondence with the principal surface of the substrate is 60 degrees or 120 degrees. The element region includes unit element regions formed on the principal surface of the substrate. The fin transistors are formed in the semiconductor layer, in the respective unit element regions. The fin transistors radially extend from a center toward an outer periphery of the element region. Adjacent two of the fin transistors have a spacing with a 60° angle or a 120° angle.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 25, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki TAKIGUCHI, Eiji YAGYU, Kunihiko NISHIMURA, Hisashi SAITO, Takahiro YAMADA, Daisuke TSUNAMI, Marika NAKAMURA, Masanao ITO
  • Publication number: 20240123654
    Abstract: Provided is a separation and recovery apparatus for continuously separating and recovering, from a resin mixture containing a resin containing a hydrolyzable polymer and a resin containing a nonhydrolyzable polymer, a hydrolytic component a of the hydrolyzable polymer A and the nonhydrolyzable polymer B, the apparatus including: a crushing unit that crushes the resin mixture a melting/discharging unit that melts a crushed product obtained by the crushing unit to form a fluid and discharges the fluid at a high pressure; and a hydrothermal reaction treatment unit that continuously subjects the fluid discharged from the melting/discharging unit to a hydrothermal reaction treatment, wherein, in the melting/discharging unit, the hydrolyzable polymer A is hydrolyzed, and the hydrolytic component a thereof is dissolved and transferred into water permeating a sintered alloy diaphragm, thereby separating the nonhydrolyzable polymer B.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 18, 2024
    Applicant: TOPPAN INC.
    Inventors: Masaru WATANABE, Aritomo YAMAGUCHI, Osamu SATO, Yuuma IRISA, Akira TAKAMA, Kousuke NISHIMURA, Hiroki KUJIRAOKA, Hideki MIYAZAKI, Keita AKIMOTO, Takuya TAKAHATA, Daisuke KUGIMOTO, Shingo KOUDA, Satoshi HAMURA, Takahiro IMAI, Yumiko OMORI, Manabu KAWA
  • Publication number: 20240118647
    Abstract: An endless belt includes a resin and conductive particles, in which a content of the conductive particles with respect to the endless belt is 5% by volume or more and 20% by volume or less in terms of a volume ratio, a Young's modulus of the endless belt is 3,000 MPa or more, and the number of times of bending endurance of the endless belt measured by an MIT test specified in JIS P8115:2001 is 10,000 or more.
    Type: Application
    Filed: March 26, 2023
    Publication date: April 11, 2024
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Yosuke KUBO, Hiroaki TANAKA, Shigeru FUKUDA, Daisuke TANEMURA, Masato ONO, Masato FURUKAWA, Masayuki SEKO, Koichi MATSUMOTO, Iori NISHIMURA
  • Publication number: 20240118646
    Abstract: An endless belt, in which an outer peripheral surface of the endless belt has a coefficient of dynamic friction of 0.85 or less, and in a case where polyester resin particles having a volume-average particle size of 4.7 ?m are caused to adhere to the outer peripheral surface under a load of 0 g/cm2, and then air is sprayed on the outer peripheral surface from above the outer peripheral surface at a spray pressure that keeps increasing, all the polyester resin particles having adhered to the outer peripheral surface are spaced apart from the outer peripheral surface at the spray pressure of 6 kPa or less.
    Type: Application
    Filed: March 22, 2023
    Publication date: April 11, 2024
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Hiroaki TANAKA, Daisuke TANEMURA, Masato FURUKAWA, Yosuke KUBO, Iori NISHIMURA, Masato ONO, Masayuki SEKO, Shigeru FUKUDA
  • Patent number: 11929599
    Abstract: A wiring member with a fixing member includes a wiring member, and a fixing member. The wiring member includes a plurality of wire-like transmission members and a base material. The plurality of wire-like transmission members are fixed to the base material in an arrayed state. The base material is bent so as to surround the plurality of wire-like transmission members. The fixing member includes an attachment part and a fixing part. The attachment part is attached to the wiring member so as to be located on outside of the base material. The fixing part is a part being connected to the attachment part and being fixed to a fixing target of the wiring member. In a state in which the attachment part is attached to the wiring member, the base material is maintained in a bent state.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 12, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsuya Nishimura, Daisuke Ebata, Taku Umehara, Ryuta Takakura, Kenta Arai, Miyu Aramaki
  • Patent number: 11919257
    Abstract: A tape arranging device includes guide roller units and a moving unit. Tape materials are capable of passing through the respective guide roller units. Each of the tape materials is configured with fibers impregnated with resin. The moving unit is configured to move the guide roller units and to change a distance between adjacent ones of the guide roller units. The adjacent ones of the guide roller units are adjacent to each other.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: March 5, 2024
    Assignees: SUBARU CORPORATION, TSUDAKOMA KOGYO KABUSHIKI KAISHA
    Inventors: Daisuke Hirabayashi, Isao Nishimura
  • Publication number: 20240071793
    Abstract: In a substrate processing apparatus according to the present invention, a heating mechanism for heating a substrate includes a gas discharge nozzle arranged in an internal space, a heater attached to an outer wall of a chamber, and a pipe feeding to the discharge nozzle. An observing mechanism includes a light source part and an image pickup part which are arranged at a separation position away from an attachment portion in the outer wall of the chamber. Thus, the light source part and the image pickup part become less susceptible to an effect of heat generated by the heater. In other words, it is possible to prevent the reduction in the observation accuracy due to an effect of temperature change.
