Patents by Inventor Daisuke Uneno

Daisuke Uneno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8418517
    Abstract: A method of manufacturing a pipe coupling that prevents leakage including: forming a semi-tubular portion and flat portions along opposite sides of the semi-tubular portion; deforming the flat portions to produce larger bending depth and smaller width; bending portions of the flat portions so that the bent portions form acute angles in relation to the semi-tubular portion with sloping flat portions extending from the semi-tubular portion, and distal narrow flat portions; pushing the sloping flat portions away from the semi-tubular portion; pressing the semi-tubular portion, the sloping flat portions, and the narrow flat portions to produce a final shape; and removing burrs so that the semi-tubular portion of the final shape comes into close contact with an outer circumferential surface of a pipe, and the final flat portions are integrally formed along opposite side edges of the semi-tubular portion in a common plane.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: April 16, 2013
    Assignee: Showa Denko K.K.
    Inventor: Daisuke Uneno
  • Publication number: 20110005810
    Abstract: An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an electrically conductive material powder, and a stress relaxation layer 4 formed on the other side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an alloy powder or a mixed powder to be formed into a metal composite. The wiring layer 3 is formed of a spark sintered body of a powder selected from the group consisting of an Al powder, a Cu powder, an Ag powder, and an Au powder. The stress relaxation layer 4 is formed of a spark plasma sintered body of a powder selected from the group consisting of an Al—Si alloy powder, a mixed powder of a Cu powder and an Mo powder, a mixed powder of a Cu powder and a W powder, a mixed powder of an Al powder and an SiC powder, and a mixed powder of an Si powder and an SiC powder.
    Type: Application
    Filed: March 19, 2009
    Publication date: January 13, 2011
    Applicant: Showa Denko K.K.
    Inventors: Daisuke Uneno, Koji Hisayuki
  • Publication number: 20100320753
    Abstract: In a first step of this method, a first intermediate product 42 having a coupling portion forming portion 16d and flat portions 21 is produced. In a second step, there is produced a second intermediate product 44 which is larger in the bending depth of the coupling portion forming portion 16d and is smaller in width of the flat portions 21 than the first intermediate product 42. In a third step, a third intermediate product 36 having the coupling portion forming portion 16d, sloping flat portions 34, and narrow flat portions 35 is produced. In a fourth step, the sloping flat portions 34 of the third intermediate product 36 are pressed obliquely upward so as to cause the material to move to the boundaries between the sloping flat portions 35 and the side walls of the coupling portion forming portion 16d, to thereby produce a fourth intermediate product 37.
    Type: Application
    Filed: February 17, 2009
    Publication date: December 23, 2010
    Applicant: SHOWA DENKO K.K.
    Inventor: Daisuke Uneno
  • Publication number: 20090065183
    Abstract: A flat heat transfer tube has upper and lower walls and fluid channels. Two to five inner fins are formed on each of two surfaces of the flat walls facing each fluid channel. The tube height is 1.8 mm or less; the tube width is 20 mm or less; the fluid channel height is 1.0 mm or less; the fluid channel width w1 is 2.0 mm or less; the fluid diameter is 0.3 to 1.2 mm; and the thickness t of each wall is 0.4 mm or less. The ratio h2/t of the fin height h2 to the wall thickness t satisfies the relation 0.5?h2/t?2.0. The ratio p1/w1 of the fin pitch p1 to the fluid channel width w1 satisfies the relation 0.15?p1/w1?1/n (where n is the number of the inner fins formed on one of the two surfaces).
    Type: Application
    Filed: September 3, 2008
    Publication date: March 12, 2009
    Applicant: SHOWA DENKO K.K.
    Inventor: Daisuke Uneno