Abstract: Tendency of change in physical quantities is easily recognized. For example, under a precondition that predictive values of a plurality of physical quantities are acquired by use of regression models, a plurality of predictive values of single physical quantity are acquired while changing blend rate for the plurality of physical quantities, and then, a blend rate of a composite material having the plurality of physical quantities all satisfying the predetermined conditions is visualized, on basis of prediction results of the plurality of physical quantities corresponded to the changed blend rate.

Abstract: A first synthesized characteristic value calculated based on a first blending ratio of constituent materials contained in a first composite material and on a first characteristic value corresponding to the constituent materials contained in the first composite material, as well as first blending information of the constituent materials contained in the first composite material are used as input parameters (explanatory variables) for an approximate function to estimate a value of physical quantity (objective variable) for the first composite material.

Abstract: A physical property value estimation device that estimates a physical property value corresponding to a physical property required for a composite material is provided with a storage unit that stores a learned physical property regression formula corresponding to the physical property in order to calculate a physical property value corresponding to a physical property predetermined as an objective variable, by using compound data of a material that composes the composite material and feature data of the material as explanatory variables, and stores a feature amount value of the material required for calculating the feature data; a reception unit that receives compound data of the material that composes the composite material as an estimation target; and a physical property calculation unit that obtains the physical property regression formula corresponding to the physical property from the storage unit, and calculates the physical property value based on the obtained compound data by using the obtained physic

Abstract: A first synthesized characteristic value calculated based on a first blending ratio of constituent materials contained in a first composite material and on a first characteristic value corresponding to the constituent materials contained in the first composite material, as well as first blending information of the constituent materials contained in the first composite material are used as input parameters (explanatory variables) for an approximate function to estimate a value of physical quantity (objective variable) for the first composite material.

Abstract: A physical property estimation device for a resin composition, which estimates a physical property of a resin composition that is manufactured by using a base polymer, a flame retardant, a flame retardant auxiliary, and other materials. The physical property estimation device is provided with a regression model building processing unit that learns by machine learning a relationship between explanatory variable data and physical property data including physical property data as an estimation target, and builds a regression model that shows a correlation between the explanatory variable data and the physical property data, and a physical property estimation processing unit that estimates the physical property of an estimation target by using the regression model.

Abstract: A physical quantity estimating system for estimating a value of physical quantity for a composite material is provided. The composite material contains two or more materials included in a plurality of different materials as constituent materials.

Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

Abstract: There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.

Abstract: An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B).

Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 ?m or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.

Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.

Abstract: The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer.

Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 ?m or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.

Abstract: An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B).

Abstract: There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts.wt. or more and 250 pts.wt. or less with respect to 100 pts.wt. of the mixed resin composition.

Abstract: An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° C. and not more than 150° C., a halogen-free flame retardant at a rate of not less than 100 parts by mass and not more than 250 parts by mass relative to 100 parts by mass of the copolyamide resin, and a carbodiimide compound soluble in the solvent at the room temperature (25° C.), and a conductor adhesion layer laminated on the adhesive layer.