Abstract: A heater including: a base body; a high frequency electrode and a heating element arranged inside the base body; and a support body, the base body including a first surface on which a heating target is mounted, a second surface to which a first end portion of the support body is attached, a first flow path having an gas intake provided on the first surface, a second flow path having an gas exhaust provided in a region inside the support body on the second surface, and a third flow path connecting the first flow path and the second flow path, each of the high frequency electrode, the heating element, and the third flow path being arranged in a plane parallel to the first surface, the heating element and the third flow path being arranged closer to the second surface than the high frequency electrode.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

Abstract: A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: A method and apparatus for controlling heating and cooling of a transfer unit in a precision hot press device configured to suppress overheating and supercooling, and of performing quick heating and cooling, wherein the method and apparatus compares an amount of energy given to the transfer unit or taken from the transfer unit by a heating unit or a cooling unit with an amount of energy observed to enter into or exit from the transfer unit before the temperature of the transfer unit reaches a target temperature, calculates an amount of surplus or supercooled energy from a difference between the two energy amounts, and heats or cools the transfer unit based on the amount of surplus or supercooled energy.

Abstract: A fine structure formation apparatus includes a preheating heater to heat up the surface of belt-like mold alone, right before contacting the belt-like mold to heating and pressurizing rollers, the temperature of the surface of the belt-like mold is made equal to that of the heating and pressurizing rollers, enabling to reliably obtain a predetermined temperature, and cooling rollers or a cooling blower are arranged right after the heating and pressurizing rollers, enabling cooling by a forced cooling and pressure holding, and to transfer a pattern.

Abstract: A precision press device and a press load control method is provided for downsizing a vacuum chamber in press work in the vacuum chamber, shortening a time required to reach a vacuum and performing high accuracy pressure control. A pressure sensor is set up outside the chamber 16 and a cylinder chamber 17 is formed to allow a tubular plunger 7 to slide up and down. A negative pressure 22 in the chamber 16 attracts the pressurized section 2 and the pressurizing section 1, but by injecting an equivalent pressure 19 of a fluid into the cylinder chamber 17, pushing out the tubular plunger 7, the attractive forces are canceled out.

Abstract: The present invention provides a precision press device and a press load control method thereof for downsizing a vacuum chamber in press work in the vacuum chamber, shortening a time required to reach a vacuum and further performing high accuracy pressure control. To downsize a chamber 16, a pressure sensor is set up outside the chamber 16 and a cylinder chamber 17 is formed to allow a tubular plunger 7 to slide up and down using the tubular shape of the chamber 16. A negative pressure 22 in the chamber 16 attracts the pressurized section 2 and the pressurizing section 1 to each other, but by injecting an equivalent pressure 19 of a fluid into the cylinder chamber 17, pushing out the tubular plunger 7, the attractive forces are canceled out. It is possible to control the load on the substrate or the like transferred by the press stage with high accuracy.

Abstract: Provided are an image synthesizing device and an image synthesizing method wherein a subject is less affected by beam absorption. A diffraction beam intensity and a front diffraction beam intensity actually detected are included in the influence of absorption on a subject (Sa). Yet, assuming that said beams have the attenuation rate which is caused by said beams being absorbed when passing through a subject, the angle of refraction ?0 of the beam when passing through the subject (Sa) is obtained using the diffraction beam intensity and the front diffraction beam intensity which are not affected by attenuation, and which are represented by the aforementioned attenuation rate, front diffraction beam intensity, and diffraction beam intensity; a synthesized image of the subject (Sa) is obtained by means of said angle of refraction ?0.

Abstract: Provided is a pattern transferring apparatus (1A) which presses a belt-shaped mold (2) with a fine convex concave pattern and a transfer target material (3) against each other, releases the mold (2) from the transfer target material (3), thereby to transfer the convex concave pattern onto a surface of the transfer target material (3). The apparatus includes a pressing mechanism (4A) that presses the mold (2) and the transfer target material (3) against each other, and a supply mechanism for a mold releasing agent (7), which supplies a mold releasing agent to the mold (2). Accordingly, the pattern transferring apparatus (1A) may need no renewable process of the continuously used mold (2), allowing the excellent mold releasing performance of the mold (2) to be maintained.

