Patents by Inventor Daisuke Terada

Daisuke Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260125659
    Abstract: Provided are a mutant glycosyltransferase having 80% or more sequence identity with an amino acid sequence set forth in SEQ ID NO: 1, in which the mutant glycosyltransferase is capable of forming an anthraquinone C-glycoside from an anthraquinone compound and a monosaccharide donor; a method for producing the same; a nucleic acid; a vector; a host cell; a composition; and a method for producing an anthraquinone C-glycoside.
    Type: Application
    Filed: September 9, 2025
    Publication date: May 7, 2026
    Inventors: Motomasa TAKAHASHI, Takayuki YAMAKAWA, Daisuke TERADA, Yuki SONODA, Tomoki OTA
  • Patent number: 12040056
    Abstract: The present invention provides a method for evaluating a synthetic aptitude of a compound, a program for evaluating a synthetic aptitude of a compound, and a device for evaluating a synthetic aptitude of a compound, which evaluate a synthetic aptitude of a compound generated and/or modified on a computer.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: July 16, 2024
    Assignee: FUJIFILM Corporation
    Inventors: Jun Nakabayashi, Daisuke Terada
  • Patent number: 12005954
    Abstract: A steering column device includes: a link mechanism pivotably supported with respect to a fixing bracket about a first pivot shaft, which is perpendicular to a center axis PC of a steering shaft and is positioned further toward an upper side of a vehicle than the center axis PC, and pivotably supported with respect to a column jacket about a second pivot shaft, which is positioned further toward the upper side of the vehicle than the center axis PC; and a drive mechanism connected to the link mechanism to drive the link mechanism, thereby adjusting a tilt angle of the steering shaft. A sliding member includes a shaft member engaged in an elongated hole which is provided in a portion of the link mechanism which is near the second pivot shaft, and the shaft member is pivotably supported in the elongated hole and fixed to the column jacket.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: June 11, 2024
    Assignee: JTEKT COLUMN SYSTEMS CORPORATION
    Inventors: Daisuke Terada, Takeshi Miyagi
  • Publication number: 20230347968
    Abstract: A steering column device includes: a link mechanism pivotably supported with respect to a fixing bracket about a first pivot shaft, which is perpendicular to a center axis PC of a steering shaft and is positioned further toward an upper side of a vehicle than the center axis PC, and pivotably supported with respect to a column jacket about a second pivot shaft, which is positioned further toward the upper side of the vehicle than the center axis PC; and a drive mechanism connected to the link mechanism to drive the link mechanism, thereby adjusting a tilt angle of the steering shaft. A sliding member includes a shaft member engaged in an elongated hole which is provided in a portion of the link mechanism which is near the second pivot shaft, and the shaft member is pivotably supported in the elongated hole and fixed to the column jacket.
    Type: Application
    Filed: May 21, 2021
    Publication date: November 2, 2023
    Inventors: Daisuke TERADA, Takeshi MIYAGI
  • Patent number: 11555229
    Abstract: An aluminum alloy additive manufacturing product and a method manufactures the same. The aluminum alloy additive manufacturing product is formed by molding a raw metal by an additive manufacturing method. The raw metal is made of an aluminum alloy. The aluminum alloy contains Fe and one or more of Mn and Cr. The Fe is an inevitable impurity of 0.3 weight % or less. The one or more of Mn and Cr have a total weight of 0.3 to 10 weight %. The aluminum alloy additive manufacturing product contains any one or more of an intermetallic compound and an aluminum alloy solid solution. The intermetallic compound contains two or more of Al, Mn, Fe, and Cr. One or more elements of Mn, Fe, and Cr are dissolved in the aluminum alloy solid solution.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: January 17, 2023
    Assignees: KOIWAI CO., LTD., TOYO ALUMINUM KABUSHIKI KAISHA
    Inventors: Mitsuru Adachi, Jun Kusui, Daisuke Terada, Hideharu Nakashima, Masatoshi Mitsuhara, Shigeto Yamasaki
  • Patent number: 11262266
    Abstract: A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 1, 2022
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Tomonari Misawa, Daisuke Terada, Hiroshi Onuki
  • Patent number: 11143563
    Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 12, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Daisuke Terada, Hiroshi Onuki, Takuya Aoyagi
  • Publication number: 20210193272
    Abstract: The present invention provides a method for evaluating a synthetic aptitude of a compound, a program for evaluating a synthetic aptitude of a compound, and a device for evaluating a synthetic aptitude of a compound, which evaluate a synthetic aptitude of a compound generated and/or modified on a computer.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Jun NAKABAYASHI, Daisuke TERADA
  • Patent number: 10989284
    Abstract: A steering column device includes a male screw shaft member supported by an outer column and a female screw member provided in a link member. The female screw member and the male screw shaft member are moved relative to each other by rotation of the male screw shaft member, causing the link member to swing relative to the outer column. The female screw member includes a main body section supported by the link member, a fragile section provided on one side of the main body section, and a screw engaging section provided on the opposite side of the fragile section from the main body section. In a state where an adjust nut is screwed to the screw engaging section, a distal end portion of the adjust nut comes into contact with the main body section and extends the fragile section in the axial direction of the male screw shaft member.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: April 27, 2021
    Assignee: FUJI KIKO CO., LTD.
