Abstract: Providing a core ball wherein a junction melting temperature and a low alpha dose are set for suppressing a soft error generation and solving a mounting problem. A metallic powder as a core is a sphere. A pure degree of a Cu ball of the metallic powder is equal to or higher than 99.9% but equal to or less than 99.995%. A contained amount of one of Pb and Bi or a total contained amount of Pb and Bi is equal to or higher than 1 ppm. A sphericity of the Cu ball is equal to or higher than 0.95. A solder plating film for coating the Cu ball comprises Sn—Bi based alloy. U contained in the solder plating film is equal to or less than 5 ppb and Th is equal to or less than 5 ppb. An alpha dose of the core ball is equal to or less than 0.0200 cph/cm2.

Abstract: Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.

Abstract: A Cu core ball suppresses a soft error and its alpha dose is low. Its surface roughness does not affect a mounting process. A pure degree of the Cu ball as an internal ball is equal to or larger than 99.9% and equal to or less than 95%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is equal to or higher than 0.95. A solder plating film coated on the Cu ball is a Sn solder plating film or a solder plating film comprising a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is equal to or less than 5 ppb and that of Th is equal to or less than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is equal to or less than 0.0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 ?m.

Abstract: A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and yellowing. A solder alloy according to the present invention consists essentially of, in mass percent, (1) Ag: 0.8-2.0%, (2) Cu: 0.05-0.3%, (3) at least one element selected from In: at least 0.01% and less than 0.1%, Ni; 0.01-0.04%, Co: 0.01-0.05%, and Pt: 0.01-0.1%, optionally (4) at least one element selected from Sb, Bi, Fe, Al, Zn, and P in a total amount of up to 0.1%, and a remainder of Sn and impurities.

Abstract: A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and yellowing. A solder alloy according to the present invention consists essentially of, in mass percent, (1) Ag: 0.8-2.0%, (2) Cu: 0.05-0.3%, (3) at least one element selected from In: at least 0.01% and less than 0.1%, Ni; 0.01-0.04%, Co: 0.01-0.05%, and Pt: 0.01-0.1%, optionally (4) at least one element selected from Sb, Bi, Fe, Al, Zn, and P in a total amount of up to 0.1%, and a remainder of Sn and impurities.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.

Abstract: A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60-64 mass % of Sn, 0.002-0.01 mass % of P, 0.04-0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.

Abstract: An image recording and replaying apparatus has a main unit. A collapsible liquid crystal display monitor is provided on a side of the main unit and is detachable from the main unit. An operating unit is provided on an upper side of the main unit and is also detachable from the main unit. The main unit includes a control signal receiving unit that receives control signals from the operating unit and an image signal transmission unit that transmits image signals to the monitoring unit for displaying images.