Patents by Inventor Daisuke SATAKE
Daisuke SATAKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12570191Abstract: A vehicle seat assembly apparatus includes: a base part; a cushion working part which is joined to one side of the base part and with which a seat cushion having a plurality of first through-holes formed therein can be placed and a seat cover can be joined to the seat cushion; and a cover working part which is joined to the other side of the base part and with which the seat cover can be placed and the seat cover can be moved to an upper part of the seat cushion. The cover working part makes it possible to align the angles of clips to be joined to suspenders of the seat cover.Type: GrantFiled: March 23, 2022Date of Patent: March 10, 2026Assignee: YKK CorporationInventors: Sooil Chin, Daisuke Satake, Akira Sato, Naoki Kasuya, Jinwoo Park
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Patent number: 12300530Abstract: A placement stage includes: a wafer placement part having a placement surface and a first through hole; a base bonded to a rear surface of the wafer placement part by a first adhesive layer, and including a second through hole formed in the base, the second through hole communicating with the first through hole; a sleeve installed in the second through hole to be detachable from the base; and the sealing member installed between the rear surface and the sleeve to be spaced apart from the first adhesive layer so as to seal the first adhesive layer. A convex portion is formed to extend on an outer circumference or an inner circumference of a tip end of the sleeve, and the sealing member is pressed against a tip end surface of the sleeve to expand and contract.Type: GrantFiled: July 30, 2020Date of Patent: May 13, 2025Assignee: TOKYO ELECTRON LIMITEDInventor: Daisuke Satake
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Patent number: 12275633Abstract: This vehicle seat assembly device includes: a base section; a cushion working section that is connected to one side of the base section and that can place a seat cushion in which a plurality of first through holes are formed; and a cover working section that is connected to the other side of the base section, that places a seat cover, and that can transfer the seat cover to the upper part of the seat cushion. The cushion working section fixes a clip, which is connected to a suspender of the seat cover, to a wire positioned at the lower part of the seat cushion.Type: GrantFiled: March 23, 2022Date of Patent: April 15, 2025Assignee: YKK CorporationInventors: Sooil Chin, Daisuke Satake, Akira Sato, Naoki Kasuya, Jinwoo Park
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Publication number: 20250087469Abstract: A substrate processing apparatus is provided. The apparatus comprises a chamber; a substrate support which is arranged in the chamber and has at least one first gas supply path; and at least one control valve configured to control a flow rate or pressure of gas supplied through the at least one first gas supply path. The substrate support includes a base, and an electrostatic chuck which is arranged on the base and has an upper surface. The upper surface has a plurality of protrusions and a first annular groove group. The first annular groove group comprises a first inner annular groove, a first intermediate annular groove, and a first outer annular groove. Any one of the first inner annular groove, the first intermediate annular groove, and the first outer annular groove communicates with the at least one first gas supply path.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Applicant: Tokyo Electron LimitedInventors: Kohei OTSUKI, Shin YAMAGUCHI, Daisuke SATAKE
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Publication number: 20250065785Abstract: A vehicle seat assembly apparatus includes: a base part; a cushion working part which is joined to one side of the base part and with which a seat cushion having a plurality of first through-holes formed therein can be placed and a seat cover can be joined to the seat cushion; and a cover working part which is joined to the other side of the base part and with which the seat cover can be placed and the seat cover can be moved to an upper part of the seat cushion. The cover working part makes it possible to align the angles of clips to be joined to suspenders of the seat cover.Type: ApplicationFiled: March 23, 2022Publication date: February 27, 2025Inventors: Sooil Chin, Daisuke Satake, Akira Sato, Naoki Kasuya, Jinwoo Park
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Patent number: 12217943Abstract: A substrate processing apparatus is provided. The apparatus comprises a chamber; a substrate support which is arranged in the chamber and has at least one first gas supply path; and at least one control valve configured to control a flow rate or pressure of gas supplied through the at least one first gas supply path. The substrate support includes a base, and an electrostatic chuck which is arranged on the base and has an upper surface. The upper surface has a plurality of protrusions and a first annular groove group. The first annular groove group comprises a first inner annular groove, a first intermediate annular groove, and a first outer annular groove. Any one of the first inner annular groove, the first intermediate annular groove, and the first outer annular groove communicates with the at least one first gas supply path.Type: GrantFiled: June 22, 2022Date of Patent: February 4, 2025Assignee: TOKYO ELECTRON LIMITEDInventors: Kohei Otsuki, Shin Yamaguchi, Daisuke Satake
