Patents by Inventor Daisuke YASUI

Daisuke YASUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240227119
    Abstract: Provided is a polishing pad having a high following performance even when a surface to be polished is a curved face. A polishing pad (1) in an embodiment of the present invention includes a polishing layer (2) having a polishing face (21) and a support layer (3) that is formed from a material softer than the polishing layer (2) and is fixed to a face (22) opposite to the polishing face (21) of the polishing layer (2). The support layer (3) has a hardness of not less than 30 and less than 70 in terms of F hardness.
    Type: Application
    Filed: February 25, 2022
    Publication date: July 11, 2024
    Applicant: FUJIMI INCORPORATED
    Inventors: Kyosuke Tenko, Koji Katayama, Daisuke Yasui, Hideharu Hase, Shota Hishida
  • Publication number: 20240182750
    Abstract: Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing. A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.
    Type: Application
    Filed: March 29, 2022
    Publication date: June 6, 2024
    Applicant: FUJIMI INCORPORATED
    Inventors: Kyosuke TENKO, Jun ITO, Daisuke YASUI, Hitoshi MORINAGA
  • Publication number: 20240131654
    Abstract: Provided is a polishing pad having a high following performance even when a surface to be polished is a curved face. A polishing pad (1) in an embodiment of the present invention includes a polishing layer (2) having a polishing face (21) and a support layer (3) that is formed from a material softer than the polishing layer (2) and is fixed to a face (22) opposite to the polishing face (21) of the polishing layer (2). The support layer (3) has a hardness of not less than 30 and less than 70 in terms of F hardness.
    Type: Application
    Filed: February 25, 2022
    Publication date: April 25, 2024
    Applicant: FUJIMI INCORPORATED
    Inventors: Kyosuke Tenko, Koji Katayama, Daisuke Yasui, Hideharu Hase, Shota Hishida
  • Publication number: 20210347007
    Abstract: There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.
    Type: Application
    Filed: September 12, 2019
    Publication date: November 11, 2021
    Applicant: FUJIMI INCORPORATED
    Inventors: Kyosuke TENKO, Shota HISHIDA, Daisuke YASUI, Hideharu HASE, Toru KAMADA
  • Publication number: 20190119523
    Abstract: Provided are a polishing composition, in which oxidation of magnetic particles hardly occurs, and a magnetic polishing method. The polishing composition (1) contains magnetic particles, an antioxidant for suppressing oxidation of the magnetic particles, and water. A magnetic field is applied to the polishing composition (1) to form a magnetic cluster (3) that contains the magnetic particles, and the magnetic cluster (3) is brought into contact with an object (5) to be polished, to polish the object (5) to be polished.
    Type: Application
    Filed: March 23, 2017
    Publication date: April 25, 2019
    Applicant: FUJIMI INCORPORATED
    Inventors: Shuichi TAMADA, Hitoshi MORINAGA, Shota HISHIDA, Daisuke YASUI