Patents by Inventor Daisuke Yoshitome
Daisuke Yoshitome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10041148Abstract: When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.Type: GrantFiled: July 23, 2012Date of Patent: August 7, 2018Assignee: TAIHO KOGYO CO., LTD.Inventors: Hiromi Yokota, Daisuke Yoshitome
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Patent number: 9669461Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.Type: GrantFiled: January 30, 2014Date of Patent: June 6, 2017Assignee: TAIHO KOGYO CO., LTD.Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
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Patent number: 9028582Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.Type: GrantFiled: January 22, 2009Date of Patent: May 12, 2015Assignee: Taiho Kogyo Co., Ltd.Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
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Publication number: 20140147326Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.Type: ApplicationFiled: January 30, 2014Publication date: May 29, 2014Applicant: TAIHO KOGYO CO., LTD.Inventors: Hitoshi WADA, Takashi TOMIKAWA, Daisuke YOSHITOME, Hiromi YOKOTA
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Publication number: 20120294750Abstract: When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.Type: ApplicationFiled: July 23, 2012Publication date: November 22, 2012Inventors: HIROMI YOKOTA, Daisuke Yoshitome
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Patent number: 7883588Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.Type: GrantFiled: June 9, 2005Date of Patent: February 8, 2011Assignees: Taiho Kogyo Co., Ltd., Denso CorporationInventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Hayakawa, Naruhiko Inayoshi, Youichi Murakami, Masashi Suzuki, Takahiro Nozu
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Publication number: 20110020171Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.Type: ApplicationFiled: January 22, 2009Publication date: January 27, 2011Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
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Publication number: 20100266444Abstract: When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.Type: ApplicationFiled: August 2, 2007Publication date: October 21, 2010Applicant: TAIHO KOGYO CO., LTD.Inventors: Hiromi Yokota, Daisuke Yoshitome
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Publication number: 20100111753Abstract: [Task] The adhesion resistance of Cu—Bi based or Cu—Sn—Bi based alloy is lower than that of Cu—Sn—Pb based alloy, and also since conformability of the former alloy is low. Therefore, when Bi of the former alloy adheres onto an opposite shaft, seizure of the former alloy is likely to occur as compared with the case of the latter Cu—Sn—Pb based alloy. In is alloyed in the Bi phase of the Cu—Sn—Bi—In based copper alloy. The In-alloyed Bi phase has a considerably low melting point and therefore the sliding properties deteriorate. [Means for Solving] A Pb-free copper-based sintered sliding material has a composition that 0.5 to 15.0 mass % Bi and 0.3 to 15.0 mass % In, with the balance being Cu and inevitable impurities. With regard to the existence of Cu, Bi, and In, the material consists of a Cu matrix containing In, a Bi phase, and an In concentrated region in said Cu matrix at a boundary of said Bi phase.Type: ApplicationFiled: February 13, 2008Publication date: May 6, 2010Applicant: TAIHO KOGYO CO., LTD.Inventors: Daisuke Yoshitome, Takashi Tomikawa, Hitoshi Wada
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Patent number: 7678173Abstract: In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 ?m of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.Type: GrantFiled: January 13, 2005Date of Patent: March 16, 2010Assignee: Taiho Kogyo Co., Ltd.Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
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Publication number: 20080095658Abstract: [PROBLEMS] To provide a Cu—Bi—hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Ph free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 ?m average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.Type: ApplicationFiled: January 13, 2005Publication date: April 24, 2008Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
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Publication number: 20060000527Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.Type: ApplicationFiled: June 9, 2005Publication date: January 5, 2006Applicants: TAIHO KOGYO Co., Ltd., Kabushiki Kaisya DensoInventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Hayakawa, Naruhiko Inayoshi, Youichi Murakami, Masashi Suzuki, Takahiro Nozu
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Patent number: 6689488Abstract: A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetallic compound formed at the interface between the bulk of solder and a Ni or Cu conductor.Type: GrantFiled: February 7, 2002Date of Patent: February 10, 2004Assignee: Taiho Kogyo Co., Ltd.Inventors: Daisuke Yoshitome, Yasuhisa Tanaka
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Publication number: 20020150787Abstract: A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetallic compound formed at the interface between the bulk of solder and a Ni or Cu conductor.Type: ApplicationFiled: February 7, 2002Publication date: October 17, 2002Applicant: Taiho Kogyo Co., Ltd.Inventors: Daisuke Yoshitome, Yasuhisa Tanaka