Patents by Inventor Daisuke OMIYA

Daisuke OMIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etching liquid composition and etching method
    Patent number: 10920143
    Abstract: An etching method that includes using the etching liquid composition containing (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) 2-hydroxyethane sulfonic acid or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one compound selected from the group consisting of azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water, is provided.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: February 16, 2021
    Assignee: ADEKA CORPORATION
    Inventors: Junro Ishizaki, Daisuke Omiya
  • ETCHING LIQUID COMPOSITION AND ETCHING METHOD
    Publication number: 20200010762
    Abstract: An etching method that includes using the etching liquid composition containing (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) 2-hydroxyethane sulfonic acid or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one compound selected from the group consisting of azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water, is provided.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Applicant: ADEKA CORPORATION
    Inventors: Junro ISHIZAKI, Daisuke OMIYA
  • ETCHING LIQUID COMPOSITION AND ETCHING METHOD
    Publication number: 20180237923
    Abstract: An etching liquid composition that contains (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) an organic sulfonic acid compound represented by general formula (I) described in the specification or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one type of compound selected from among azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water; and an etching method that includes using the etching liquid composition are provided.
    Type: Application
    Filed: August 23, 2016
    Publication date: August 23, 2018
    Applicant: ADEKA CORPORATION
    Inventors: Junro ISHIZAKI, Daisuke OMIYA