Patents by Inventor Daisuke Sekiya
Daisuke Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11876502Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on the substrate, a cover over the substrate and IDT electrode, and hollow spaces between the IDT electrode and the cover. The hollow spaces are defined by partition supports between the substrate and the cover. The partition supports include a first and second partition supports extending in a first direction without contacting each other. The first and second partition supports each include first and second ends along the first direction. The first and second direction perpendicular to the first direction. The first end of the first partition support is closer to an outer periphery of the substrate than is the second end, and the first end of the second partition support is farther away from the outer periphery than is the second end.Type: GrantFiled: September 14, 2022Date of Patent: January 16, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiko Hirano, Daisuke Sekiya
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Publication number: 20230006639Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on the substrate, a cover over the substrate and IDT electrode, and hollow spaces between the IDT electrode and the cover. The hollow spaces are defined by partition supports between the substrate and the cover. The partition supports include a first and second partition supports extending in a first direction without contacting each other. The first and second partition supports each include first and second ends along the first direction. The first and second direction perpendicular to the first direction. The first end of the first partition support is closer to an outer periphery of the substrate than is the second end, and the first end of the second partition support is farther away from the outer periphery than is the second end.Type: ApplicationFiled: September 14, 2022Publication date: January 5, 2023Inventors: Yasuhiko HIRANO, Daisuke SEKIYA
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Patent number: 11476831Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate, a plurality of partition-support layers each of which is arranged in a region of the main surface surrounded by an outer periphery of the main surface, and a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode. The plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other, and a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from a second direction perpendicular or substantially perpendicular to a first direction in which the plurality of partition-support layers extend.Type: GrantFiled: October 17, 2018Date of Patent: October 18, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiko Hirano, Daisuke Sekiya
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Patent number: 11444596Abstract: An acoustic wave device includes a piezoelectric substrate, an IDT electrode and an electrode pad provided on a front surface of the piezoelectric substrate, a support layer provided on the front surface so as to surround the IDT electrode, a first cover layer and a second cover layer provided on the support layer such that the first cover layer, the second cover layer, the support layer, and the piezoelectric substrate seal the IDT electrode in a hollow space, a UBM portion joined to the electrode pad, and a bump joined to the UBM portion. A joint surface of the UBM portion at which the UBM portion is joined to the bump has a spherical shape or substantially spherical shape that is convex towards the bump side.Type: GrantFiled: April 26, 2018Date of Patent: September 13, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke Sekiya, Yasuhiko Hirano
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Patent number: 11398809Abstract: An elastic wave device includes a piezoelectric substrate including first and second primary surfaces opposing one another, a via electrode extending through the piezoelectric substrate, and a wiring electrode on the first primary surface of the piezoelectric substrate. The via electrode is connected at one end to the wiring electrode, and the via electrode includes a locking section at the one end, on the wiring electrode side. The locking section extends on the first primary surface of the piezoelectric substrate.Type: GrantFiled: October 23, 2018Date of Patent: July 26, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke Sekiya, Taku Kikuchi
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Patent number: 11277114Abstract: An elastic wave device includes an interdigital transducer electrode and a wiring electrode made of metal and provided on a first main surface of a piezoelectric substrate. Via hole electrodes penetrate the piezoelectric substrate. Each via hole electrode is connected to an external connection terminal. A cover member defines a hollow space in which the interdigital transducer electrode is sealed, together with the first main surface of the piezoelectric substrate. A heat dissipating member is provided on the wiring electrode to extend from the wiring electrode toward the cover member and penetrate the cover member.Type: GrantFiled: September 26, 2018Date of Patent: March 15, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Taku Kikuchi, Daisuke Sekiya
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Patent number: 10601389Abstract: An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.Type: GrantFiled: May 4, 2017Date of Patent: March 24, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke Sekiya, Taku Kikuchi, Hiroshi Tanaka