    Inventor: Daisuke Terada
  • Patent number: 10788385
    Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: September 29, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takuya Aoyagi, Takashi Naitou, Tatsuya Miyake, Mizuki Shibata, Hiroshi Onuki, Daisuke Terada, Shigenobu Komatsu
  • Patent number: 10654510
    Abstract: An electric steering column apparatus includes a pressing mechanism for reducing the play between an outer jacket and an inner jacket. A pressing mechanism has a first pressing portion disposed on the outer jacket and pressing a lower surface of the inner jacket upward and a second pressing portion disposed on an axially front end side of the outer jacket and pressing an upper surface of the inner jacket downward. A tubular member housing a telescopic nut is disposed between the first pressing portion and the second pressing portion in an axial direction so as to face the second pressing portion in an up-down direction and fixed to the lower surface of the inner jacket.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: May 19, 2020
    Assignee: FUJI KIKO CO., LTD.
    Inventors: Kyoichi Inoue, Takeshi Miyagi, Daisuke Terada, Tomoya Ohashi
  • Publication number: 20200063241
    Abstract: An aluminum alloy additive manufacturing product and a method manufactures the same. The aluminum alloy additive manufacturing product is formed by molding a raw metal by an additive manufacturing method. The raw metal is made of an aluminum alloy. The aluminum alloy contains Fe and one or more of Mn and Cr. The Fe is an inevitable impurity of 0.3 weight % or less. The one or more of Mn and Cr have a total weight of 0.3 to 10 weight %. The aluminum alloy additive manufacturing product contains any one or more of an intermetallic compound and an aluminum alloy solid solution. The intermetallic compound contains two or more of Al, Mn, Fe, and Cr. One or more elements of Mn, Fe, and Cr are dissolved in the aluminum alloy solid solution.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Applicants: KOIWAI CO., LTD., TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Mitsuru ADACHI, Jun KUSUI, Daisuke TERADA, Hideharu NAKASHIMA, Masatoshi MITSUHARA, Shigeto YAMASAKI
  • Publication number: 20200064218
    Abstract: There is provided a pressure detecting device whose number of connection points and number of parts are small. A pressure detecting device 100 includes a sensor unit 30 which includes a strain detecting element which detects a strain amount of a pressure receiving surface 11p strained when receiving a pressure, and a processing circuit which processes a signal from the strain detecting element, and includes a housing 10 which houses the sensor unit 30, and terminals 20a and 20c which are connected to the sensor unit 30 and part of which is exposed retractably from the housing 10, and the terminals 20a and 20c include spring mechanisms 22a and 22c which are provided in the housing 10 and can elastically deform.
    Type: Application
    Filed: October 25, 2017
    Publication date: February 27, 2020
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroshi ONUKI, Daisuke TERADA, Takuya AOYAGI
  • Publication number: 20190376866
    Abstract: A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.
    Type: Application
    Filed: November 17, 2017
    Publication date: December 12, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Tomonari MISAWA, Daisuke TERADA, Hiroshi ONUKI
  • Publication number: 20190368957
    Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.
    Type: Application
    Filed: January 30, 2018
    Publication date: December 5, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Daisuke TERADA, Hiroshi ONUKI, Takuya AOYAGI
  • Publication number: 20190371759
    Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.
    Type: Application
    Filed: January 24, 2018
    Publication date: December 5, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takuya AOYAGI, Mizuki IJUIN, Daisuke TERADA, Hiroshi ONUKI, Shigenobu KOMATSU, Takashi NAITOU, Tatsuya MIYAKE
  • Publication number: 20190301574
    Abstract: A steering column device includes a male screw shaft member supported by an outer column and a female screw member provided in a link member. The female screw member and the male screw shaft member are moved relative to each other by rotation of the male screw shaft member, causing the link member to swing relative to the outer column. The female screw member includes a main body section supported by the link member, a fragile section provided on one side of the main body section, and a screw engaging section provided on the opposite side of the fragile section from the main body section. In a state where an adjust nut is screwed to the screw engaging section, a distal end portion of the adjust nut comes into contact with the main body section and extends the fragile section in the axial direction of the male screw shaft member.
    Type: Application
    Filed: March 13, 2019
    Publication date: October 3, 2019
    Inventor: Daisuke TERADA
  • Patent number: 10339645
    Abstract: Provided is a defect detection device capable of measuring the volume of surface defects. The defect detection device includes: an imaging device configured to image an image of an inspection object; a binarization processing unit configured to subject the image to first and second binarization processing by use of different first and second binarization thresholds, so as to calculate first and second sizes for an identical defect in the image; a ratio calculation unit configured to calculate a first ratio of the second size to the first size; and a depth determination unit configured to determine a depth of the defect depending on the first ratio.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 2, 2019
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Hirohisa Shibayama, Eiji Shiotani, Satoru Sakurai, Kiyokazu Sugiyama, Akira Shimizu, Daisuke Terada, Yoshitsugu Noshi, Yoshito Utsumi
  • Publication number: 20190128758
    Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.
    Type: Application
    Filed: April 13, 2017
    Publication date: May 2, 2019
    Inventors: Takuya AOYAGI, Takashi NAITOU, Tatsuya MIYAKE, Mizuki SHIBATA, Hiroshi ONUKI, Daisuke TERADA, Shigenobu KOMATSU
  • Patent number: 10247630
    Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 2, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hanae Shimokawa, Shosaku Ishihara, Atsuo Soma, Junji Onozuka, Hiroshi Onuki, Daisuke Terada, Mizuki Shibata