Patents by Inventor Daisuke Tottori

Daisuke Tottori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating resin material and multilayer substrate
    Patent number: 9382445
    Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: July 5, 2016
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tatsushi Hayashi, Tomoki Kunikawa, Reona Yokota, Daisuke Tottori, Kazutaka Shirahase
  • INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE
    Publication number: 20150210884
    Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.
    Type: Application
    Filed: September 3, 2013
    Publication date: July 30, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tatsushi Hayashi, Tomoki Kunikawa, Reona Yokota, Daisuke Tottori, Kazutaka Shirahase