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Patent number: 10601394Abstract: An elastic wave device includes interdigital transducer electrodes on a piezoelectric substrate and wires electrically connected to the interdigital transducer electrodes. The wires include a first wire and a second wire. The device further includes an interlayer insulating film made from an inorganic dielectric material and covering a portion of the first wire. A portion of the second wire bridges a portion of the first wire with the interlayer insulating film provided therebetween. In a region, in a bridged area, where the second wire extends from a region on an outer side portion of the interlayer insulating film to above the interlayer insulating film, first auxiliary wire electrodes are provided on the piezoelectric substrate, such that when viewed in plan view, the first auxiliary wire electrodes at least partially overlap with the second wire and extend to within the interlayer insulating film.Type: GrantFiled: February 13, 2017Date of Patent: March 24, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Taku Kikuchi, Akira Michigami, Daisuke Sekiya, Masashi Tsubokawa
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Publication number: 20190058453Abstract: An elastic wave device includes a piezoelectric substrate including first and second primary surfaces opposing one another, a via electrode extending through the piezoelectric substrate, and a wiring electrode on the first primary surface of the piezoelectric substrate. The via electrode is connected at one end to the wiring electrode, and the via electrode includes a locking section at the one end, on the wiring electrode side. The locking section extends on the first primary surface of the piezoelectric substrate.Type: ApplicationFiled: October 23, 2018Publication date: February 21, 2019Inventors: Daisuke SEKIYA, Taku KIKUCHI
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Publication number: 20190052242Abstract: A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, support layers, and a cover layer. A distance from a first end of a first partition-support layer to one of the outer-periphery-frame support layers closest to the first end is smaller than a distance from a second end of the first partition-support layer to one of the outer-periphery-frame support layers closest to the second end, and a distance from a first end of a second partition-support layer to one of the outer-periphery-frame support layers closest to the first end is larger than a distance from a second end of the second partition-support layer to one of the outer-periphery-frame support layers closest to the second end.Type: ApplicationFiled: October 17, 2018Publication date: February 14, 2019Inventors: Yasuhiko HIRANO, Daisuke SEKIYA
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Publication number: 20190036510Abstract: An elastic wave device includes an interdigital transducer electrode and a wiring electrode made of metal and provided on a first main surface of a piezoelectric substrate. Via hole electrodes penetrate the piezoelectric substrate. Each via hole electrode is connected to an external connection terminal. A cover member defines a hollow space in which the interdigital transducer electrode is sealed, together with the first main surface of the piezoelectric substrate. A heat dissipating member is provided on the wiring electrode to extend from the wiring electrode toward the cover member and penetrate the cover member.Type: ApplicationFiled: September 26, 2018Publication date: January 31, 2019Inventors: Taku KIKUCHI, Daisuke SEKIYA
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Patent number: 10164603Abstract: An elastic wave device includes an elastic wave element that includes first support layers provided on a piezoelectric substrate, a second support layer provided on the piezoelectric substrate so as to surround the first support layers when viewed in a plan view, and a cover member provided on the first support layers and the second support layer, a mounting substrate on which the elastic wave element is mounted, and a mold resin provided on the mounting substrate and sealing the elastic wave element. A thickness of each of the first support layers is less than a thickness of the second support layer. The cover member convexly curves towards the piezoelectric substrate so as to be spaced away from the mounting substrate. A space between the mounting substrate and the cover member is filled with the mold resin.Type: GrantFiled: August 28, 2017Date of Patent: December 25, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke Sekiya, Taku Kikuchi, Yasuhiko Hirano, Hiroshi Tanaka
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Patent number: 10135419Abstract: A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, support layers, and a cover layer. A distance from a first end of a first partition-support layer to one of the outer-periphery-frame support layers closest to the first end is smaller than a distance from a second end of the first partition-support layer to one of the outer-periphery-frame support layers closest to the second end, and a distance from a first end of a second partition-support layer to one of the outer-periphery-frame support layers closest to the first end is larger than a distance from a second end of the second partition-support layer to one of the outer-periphery-frame support layers closest to the second end.Type: GrantFiled: December 12, 2016Date of Patent: November 20, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiko Hirano, Daisuke Sekiya
