Patents by Inventor Daisuke Toriya
Daisuke Toriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11466365Abstract: There is provided a film-forming apparatus including: a processing container, wherein a reaction gas is supplied into the processing container; a stage disposed inside the processing container and provided with a substrate heating part, the stage being configured to place a substrate thereon; a support member configured to support the stage from a rear surface of the stage, wherein the rear surface faces a placement surface on which the substrate is placed; a temperature control member disposed on the rear surface of the stage and including a hollow portion formed to cover the support member, the temperature control member configured to have a controllable temperature; a heat-insulating member disposed between the stage and the temperature control member; and a purge gas supply part configured to supply a purge gas to a first gap formed between the support member and the temperature control member.Type: GrantFiled: June 28, 2019Date of Patent: October 11, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Daisuke Toriya, Toshiaki Fujisato, Yuichi Furuya
-
Patent number: 11441224Abstract: A method of controlling a substrate processing apparatus that includes a stage, an annular member, a gas introduction mechanism, an exhaust part and a heat transfer gas introduction supply/exhaust part, the method including: mounting a substrate on the stage, and mounting the annular member on the substrate to press the substrate; creating a pressure of a heat transfer gas to be supplied into a space formed between a rear surface of the substrate and a front surface of the stage using the heat transfer gas supply/exhaust part; supplying the heat transfer gas into the space from the heat transfer gas supply/exhaust part; introducing the gas from the gas introduction mechanism into a container; exhausting the heat transfer gas from the space through an orifice; subsequently, exhausting the heat transfer gas from the space; and removing the annular member from the substrate.Type: GrantFiled: January 29, 2020Date of Patent: September 13, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Daisuke Toriya, Yuichi Furuya, Toshiaki Fujisato
-
Patent number: 11396704Abstract: A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.Type: GrantFiled: November 27, 2019Date of Patent: July 26, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Toshiaki Fujisato, Takashi Mochizuki, Daisuke Toriya, Kouki Suzuki, Hwajun Noh
-
Patent number: 11281116Abstract: The present invention provides a substrate stage and a substrate processing apparatus that appropriately control a temperature of a staging surface on which a substrate is placed. The substrate stage includes a stage base including a cooling surface therein, and a supply flow path forming member formed of a material having a lower thermal conductivity than that of the stage base and including cooling nozzles configured to spray a coolant toward the cooling surface.Type: GrantFiled: March 17, 2021Date of Patent: March 22, 2022Assignee: Tokyo Electron LimitedInventors: Einosuke Tsuda, Daisuke Toriya, Satoshi Yonekura, Satoshi Takeda, Motoshi Fukudome, Kyoko Ikeda
-
Patent number: 11280002Abstract: A placement apparatus is provided in the present disclosure. The apparatus includes a stage on which a substrate is placed; a support configured to support the stage from a side of a rear surface of the stage that is opposite to a placement surface on which the substrate is placed; a temperature adjustment member including a plate securing the stage from a lower surface of the stage, a shaft extending downwards from the plate, and a hole accommodating the support through the shaft from the plate, and being capable of a temperature adjustment; a heat-insulating member disposed between the stage and the temperature adjustment member; and an abutment member configured to abut the substrate placed on the stage.Type: GrantFiled: September 18, 2019Date of Patent: March 22, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Kohichi Satoh, Toshiaki Fujisato, Daisuke Toriya
-
Publication number: 20210302846Abstract: The present invention provides a substrate stage and a substrate processing apparatus that appropriately control a temperature of a staging surface on which a substrate is placed. The substrate stage includes a stage base including a cooling surface therein, and a supply flow path forming member formed of a material having a lower thermal conductivity than that of the stage base and including cooling nozzles configured to spray a coolant toward the cooling surface.Type: ApplicationFiled: March 17, 2021Publication date: September 30, 2021Inventors: Einosuke TSUDA, Daisuke TORIYA, Satoshi YONEKURA, Satoshi TAKEDA, Motoshi FUKUDOME, Kyoko IKEDA
-
Publication number: 20210005493Abstract: When performing processing on a substrate in a plasma-free atmosphere, the substrate is reliably attracted to perform processing with high uniformity in the plane of the substrate. An apparatus includes a DC power source and a processing gas supply part. The DC power source has a positive electrode connected to one of an electrode of an electrostatic chuck and a conductive member, and a negative electrode connected to the other of the electrode and the conductive member, and attracts the substrate to a dielectric layer of the electrostatic chuck by electrostatic attraction force generated by applying voltage between the conductive member located at a processing position and the electrode in a state in which plasma is not formed inside a processing container. The processing gas supply part performs processing by supplying a processing gas to the substrate in a state in which the substrate is attracted to the dielectric layer.Type: ApplicationFiled: October 12, 2018Publication date: January 7, 2021Inventors: Toshiaki FUJISATO, Tadahiro ISHIZAKA, Takashi MOCHIZUKI, Daisuke TORIYA