    Type: Application
    Filed: August 7, 2023
    Publication date: February 29, 2024
    Inventors: Shuhei NEMOTO, Kazuhiro SHOJI, Daisuke HISHITANI, Yusuke SATO, Tomomitsu NISHIMURA
  • Publication number: 20230299716
    Abstract: A measurement method for a photovoltaic module includes loading and measuring . The loading includes loading a photovoltaic module onto a measurement device. The measuring includes measuring, with an output characteristic measurer included in the measurement device, an output voltage value and an output current value between a positive terminal and a negative terminal of the photovoltaic module, and measuring, with a weight measurer included in the measurement device, a weight value of the photovoltaic module.
    Type: Application
    Filed: July 16, 2021
    Publication date: September 21, 2023
    Inventors: Yusuke MIYAMICHI, Keita KUROSU, Shinnosuke USHIO, Daisuke NISHIMURA, Motoki SHIBAHARA, Masaya TAKAHASHI
  • Publication number: 20230283233
    Abstract: A measurement device for a photovoltaic module includes an output characteristic measurer and a weight measurer. The output characteristic measurer measures an output voltage value and an output current value between a positive terminal and a negative terminal of the photovoltaic module. The weight measurer measures a weight value of the photovoltaic module.
    Type: Application
    Filed: July 15, 2021
    Publication date: September 7, 2023
    Inventors: Yusuke MIYAMICHI, Keita KUROSU, Shinnosuke USHIO, Daisuke NISHIMURA, Motoki SHIBAHARA, Masaya TAKAHASHI
  • Publication number: 20230177431
    Abstract: Collaborative skills management includes techniques for maintaining up-to-date skills data. Skill data for users is updated by both the users themselves as well as other users. Various rules can be applied depending on the application. Skill data can also be updated based on analysis of collaboration data.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 8, 2023
    Inventors: Daichi Yoshikawa, Daisuke Nishimura
  • Publication number: 20220147903
    Abstract: A platform for skill data management includes a search engine with recommendation algorithm to search for experts, a platform to rate advisors, report hidden contributions, and endorse skills for other users, a function to evaluate work efficiency and advisor's help quantitatively, and audio/video chat functionality that is optimized for a short and verbal conversation.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 12, 2022
    Inventors: Daichi Yoshikawa, Daisuke Nishimura
  • Publication number: 20220147945
    Abstract: Skill data management techniques include extracting keywords for skill data obtained from experiences of individuals. Skill data management includes representing skill data in graph format including edges and nodes, suppressing duplicate data, and managing aliases. Managed skill data can be used for hiring, recruiting, internal placement, career planning, training, and issue solving.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 12, 2022
    Inventors: Daichi Yoshikawa, Daisuke Nishimura
  • Patent number: 10242522
    Abstract: An electronic locker includes a plurality of cabinets, a measurement unit capable of measuring a dimension of an object, and a controller. The controller compares the dimension of the object measured by the measurement unit with a table of dimensions of the plurality of cabinets stored previously to select a cabinet suitable for the dimension of the object out of the plurality of cabinets.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: March 26, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Daisuke Nishimura, Kimiaki Toshikiyo
  • Patent number: 10029857
    Abstract: An arrangement of loaded packages is estimated three-dimensionally. A loading position at which a target package is loaded next is determined based on the estimated arrangement. A position at which the target package is loaded is instructed by irradiation with an index light indicating the determined loading position. This method allows a package to be loaded in a limited space, for example, the package to be loaded optimally in a transport device or in a storehouse.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: July 24, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kimiaki Toshikiyo, Daisuke Nishimura
  • Publication number: 20170267461
    Abstract: An arrangement of loaded packages is estimated three-dimensionally. A loading position at which a target package is loaded next is determined based on the estimated arrangement. A position at which the target package is loaded is instructed by irradiation with an index light indicating the determined loading position. This method allows a package to be loaded in a limited space, for example, the package to be loaded optimally in a transport device or in a storehouse.
    Type: Application
    Filed: July 16, 2015
    Publication date: September 21, 2017
    Inventors: KIMIAKI TOSHIKIYO, DAISUKE NISHIMURA
  • Patent number: RE46739
    Abstract: To provide a photoelectric conversion device having a high photoelectric conversion efficiency, a photoelectric conversion device 21 includes a substrate 1, a plurality of lower electrodes 2 on the substrate 1 comprising a metal element, a plurality of photoelectric conversion layers 33 comprising a chalcogen compound semiconductor formed on the plurality of lower electrodes 2 and separated from one another on the lower electrodes 2, a metal-chalcogen compound layer 8 comprising the metal element and a chalcogen element included in the chalcogen compound semiconductor formed between the lower electrode 2 and the photoelectric conversion layer 33, an upper electrode 5 formed on the photoelectric conversion layer 33, and a connection conductor 7 electrically connecting, in a plurality of the photoelectric conversion layers 33, the upper electrode 5 to the lower electrode 2 without interposition of the metal-chalcogen compound layer 8.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: February 27, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Daisuke Nishimura, Toshifumi Sugawara, Ken Nishiura, Norihiko Matsushima, Yosuke Inomata, Hisao Arimune, Tsuyoshi Uesugi