Abstract: A relay system includes a transmission device and a reception device. The transmission device includes: a first optical transmitter that converts a first signal to a first optical signal having a transmission speed equal to that of the first signal, and transmits the first optical signal; a data separator that converts the first signal to a plurality of low-rate signals having a lower speed than the first signal; a plurality of second optical transmitters each capable of converting the low-rate signals to low-rate optical signals and transmitting the optical signals, and converting a second signal to a second optical signal having a transmission speed equal to that of the second signal and transmitting the optical signal; and a multiplexer that multiplexes a plurality of optical signals selected from among the first optical signal, the low-rate optical signals, and the second optical signal, and outputs a multiplexed optical signal.

Abstract: The present invention provides an industrially desirable production method for a sulfone derivative that is useful as a herbicide, and an intermediate thereof.

Abstract: A wiring substrate includes a first substrate including a wiring layer and a solder resist layer that partially covers the wiring layer. The solder resist layer includes a circular opening partially exposing the wiring layer and a support partially covering the wiring layer within the opening. The wiring layer includes a first connection pad exposed in the opening and formed by a portion of the wiring layer located at an outer side of the support. The wiring substrate further includes a cylindrical connection pin and a bonding member that bonds a first end surface of the connection pin and the first connection pad located in the opening.

Abstract: A wiring substrate includes a first substrate including a wiring layer and a solder resist layer that partially covers the wiring layer. The solder resist layer includes a circular opening partially exposing the wiring layer and a support partially covering the wiring layer within the opening. The wiring layer includes a first connection pad exposed in the opening and formed by a portion of the wiring layer located at an outer side of the support. The wiring substrate further includes a cylindrical connection pin and a bonding member that bonds a first end surface of the connection pin and the first connection pad located in the opening.

Abstract: A wiring board includes: a connection pad; an insulating layer that covers the connection pad and has an opening portion exposing a portion of the connection pad; and a metal pin that is disposed on the insulating layer and that is connected to the connection pad through a metal bonding material provided in the opening portion. The opening portion includes a main opening portion, and a plurality of protrusive opening portions that communicate with the main opening portion and that protrude outward from an outer circumference of the main opening portion. An outer circumference of a lower end surface of the metal pin, which is opposed to the insulating layer, is located outside the outer circumference of the main opening portion.

Abstract: A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.

Abstract: A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.

Abstract: A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and connection terminals. The main body includes opposing first side surfaces, opposing second side surfaces, and opposing third side surfaces. The connection terminals cover the first side surfaces. First projections project from walls of the through hole toward the first side surfaces. Each first projection includes a distal end that contacts one of the connection terminals. Second projections project from walls of the through hole toward the second side surfaces. The opposing second projections include distal ends spaced apart by a distance longer than the distance between the second side surfaces and shorter than the distance between two farthest points on a periphery of each first side surface.

Abstract: A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and connection terminals. The main body includes opposing first side surfaces, opposing second side surfaces, and opposing third side surfaces. The connection terminals cover the first side surfaces. First projections project from walls of the through hole toward the first side surfaces. Each first projection includes a distal end that contacts one of the connection terminals. Second projections project from walls of the through hole toward the second side surfaces. The opposing second projections include distal ends spaced apart by a distance longer than the distance between the second side surfaces and shorter than the distance between two farthest points on a periphery of each first side surface.

Abstract: A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.

Abstract: A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.