Abstract: An iron core annealing furnace that is used in annealing of an amorphous iron core requiring strict control of annealing temperature. There is provided an iron core annealing furnace comprising a furnace body fitted at its superior area with a heat source and a fan, wherein the furnace body has a double layer structure consisting of a furnace interior defined by the inside division wall of the furnace body and an interspace defined by the division wall and the outside wall of the furnace body, and wherein the fan is disposed in the center of a superior area of the furnace body, and wherein the fan is adapted to introduce hot air from the furnace interior of the double layer structure, feed the hot air to the outside of the double layer structure, allow the hot air to enter the furnace interior from an inferior area of the furnace body and heat the iron core, and circulate the hot air.

Abstract: An iron core annealing furnace that is used in annealing of an amorphous iron core requiring strict control of annealing temperature. There is provided an iron core annealing furnace comprising a furnace body fitted at its superior area with a heat source and a fan, wherein the furnace body has a double layer structure consisting of a furnace interior defined by the inside division wall of the furnace body and an interspace defined by the division wall and the outside wall of the furnace body, and wherein the fan is disposed in the center of a superior area of the furnace body, and wherein the fan is adapted to introduce hot air from the furnace interior of the double layer structure, feed the hot air to the outside of the double layer structure, allow the hot air to enter the furnace interior from an inferior area of the furnace body and heat the iron core, and circulate the hot air.

Abstract: A fine structure formation apparatus includes a preheating heater to heat up the surface of belt-like mold alone, right before contacting the belt-like mold to heating and pressurizing rollers, the temperature of the surface of the belt-like mold is made equal to that of the heating and pressurizing rollers, enabling to reliably obtain a predetermined temperature, and cooling rollers or a cooling blower are arranged right after the heating and pressurizing rollers, enabling cooling by a forced cooling and pressure holding, and to transfer a pattern.

Abstract: A method and apparatus for controlling heating and cooling of a transfer unit in a precision hot press device capable of suppressing overheating and supercooling, and of performing quick heating and cooling, wherein the method and apparatus compares an amount of energy (amount of heat) given to the transfer unit or taken from the transfer unit by a heating unit or a cooling unit with an amount of energy observed to enter into or exit from the transfer unit before the temperature of the transfer unit reaches a target temperature, calculates an amount of surplus or supercooled energy from a difference between the two energy mounts, and heats or cools the transfer unit based on the amount of surplus or supercooled energy.

Abstract: The present invention provides a precision press device and a press load control method thereof for downsizing a vacuum chamber in press work in the vacuum chamber, shortening a time required to reach a vacuum and further performing high accuracy pressure control. To downsize a chamber 16, a pressure sensor is set up outside the chamber 16 and a cylinder chamber 17 is formed to allow a tubular plunger 7 to slide up and down using the tubular shape of the chamber 16. A negative pressure 22 in the chamber 16 attracts the pressurized section 2 and the pressurizing section 1 to each other, but by injecting an equivalent pressure 19 of a fluid into the cylinder chamber 17, pushing out the tubular plunger 7, the attractive forces are canceled out. It is possible to control the load on the substrate or the like transferred by the press stage with high accuracy.

Abstract: An iron core annealing furnace that is used in annealing of an amorphous iron core requiring strict control of annealing temperature. There is provided an iron core annealing furnace comprising a furnace body fitted at its superior area with a heat source and a fan, wherein the furnace body has a double layer structure consisting of a furnace interior defined by the inside division wall of the furnace body and an interspace defined by the division wall and the outside wall of the furnace body, and wherein the fan is disposed in the center of a superior area of the furnace body, and wherein the fan is adapted to introduce hot air from the furnace interior of the double layer structure, feed the hot air to the outside of the double layer structure, allow the hot air to enter the furnace interior from an inferior area of the furnace body and heat the iron core, and circulate the hot air.