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Publication number: 20180241370Abstract: An acoustic wave device includes a piezoelectric substrate, an IDT electrode and an electrode pad provided on a front surface of the piezoelectric substrate, a support layer provided on the front surface so as to surround the IDT electrode, a first cover layer and a second cover layer provided on the support layer such that the first cover layer, the second cover layer, the support layer, and the piezoelectric substrate seal the IDT electrode in a hollow space, a UBM portion joined to the electrode pad, and a bump joined to the UBM portion. A joint surface of the UBM portion at which the UBM portion is joined to the bump has a spherical shape or substantially spherical shape that is convex towards the bump side.Type: ApplicationFiled: April 26, 2018Publication date: August 23, 2018Inventors: Daisuke SEKIYA, Yasuhiko HIRANO
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Publication number: 20170358728Abstract: An elastic wave device includes an elastic wave element that includes first support layers provided on a piezoelectric substrate, a second support layer provided on the piezoelectric substrate so as to surround the first support layers when viewed in a plan view, and a cover member provided on the first support layers and the second support layer, a mounting substrate on which the elastic wave element is mounted, and a mold resin provided on the mounting substrate and sealing the elastic wave element. A thickness of each of the first support layers is less than a thickness of the second support layer. The cover member convexly curves towards the piezoelectric substrate so as to be spaced away from the mounting substrate. A space between the mounting substrate and the cover member is filled with the mold resin.Type: ApplicationFiled: August 28, 2017Publication date: December 14, 2017Inventors: Daisuke SEKIYA, Taku KIKUCHI, Yasuhiko HIRANO, Hiroshi TANAKA
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Publication number: 20170237406Abstract: An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.Type: ApplicationFiled: May 4, 2017Publication date: August 17, 2017Inventors: Daisuke SEKIYA, Taku KIKUCHI, Hiroshi TANAKA
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Publication number: 20170187353Abstract: A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, support layers, and a cover layer. A distance from a first end of a first partition-support layer to one of the outer-periphery-frame support layers closest to the first end is smaller than a distance from a second end of the first partition-support layer to one of the outer-periphery-frame support layers closest to the second end, and a distance from a first end of a second partition-support layer to one of the outer-periphery-frame support layers closest to the first end is larger than a distance from a second end of the second partition-support layer to one of the outer-periphery-frame support layers closest to the second end.Type: ApplicationFiled: December 12, 2016Publication date: June 29, 2017Inventors: Yasuhiko HIRANO, Daisuke SEKIYA
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Publication number: 20170155372Abstract: An elastic wave device includes interdigital transducer electrodes on a piezoelectric substrate and wires electrically connected to the interdigital transducer electrodes. The wires include a first wire and a second wire. The device further includes an interlayer insulating film made from an inorganic dielectric material and covering a portion of the first wire. A portion of the second wire bridges a portion of the first wire with the interlayer insulating film provided therebetween. In a region, in a bridged area, where the second wire extends from a region on an outer side portion of the interlayer insulating film to above the interlayer insulating film, first auxiliary wire electrodes are provided on the piezoelectric substrate, such that when viewed in plan view, the first auxiliary wire electrodes at least partially overlap with the second wire and extend to within the interlayer insulating film.Type: ApplicationFiled: February 13, 2017Publication date: June 1, 2017Inventors: Taku KIKUCHI, Akira MICHIGAMI, Daisuke SEKIYA, Masashi TSUBOKAWA
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Patent number: 9346413Abstract: The saddle-ride vehicle includes: a front fork that rotatably supports a front wheel; a steering shaft that is coupled to the front fork and is steerably supported by a vehicle body frame; a steering handlebar holder that includes a lower holder and an upper holder and is provided above the steering shaft, the upper holder being in contact with the lower holder from above and fastened to the lower holder; a portable terminal holder that is fastened to the upper holder or the lower holder and capable of holding a personal digital assistance; and a steering system in which a steering handlebar pipe sandwiched between the lower holder and the upper holder is fixed to the steering handlebar holder.Type: GrantFiled: February 26, 2013Date of Patent: May 24, 2016Assignee: HONDA MOTOR CO., LTD.Inventors: Tsuguo Watanabe, Kiyotaka Fujihara, Yasumasa Matsui, Takuhei Kusano, Daisuke Kuriki, Kota Takizawa, Daisuke Sekiya
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Publication number: 20150158433Abstract: The saddle-ride vehicle includes: a front fork that rotatably supports a front wheel; a steering shaft that is coupled to the front fork and is steerably supported by a vehicle body frame; a steering handlebar holder that includes a lower holder and an upper holder and is provided above the steering shaft, the upper holder being in contact with the lower holder from above and fastened to the lower holder; a portable terminal holder that is fastened to the upper holder or the lower holder and capable of holding a personal digital assistance; and a steering system in which a steering handlebar pipe sandwiched between the lower holder and the upper holder is fixed to the steering handlebar holder.Type: ApplicationFiled: February 26, 2013Publication date: June 11, 2015Inventors: Tsuguo Watanabe, Kiyotaka Fujihara, Yasumasa Matsui, Takuhei Kusano, Daisuke Kuriki, Kota Takizawa, Daisuke Sekiya