Abstract: There is provided a bidirectional optical communication module including a bidirectional optical communication chip configured to include an optical circuit board in which a light receiving element constituting a receiving section, a transmitting element constituting a transmitting section, and a wavelength-division multiplexing (WDM) filter that divides transmission signal light and reception signal light from each other are hybrid-integrated, a reflecting section configured to direct a propagation direction of the transmission signal light output from the transmitting section and the reception signal light received by the receiving section to a direction orthogonal to the optical circuit board, and an optical coupling element configured to spatially optically-couple an input-output port for the transmission signal light and the reception signal light provided at the bidirectional optical communication chip to an input-output port of an optical fiber.

Abstract: There is provided a bidirectional optical communication module including a bidirectional optical communication chip configured to include an optical circuit board in which a light receiving element constituting a receiving section, a transmitting element constituting a transmitting section, and a wavelength-division multiplexing (WDM) filter that divides transmission signal light and reception signal light from each other are hybrid-integrated, a reflecting section configured to direct a propagation direction of the transmission signal light output from the transmitting section and the reception signal light received by the receiving section to a direction orthogonal to the optical circuit board, and an optical coupling element configured to spatially optically-couple an input-output port for the transmission signal light and the reception signal light provided at the bidirectional optical communication chip to an input-output port of an optical fiber.

Abstract: An optical bidirectional communication module includes a light-emitting element, a light-receiving element and an optical waveguide. The optical waveguide performs wavelength division on light received from an optical fiber and guides the received light to the light-receiving element. The optical waveguide also performs wavelength division on light emitted from the light-emitting element and guides the emitted light to the optical fiber. The light-emitting element, the light-receiving element and the optical waveguide are incorporated on an optical substrate.

Abstract: An optical bidirectional communication module includes a light-emitting element, a light-receiving element and an optical waveguide. The optical waveguide performs wavelength division on light received from an optical fiber and guides the received light to the light-receiving element. The optical waveguide also performs wavelength division on light emitted from the light-emitting element and guides the emitted light to the optical fiber. The light-emitting element, the light-receiving element and the optical waveguide are incorporated on an optical substrate.

Abstract: A new and improved optical element manufacturing method, through which lens elements can be efficiently mounted on a silicon V-shaped groove substrate at lower manufacturing costs, is provided. The method comprises a lens element forming step in which an oxide layer 104 is formed at a supporting layer 102 and lens elements 120 are formed at the upper surface of the silicon oxide film, a coating step in which a solder connection metal film is coated onto the side surfaces of the lens elements and a separating step in which the lens elements are separated by removing the silicon oxide film. Through this method, the solder connection metal film can be formed with ease at the sidewalls of the lens elements. The lens elements with the solder connection metal film formed at the side walls thereof can easily be soldered onto a supporting substrate.

Abstract: A new and improved optical element manufacturing method, through which lens elements can be efficiently mounted on a silicon V-shaped groove substrate at lower manufacturing costs, is provided. The method comprises a lens element forming step in which an oxide layer 104 is formed at a supporting layer 102 and lens elements 120 are formed at the upper surface of the silicon oxide film, a coating step in which a solder connection metal film is coated onto the side surfaces of the lens elements and a separating step in which the lens elements are separated by removing the silicon oxide film. Through this method, the solder connection metal film can be formed with ease at the sidewalls of the lens elements. The lens elements with the solder connection metal film formed at the side walls thereof can easily be soldered onto a supporting substrate.