Patents by Inventor Daisuke Yoshimi

Daisuke Yoshimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367813
    Abstract: Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 21, 2022
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Seishi Watanabe, Daisuke Yoshimi, Kohei Tai
  • Patent number: 11342832
    Abstract: A driving circuit for a semiconductor circuit which includes a pair of main terminals through which a main current is conducted and a control terminal to which a control voltage is applied to control a circulation state of the main current, includes: driving voltage switching circuitry that receives a control signal, instructs switching between driving voltages based on a change in the control signal, and outputs a driving voltage, among the driving voltages, that has been selected in the switching; low-speed control circuitry that instructs an increase-decrease change in the control voltage at a low speed; speed-increase control circuitry that executes a speed-increase control of increasing a speed of the increase-decrease change made by the low-speed control circuitry; and speed-increase switching circuitry that instructs switching between an execution and a non-execution of the speed-increase control, and instructs switching between levels of a speed-increase change caused by the speed-increase control.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: May 24, 2022
    Assignee: KABUSHIKI KAISHA YASKAWA DENKT
    Inventors: Yu Ujita, Masato Higuchi, Daisuke Yoshimi, Heiji Kaneda
  • Publication number: 20200350813
    Abstract: A driving circuit for a semiconductor circuit which includes a pair of main terminals through which a main current is conducted and a control terminal to which a control voltage is applied to control a circulation state of the main current, includes: driving voltage switching circuitry that receives a control signal, instructs switching between driving voltages based on a change in the control signal, and outputs a driving voltage, among the driving voltages, that has been selected in the switching; low-speed control circuitry that instructs an increase-decrease change in the control voltage at a low speed; speed-increase control circuitry that executes a speed-increase control of increasing a speed of the increase-decrease change made by the low-speed control circuitry; and speed-increase switching circuitry that instructs switching between an execution and a non-execution of the speed-increase control, and instructs switching between levels of a speed-increase change caused by the speed-increase control.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 5, 2020
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yu UJITA, Masato HIGUCHI, Daisuke YOSHIMI, Heiji KANEDA
  • Publication number: 20190198731
    Abstract: Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Seishi WATANABE, Daisuke YOSHIMI, Kohei TAI
  • Patent number: 8981552
    Abstract: This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of the first substrate closer to the power conversion element and a second connection terminal connected to a second conductor pattern arranged on a side of the second substrate opposite to the power conversion element.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: March 17, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Shoichiro Shimoike, Daisuke Yoshimi
  • Publication number: 20120307541
    Abstract: This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of the first substrate closer to the power conversion element and a second connection terminal connected to a second conductor pattern arranged on a side of the second substrate opposite to the power conversion element.
    Type: Application
    Filed: February 20, 2012
    Publication date: December 6, 2012
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Shoichiro SHIMOIKE, Daisuke YOSHIMI
  • Patent number: 7340227
    Abstract: A wireless communication system uses a transmission power detection circuit. The transmission power detection circuit has excellent linearity of detection output for transmission output power and can obtain detection output not having temperature dependence. The transmission power detection circuit has a rectifying detection part that includes plural amplifiers connected in series and obtains detection output by taking out rectified outputs from emitters of input transistors of amplifiers of individual stages and synthesizing them. A compensation voltage generating circuit has a dummy amplifier having a construction similar to the amplifiers constituting the rectifying detection part and a coefficient circuit that changes output of the dummy amplifier at a specified ratio, and generates voltage for compensating temperature characteristics.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: March 4, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Daisuke Yoshimi, Akio Yamamoto, Yutaka Igarashi
  • Publication number: 20050287966
    Abstract: A wireless communication system uses a transmission power detection circuit. The transmission power detection circuit has excellent linearity of detection output for transmission output power and can obtain detection output not having temperature dependence. The transmission power detection circuit has rectifying detection part that includes plural amplifiers connected in series and obtains detection output by taking out rectified outputs from emitters of input transistors of amplifiers of individual stages and synthesizes them. A compensation voltage generating circuit has a dummy amplifier having a construction similar to the amplifiers constituting the rectifying detection part and a coefficient circuit that changes output of the dummy amplifier at a specified ratio, and generates voltage for compensating temperature characteristics.
    Type: Application
    Filed: June 17, 2005
    Publication date: December 29, 2005
    Inventors: Daisuke Yoshimi, Akio Yamamoto, Yutaka Igarashi