-
Publication number: 20200248306Abstract: A method of controlling a substrate processing apparatus that includes a stage, an annular member, a gas introduction mechanism, an exhaust part and a heat transfer gas introduction supply/exhaust part, the method including: mounting a substrate on the stage, and mounting the annular member on the substrate to press the substrate; creating a pressure of a heat transfer gas to be supplied into a space formed between a rear surface of the substrate and a front surface of the stage using the heat transfer gas supply/exhaust part; supplying the heat transfer gas into the space from the heat transfer gas supply/exhaust part; introducing the gas from the gas introduction mechanism into a container; exhausting the heat transfer gas from the space through an orifice; subsequently, exhausting the heat transfer gas from the space; and removing the annular member from the substrate.Type: ApplicationFiled: January 29, 2020Publication date: August 6, 2020Inventors: Daisuke TORIYA, Yuichi FURUYA, Toshiaki FUJISATO
-
Publication number: 20200165723Abstract: A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.Type: ApplicationFiled: November 27, 2019Publication date: May 28, 2020Inventors: Toshiaki FUJISATO, Takashi MOCHIZUKI, Daisuke TORIYA, Kouki SUZUKI, Hwajun NOH
-
Publication number: 20200095680Abstract: A placement apparatus is provided in the present disclosure. The apparatus includes a stage on which a substrate is placed; a support configured to support the stage from a side of a rear surface of the stage that is opposite to a placement surface on which the substrate is placed; a temperature adjustment member including a plate securing the stage from a lower surface of the stage, a shaft extending downwards from the plate, and a hole accommodating the support through the shaft from the plate, and being capable of a temperature adjustment; a heat-insulating member disposed between the stage and the temperature adjustment member; and an abutment member configured to abut the substrate placed on the stage.Type: ApplicationFiled: September 18, 2019Publication date: March 26, 2020Inventors: Kohichi SATOH, Toshiaki FUJISATO, Daisuke TORIYA
-
Publication number: 20200010956Abstract: There is provided a film-forming apparatus including: a processing container, wherein a reaction gas is supplied into the processing container; a stage disposed inside the processing container and provided with a substrate heating part, the stage being configured to place a substrate thereon; a support member configured to support the stage from a rear surface of the stage, wherein the rear surface faces a placement surface on which the substrate is placed; a temperature control member disposed on the rear surface of the stage and including a hollow portion formed to cover the support member, the temperature control member configured to have a controllable temperature; a heat-insulating member disposed between the stage and the temperature control member; and a purge gas supply part configured to supply a purge gas to a first gap formed between the support member and the temperature control member.Type: ApplicationFiled: June 28, 2019Publication date: January 9, 2020Inventors: Daisuke TORIYA, Toshiaki FUJISATO, Yuichi FURUYA
-
Patent number: 10526702Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.Type: GrantFiled: August 22, 2016Date of Patent: January 7, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Daisuke Toriya, Eiichi Komori, Manabu Amikura
-
Patent number: 10221478Abstract: A film formation device includes: a processing vessel; a mounting stand installed within the processing vessel and configured to mount a substrate thereon; an elevating shaft installed so as to extend in an up-down direction while supporting the mounting stand and connected to an external elevator mechanism through a through-hole formed in the processing vessel; a bellows installed between the processing vessel and the elevator mechanism and configured to cover a periphery of the elevating shaft at a lateral side of the elevating shaft; a lid member disposed so as to surround the elevating shaft with a gap left between a lateral circumferential surface of the elevating shaft and the lid member; and a purge gas supply part configured to supply a purge gas into the bellows so that a gas flow from the bellows toward the processing vessel through the gap is formed.Type: GrantFiled: February 10, 2014Date of Patent: March 5, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Kensaku Narushima, Daisuke Toriya, Kentaro Asakura, Seishi Murakami
-
Patent number: 10156014Abstract: A gas treatment apparatus includes: a mounting part of a substrate; a gas diffusion plate of a processing gas; gas dispersion parts forming a diffusion space of the processing gas between the gas dispersion parts and the gas diffusion plate; and a flow path having an upstream side forming a common flow path of the gas dispersion parts and a downstream side connected to each of the gas dispersion parts, lengths from the common flow path to respective of the gas dispersion parts being aligned, wherein centers of the gas dispersion parts are located around a central portion of the diffusion space, and the gas dispersion parts are arranged along first circles with two or more of the gas dispersion parts arranged on each of the first circles and distances from the central portion of the diffusion space to the centers of gas dispersion parts being different from one another.Type: GrantFiled: December 15, 2017Date of Patent: December 18, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Kakegawa, Yuichi Furuya, Daisuke Toriya
