Patents by Inventor Daisuke Ujihara

Daisuke Ujihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-diamagnetic material composite structure
    Patent number: 8704362
    Abstract: A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic material 22 and a resin 24 in a mold 30, applying a magnetic field to the diamagnetic material 22 disposed in the mold 30, and moving the diamagnetic material 22 in a direction away from at least a part of an inner surface of the mold 30, and then curing the resin 24 in the mold 30 thereby to produce a resin-diamagnetic material composite structure.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: April 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Masanori Minamio, Daisuke Ujihara, Hiroshi Wada
  • RESIN-DIAMAGNETIC MATERIAL COMPOSITE STRUCTURE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20130049187
    Abstract: A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic material 22 and a resin 24 in a mold 30, applying a magnetic field to the diamagnetic material 22 disposed in the mold 30, and moving the diamagnetic material 22 in a direction away from at least a part of an inner surface of the mold 30, and then curing the resin 24 in the mold 30 thereby to produce a resin-diamagnetic material composite structure.
    Type: Application
    Filed: August 22, 2012
    Publication date: February 28, 2013
    Inventors: Masanori MINAMIO, Daisuke Ujihara, Hiroshi Wada