Patents by Inventor Daisuke SASANO

Daisuke SASANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200409263
    Abstract: A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomohiro YORISUE, Taihei INOUE, Yoshito IDO, Mitsutaka NAKAMURA, Tomoshige YUNOKUCHI, Daisuke SASANO, Takahiro SASAKI
  • Patent number: 10831101
    Abstract: A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 10, 2020
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomohiro Yorisue, Taihei Inoue, Yoshito Ido, Mitsutaka Nakamura, Tomoshige Yunokuchi, Daisuke Sasano, Takahiro Sasaki
  • Publication number: 20190113845
    Abstract: A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
    Type: Application
    Filed: March 28, 2017
    Publication date: April 18, 2019
    Applicants: ASAHI KASEI KABUSHIKI KAISHA, ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomohiro YORISUE, Taihei INOUE, Yoshito IDO, Mitsutaka NAKAMURA, Tomoshige YUNOKUCHI, Daisuke SASANO, Takahiro SASAKI