Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

Abstract: A light-emitting device includes a wavelength conversion member including, in a dispersed manner, a first phosphor, a second phosphor, a third phosphor, a fourth phosphor, and a fifth phosphor, and a light emitter. The first phosphor has a peak in a wavelength region of 400 to 500 nm, the second phosphor in 450 to 550 nm, the third phosphor in 500 to 600 nm, the fourth phosphor in 600 to 700 nm, and a fifth phosphor in 680 to 800 nm. The light emitter emits light in an ultraviolet region of 380 to 430 nm. The light-emitting device has an emission spectrum in a region of 380 to 950 nm including peaks in regions of 380 to 430 nm, 430 to 480 nm, 480 to 550 nm, 550 to 650 nm, and 650 to 750 nm, and differences between relative light intensities at the peaks are less than 20%.

Abstract: A light-emitting device includes a wavelength conversion member including, in a dispersed manner, a first phosphor, a second phosphor, a third phosphor, a fourth phosphor, and a fifth phosphor, and a light emitter. The first phosphor has a peak in a wavelength region of 400 to 500 nm, the second phosphor in 450 to 550 nm, the third phosphor in 500 to 600 nm, the fourth phosphor in 600 to 700 nm, and a fifth phosphor in 680 to 800 nm. The light emitter emits light in an ultraviolet region of 380 to 430 nm. The light-emitting device has an emission spectrum in a region of 380 to 950 nm including peaks in regions of 380 to 430 nm, 430 to 480 nm, 480 to 550 nm, 550 to 650 nm, and 650 to 750 nm, and differences between relative light intensities at the peaks are less than 20%.

Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

Abstract: An indoor light source emits light having an emission spectrum including a first peak in a wavelength region of 440 to 460 nm, a second peak in a wavelength region of 540 to 560 nm, and a third peak in a wavelength region of 610 to 630 nm. When the highest one of intensities at the first peak, the second peak, and the third peak is 1 in terms of relative intensity, the emission spectrum includes a lowest light intensity of 0.7 or higher in terms of relative intensity in ?1 to ?2 in nm, and a lowest light intensity of 0.8 or higher in terms of relative intensity in ?2 to ?3 in nm, where ?1 is a peak wavelength at the first peak in nm, ?2 is a peak wavelength at the second peak in nm, and ?3 is a peak wavelength at the third peak in nm.

Abstract: An indoor light source emits light having an emission spectrum including a first peak in a wavelength region of 440 to 460 nm, a second peak in a wavelength region of 540 to 560 nm, and a third peak in a wavelength region of 610 to 630 nm. When the highest one of intensities at the first peak, the second peak, and the third peak is 1 in terms of relative intensity, the emission spectrum includes a lowest light intensity of 0.7 or higher in terms of relative intensity in ?1 to ?2 in nm, and a lowest light intensity of 0.8 or higher in terms of relative intensity in ?2 to ?3 in nm, where ?1 is a peak wavelength at the first peak in nm, ?2 is a peak wavelength at the second peak in nm, and ?3 is a peak wavelength at the third peak in nm.

Abstract: An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.

Abstract: The invention relates to reducing effect of light that is emitted from a light-emitting element and then enters between a base and a frame member. A light-emitting device (1) includes a base (11), a frame member (12) and a light-emitting element (13). The light-emitting device (1) further includes an intervening layer (14). The frame member (12) is disposed on the base (11). The light-emitting element (13) is made of a semiconductor material. The light-emitting element (13) is disposed in a region defined by the frame member (12), and mounted on the base (11). The intervening layer (14) contains a plurality of light transmitting particles (14-2) and is disposed between the base (11) and the frame member (12).

Abstract: A light-emitting apparatus includes a substrate warped as a whole of which a central portion is most highly raised; a light-emitting device mounted on the central portion of the substrate; a support member disposed on the substrate so as to surround the light-emitting device; and a frame body disposed on the support member so as to surround the light-emitting device, the frame body including part connected to the support member and part not connected to the support member, the part not connected to the support member being left spaced from an upper surface of the substrate. Moreover, the light-emitting apparatus is constituted so that a level of a lower surface of the light-emitting device is higher than a level of a lower surface of the frame body.

Abstract: A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Abstract: An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.

Abstract: A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Abstract: A light-emitting apparatus includes a substrate warped as a whole of which a central portion is most highly raised; a light-emitting device mounted on the central portion of the substrate; a support member disposed on the substrate so as to surround the light-emitting device; and a frame body disposed on the support member so as to surround the light-emitting device, the frame body including part connected to the support member and part not connected to the support member, the part not connected to the support member being left spaced from an upper surface of the substrate. Moreover, the light-emitting apparatus is constituted so that a level of a lower surface of the light-emitting device is higher than a level of a lower surface of the frame body.

Abstract: To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

Abstract: A light emitting device includes a substrate; a light emitting element disposed on the substrate; and a wavelength conversion member disposed on or above the substrate, the wavelength conversion member covering the light emitting element spacing apart therefrom, and having a level difference at an outer peripheral portion of a lower end of the wavelength conversion member, the lower end being joined to the substrate via a light transmitting member. In addition, the light emitting device includes a light blocking member disposed on the substrate and disposed between the light emitting element and the light transmitting member. Further, the wavelength conversion member is configured so that the lower end thereof extends from a top of the light transmitting member to a side of the light transmitting member.

Abstract: To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

Abstract: The invention relates to reducing effect of light that is emitted from a light-emitting element and then enters between a base and a frame member. A light-emitting device (1) includes a base (11), a frame member (12) and a light-emitting element (13). The light-emitting device (1) further includes an intervening layer (14). The frame member (12) is disposed on the base (11). The light-emitting element (13) is made of a semiconductor material. The light-emitting element (13) is disposed in a region defined by the frame member (12), and mounted on the base (11). The intervening layer (14) contains a plurality of light transmitting particles (14-2) and is disposed between the base (11) and the frame member (12).

Abstract: A light emitting device includes a substrate; a light emitting element disposed on the substrate; and a wavelength conversion member disposed on or above the substrate, the wavelength conversion member covering the light emitting element spacing apart therefrom, and having a level difference at an outer peripheral portion of a lower end of the wavelength conversion member, the lower end being joined to the substrate via a light transmitting member. In addition, the light emitting device includes a light blocking member disposed on the substrate and disposed between the light emitting element and the light transmitting member. Further, the wavelength conversion member is configured so that the lower end thereof extends from a top of the light transmitting member to a side of the light transmitting member.