Patents by Inventor Daisuke Ueyama

Daisuke Ueyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11172571
    Abstract: A multipiece element storage package of the present disclosure includes: a mother substrate which includes first element storage package regions, second element storage package regions, a dummy region, a first surface, and a second surface; a first stem electrode disposed in a part of the dummy region which part is in the first surface; and a second stem electrode disposed on the second surface. The first element storage package regions and the second element storage package regions each include a frame body disposed on the first surface, a first wiring conductor disposed on the first surface, and including one end located inside the frame body and the other end connected to the first stem electrode, and a second wiring conductor including one end which is located on the first surface and inside the frame body and the other end which is connected to the second stem electrode.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: November 9, 2021
    Assignee: KYOCERA Corporation
    Inventors: Daisuke Ueyama, Chiaki Doumoto
  • Publication number: 20210007219
    Abstract: A multipiece element storage package of the present disclosure includes: a mother substrate which includes first element storage package regions, second element storage package regions, a dummy region, a first surface, and a second surface; a first stem electrode disposed in a part of the dummy region which part is in the first surface; and a second stem electrode disposed on the second surface. The first element storage package regions and the second element storage package regions each include a frame body disposed on the first surface, a first wiring conductor disposed on the first surface, and including one end located inside the frame body and the other end connected to the first stem electrode, and a second wiring conductor including one end which is located on the first surface and inside the frame body and the other end which is connected to the second stem electrode.
    Type: Application
    Filed: February 14, 2019
    Publication date: January 7, 2021
    Inventors: Daisuke UEYAMA, Chiaki DOUMOTO
  • Patent number: 10703855
    Abstract: A resin composition containing: an epoxy resin (A) represented by the following formula (1); and a cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: July 7, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shota Koga, Daisuke Ueyama, Kentaro Takano
  • Patent number: 10689496
    Abstract: The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 23, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Nakazumi, Daisuke Ueyama, Kentaro Takano
  • Publication number: 20190260179
    Abstract: A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.
    Type: Application
    Filed: February 14, 2019
    Publication date: August 22, 2019
    Applicant: KYOCERA Corporation
    Inventors: Daisuke UEYAMA, Chiaki DOUMOTO, Takeshi KAMIKAWA
  • Publication number: 20190153177
    Abstract: The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
    Type: Application
    Filed: August 23, 2017
    Publication date: May 23, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro NAKAZUMI, Daisuke UEYAMA, Kentaro TAKANO
  • Publication number: 20190023832
    Abstract: A resin composition containing: an epoxy resin (A) represented by the following formula (1); and a cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
    Type: Application
    Filed: September 1, 2017
    Publication date: January 24, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shota KOGA, Daisuke UEYAMA, Kentaro TAKANO
  • Patent number: 10151045
    Abstract: A method for producing a crystal, according to the present invention, where the lower surface 4B of a seed crystal 4 which is rotatably arranged and made of silicon carbide is brought into contact with a solution 5 of silicon solvent containing carbon in a crucible 6 which is rotatably arranged and the seed crystal 4 is pulled up and a crystal of silicon carbide is grown from the solution 5 on the lower surface 4B of the seed crystal 4, comprising the steps of bringing the lower surface 4B of the seed crystal 4 into contact with the solution 5 in a contact step, rotating the seed crystal 4 in a seed crystal rotation step, rotating the crucible 6 in a crucible rotation step, and stopping rotation of the crucible 6, while the seed crystal 4 is rotated in the state in which the lower surface 4B of the seed crystal 4 is in contact with the solution 5, in a deceleration step.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: December 11, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Chiaki Domoto, Katsuaki Masaki, Yutaka Kuba, Daisuke Ueyama, Kouji Miyamoto, Yuuichiro Hayashi
  • Patent number: 10138393
    Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: November 27, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu
  • Patent number: 10017660
    Abstract: There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: July 10, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masanobu Sogame, Daisuke Ueyama, Hajime Ohtsuka
  • Publication number: 20180171506
    Abstract: A seed crystal holder according to the present invention for growing a crystal by a solution method, and that includes a seed crystal made of silicon carbide; a holding member above the seed crystal; a bonding agent configured to fix the seed crystal and the holding member; and a sheet member made of carbon which is interposed in the bonding agent in a thickness direction, and which has an outer periphery smaller than an outer periphery of the seed crystal in a plan view.