-
Patent number: 10094019Abstract: A film forming apparatus that includes a mounting table for loading a wafer, a encompassing member surrounding the mounting table and dividing an inside of a process container, an exhaust part that vacuum exhausts the process container, a clamp ring loaded upon an upper space of the encompassing member and lifted from the upper space of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer loaded on the mounting table, and a cylindrical wall extended downward from the clamp ring, formed along a circumference of the clamp ring into a cylinder shape, and positioned between an outer circumference surface of the mounting table and an inner circumference surface of the encompassing member.Type: GrantFiled: November 7, 2013Date of Patent: October 9, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Daisuke Toriya, Eiichi Komori, Manabu Amikura
-
Publication number: 20180171478Abstract: A gas treatment apparatus includes: a mounting part of a substrate; a gas diffusion plate of a processing gas; gas dispersion parts forming a diffusion space of the processing gas between the gas dispersion parts and the gas diffusion plate; and a flow path having an upstream side forming a common flow path of the gas dispersion parts and a downstream side connected to each of the gas dispersion parts, lengths from the common flow path to respective of the gas dispersion parts being aligned, wherein centers of the gas dispersion parts are located around a central portion of the diffusion space, and the gas dispersion parts are arranged along first circles with two or more of the gas dispersion parts arranged on each of the first circles and distances from the central portion of the diffusion space to the centers of gas dispersion parts being different from one another.Type: ApplicationFiled: December 15, 2017Publication date: June 21, 2018Inventors: Takashi KAKEGAWA, Yuichi FURUYA, Daisuke TORIYA
-
Publication number: 20160355928Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.Type: ApplicationFiled: August 22, 2016Publication date: December 8, 2016Inventors: Daisuke TORIYA, Eiichi KOMORI, Manabu AMIKURA
-
Publication number: 20160083837Abstract: A film formation device includes: a processing vessel; a mounting stand installed within the processing vessel and configured to mount a substrate thereon; an elevating shaft installed so as to extend in an up-down direction while supporting the mounting stand and connected to an external elevator mechanism through a through-hole formed in the processing vessel; a bellows installed between the processing vessel and the elevator mechanism and configured to cover a periphery of the elevating shaft at a lateral side of the elevating shaft; a lid member disposed so as to surround the elevating shaft with a gap left between a lateral circumferential surface of the elevating shaft and the lid member; and a purge gas supply part configured to supply a purge gas into the bellows so that a gas flow from the bellows toward the processing vessel through the gap is formed.Type: ApplicationFiled: February 10, 2014Publication date: March 24, 2016Inventors: Kensaku NARUSHIMA, Daisuke TORIYA, Kentaro ASAKURA, Seishi MURAKAMI
-
Publication number: 20140130743Abstract: A film forming apparatus that includes a mounting table for loading a wafer, a encompassing member surrounding the mounting table and dividing an inside of a process container, an exhaust part that vacuum exhausts the process container, a clamp ring loaded upon an upper space of the encompassing member and lifted from the upper space of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer loaded on the mounting table, and a cylindrical wall extended downward from the clamp ring, formed along a circumference of the clamp ring into a cylinder shape, and positioned between an outer circumference surface of the mounting table and an inner circumference surface of the encompassing member.Type: ApplicationFiled: November 7, 2013Publication date: May 15, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Daisuke TORIYA, Eiichi KOMORI, Manabu AMIKURA
-
Patent number: 8334481Abstract: A mounting table body made of ceramic includes power-receiving conductor portions and buried therein. A surface of mounting table body is formed with a recessed connection hole and a connection terminal electrically jointed to the power-receiving conductor portion and exposed into the connection hole, the connection terminal being made of a high-melting-point metal, an alloy thereof or a compound thereof. A power-feeding line member provided with a power-feeding connector portion is inserted at its leading end portion into the connection hole to feed electricity to the power-receiving conductor portion. A stress relaxing member is interposed between the connection terminal and the power-feeding connector portion. The stress relaxing member and the connection terminal are jointed together by a brazing material. The stress relaxing member is made of a metal free from cobalt and nickel or an alloy thereof.Type: GrantFiled: July 17, 2009Date of Patent: December 18, 2012Assignee: Tokyo Electron LimitedInventors: Tomohito Komatsu, Hirohiko Yamamoto, Daisuke Toriya