Abstract: There is provided a conductive adhesive comprising silver particles dispersed in a solvent, the silver particles having good flowability, and excellent shape stability after being applied to a member and before being sintered. Silver particles dispersed in a solvent, in which a compound represented by the following formula (1) is adhered to a surface of the silver particles, wherein R1 is a C1-5 alkyl group, and R2 is a hydrogen atom or a C1-5 alkyl group, and when a concentration of the silver particles in the solvent is 50% by mass, a value of SPAN as measured by a photocentrifuge method under the following conditions is 0.1 or more and 5.0 or less: SPAN:(V90?V10)/V50??Equation (1), wherein when a sedimentation velocity is expressed by a cumulative distribution, V10 is the sedimentation velocity at a cumulative value of 10%; V90 is the sedimentation velocity at a cumulative value of 90%; and V50 (median sedimentation velocity) is the sedimentation velocity at a cumulative value of 50%.

Abstract: There is provided a conductive adhesive comprising silver particles dispersed in a solvent, the silver particles having good flowability, and excellent shape stability after being applied to a member and before being sintered. Silver particles dispersed in a solvent, in which an amine compound is adhered to a surface of the silver particles, and when a concentration of the silver particles in the solvent is 50% by mass, a value of SPAN as measured by a photocentrifuge method under predetermined conditions is 0.1 or more and 3.3 or less: SPAN: (V90?V10)/V50 Equation (1), wherein when a sedimentation velocity is expressed by a cumulative distribution, V10 is the sedimentation velocity at a cumulative value of 10%; V90 is the sedimentation velocity at a cumulative value of 90%; and V50 (median sedimentation velocity) is the sedimentation velocity at a cumulative value of 50%.