    Type: Application
    Filed: January 18, 2018
    Publication date: June 21, 2018
    Inventors: Katsuaki MASAKI, Yutaka KUBA, Chiaki DOMOTO, Daisuke UEYAMA, Yuichiro HAYASHI
  • Patent number: 9944787
    Abstract: The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: April 17, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshinori Mabuchi, Yoshihiro Kato
  • Patent number: 9890470
    Abstract: A seed crystal holder according to the present invention for growing a crystal by a solution method, and that includes a seed crystal made of silicon carbide; a holding member above the seed crystal; a bonding agent configured to fix the seed crystal and the holding member; and a sheet member made of carbon which is interposed in the bonding agent in a thickness direction, and which has an outer periphery smaller than an outer periphery of the seed crystal in a plan view.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: February 13, 2018
    Assignee: KYOCERA Corporation
    Inventors: Katsuaki Masaki, Yutaka Kuba, Chiaki Domoto, Daisuke Ueyama, Yuichiro Hayashi
  • Publication number: 20170342592
    Abstract: A method for producing a crystal, according to the present invention, where the lower surface 4B of a seed crystal 4 which is rotatably arranged and made of silicon carbide is brought into contact with a solution 5 of silicon solvent containing carbon in a crucible 6 which is rotatably arranged and the seed crystal 4 is pulled up and a crystal of silicon carbide is grown from the solution 5 on the lower surface 4B of the seed crystal 4, comprising the steps of bringing the lower surface 4B of the seed crystal 4 into contact with the solution 5 in a contact step, rotating the seed crystal 4 in a seed crystal rotation step, rotating the crucible 6 in a crucible rotation step, and stopping rotation of the crucible 6, while the seed crystal 4 is rotated in the state in which the lower surface 4B of the seed crystal 4 is in contact with the solution 5, in a deceleration step.
    Type: Application
    Filed: July 13, 2017
    Publication date: November 30, 2017
    Applicant: KYOCERA Corporation
    Inventors: Chiaki DOMOTO, Katsuaki MASAKI, Yutaka KUBA, Daisuke UEYAMA, Kouji MIYAMOTO, Yuuichiro HAYASHI
  • Patent number: 9777396
    Abstract: A method for producing a crystal, according to the present invention, where the lower surface of a seed crystal which is rotatably arranged and made of silicon carbide is brought into contact with a solution of silicon solvent containing carbon in a crucible which is rotatably arranged and the seed crystal is pulled up and a crystal of silicon carbide is grown from the solution on the lower surface of the seed crystal, comprising the steps of bringing the lower surface of the seed crystal into contact with the solution in a contact step, rotating the seed crystal in a seed crystal rotation step, rotating the crucible in a crucible rotation step, and stopping rotation of the crucible, while the seed crystal is rotated in the state in which the lower surface of the seed crystal is in contact with the solution, in a deceleration step.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: October 3, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Chiaki Domoto, Katsuaki Masaki, Yutaka Kuba, Daisuke Ueyama, Kouji Miyamoto, Yuuichiro Hayashi
  • Patent number: 9775238
    Abstract: The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: September 26, 2017
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Daisuke Ueyama, Masanobu Sogame, Chisato Saito, Yoshinori Mabuchi, Yoshihiro Kato
  • Publication number: 20170170279
    Abstract: A silicon carbide crystal ingot includes first crystal layers and second crystal layers, each being alternately disposed and all containing one of a donor and acceptor, wherein a concentration of the donor or the acceptor that at least one of the second crystal layers has is higher than a concentration of the donor or the acceptor that one of the first crystal layers has, the one of the first crystal layers being in contact with the at least one of the second crystal layers.
    Type: Application
    Filed: February 27, 2015
    Publication date: June 15, 2017
    Inventors: Chiaki DOMOTO, Katsuaki MASAKI, Kazuya SHIBATA, Shigehiko YAMAGUCHI, Daisuke UEYAMA
  • Patent number: 9629239
    Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: April 18, 2017
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hajime Ohtsuka, Daisuke Ueyama, Masanobu Sogame
  • Publication number: 20150344733
    Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.
    Type: Application
    Filed: January 14, 2014
    Publication date: December 3, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Tomo CHIBA, Hiroshi TAKAHASHI, Eisuke SHIGA, Daisuke UEYAMA, Kentaro NOMIZU
  • Publication number: 20150050472
    Abstract: The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.
    Type: Application
    Filed: March 25, 2013
    Publication date: February 19, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshinori Mabuchi, Yoshihiro Kato