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Publication number: 20250010774Abstract: This vehicle seat assembly device includes: a base section; a cushion working section that is connected to one side of the base section, that places a seat cushion in which a plurality of first through holes are formed, and that is capable of connecting a seat cover to the seat cushion; and a cover working section that is connected to the other side of the base section, that places a seat cover, and that can transfer the seat cover to the upper part of the seat cushion. The cover working section includes a cushion rest which connected to the base section and on which a wire and the seat cushion can be placed.Type: ApplicationFiled: March 23, 2022Publication date: January 9, 2025Inventors: Sooil Chin, Daisuke Satake, Akira Sato, Naoki Kasuya, Jinwoo Park
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Publication number: 20240351858Abstract: This vehicle seat assembly device includes: a base section; a cushion working section that is connected to one side of the base section and that can place a seat cushion in which a plurality of first through holes are formed; and a cover working section that is connected to the other side of the base section, that places a seat cover, and that can transfer the seat cover to the upper part of the seat cushion. The cushion working section fixes a clip, which is connected to a suspender of the seat cover, to a wire positioned at the lower part of the seat cushion.Type: ApplicationFiled: March 23, 2022Publication date: October 24, 2024Inventors: Sooil Chin, Daisuke Satake, Akira Sato, Naoki Kasuya, Jinwoo Park
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Patent number: 11728145Abstract: A stage includes: a pin insertion passage penetrating the stage on which a substrate is mounted, and configured to allow a lifter pin to be inserted into and penetrate the pin insertion passage, a heat transfer gas passage penetrating the stage, and configured to introduce a heat transfer gas onto a mounting surface of the stage; a common gas passage in communication with the pin insertion passage and the heat transfer gas passage, and configured to allow the heat transfer gas to flow through the common gas passage; and a first member disposed to face the common gas passage at a location at which the pin insertion passage and the common gas passage intersect each other, and configured to adjust a flow rate of the heat transfer gas introduced onto the mounting surface of the stage from the pin insertion passage.Type: GrantFiled: December 21, 2020Date of Patent: August 15, 2023Assignee: TOKYO ELECTRON LIMITEDInventor: Daisuke Satake
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Publication number: 20220406576Abstract: A substrate processing apparatus is provided. The apparatus comprises a chamber; a substrate support which is arranged in the chamber and has at least one first gas supply path; and at least one control valve configured to control a flow rate or pressure of gas supplied through the at least one first gas supply path. The substrate support includes a base, and an electrostatic chuck which is arranged on the base and has an upper surface. The upper surface has a plurality of protrusions and a first annular groove group. The first annular groove group comprises a first inner annular groove, a first intermediate annular groove, and a first outer annular groove. Any one of the first inner annular groove, the first intermediate annular groove, and the first outer annular groove communicates with the at least one first gas supply path.Type: ApplicationFiled: June 22, 2022Publication date: December 22, 2022Applicant: Tokyo Electron LimitedInventors: Kohei OTSUKI, Shin YAMAGUCHI, Daisuke SATAKE
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Publication number: 20210202219Abstract: A stage includes: a pin insertion passage penetrating the stage on which a substrate is mounted, and configured to allow a lifter pin to be inserted into and penetrate the pin insertion passage, a heat transfer gas passage penetrating the stage, and configured to introduce a heat transfer gas onto a mounting surface of the stage; a common gas passage in communication with the pin insertion passage and the heat transfer gas passage, and configured to allow the heat transfer gas to flow through the common gas passage; and a first member disposed to face the common gas passage at a location at which the pin insertion passage and the common gas passage intersect each other, and configured to adjust a flow rate of the heat transfer gas introduced onto the mounting surface of the stage from the pin insertion passage.Type: ApplicationFiled: December 21, 2020Publication date: July 1, 2021Inventor: Daisuke SATAKE
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Publication number: 20210043489Abstract: A placement stage includes: a wafer placement part having a placement surface and a first through hole; a base bonded to a rear surface of the wafer placement part by a first adhesive layer, and including a second through hole formed in the base, the second through hole communicating with the first through hole; a sleeve installed in the second through hole to be detachable from the base; and the sealing member installed between the rear surface and the sleeve to be spaced apart from the first adhesive layer so as to seal the first adhesive layer. A convex portion is formed to extend on an outer circumference or an inner circumference of a tip end of the sleeve, and the sealing member is pressed against a tip end surface of the sleeve to expand and contract.Type: ApplicationFiled: July 30, 2020Publication date: February 11, 2021Inventor: Daisuke SATAKE