Patents by Inventor Daisuku Yoshida

Daisuku Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the same
    Publication number: 20030180981
    Abstract: The present invention relates to a thin-film structural body formed by using a semiconductor processing technique and a manufacturing method thereof, and particularly in a thin-film structural body constituting a semiconductor acceleration sensor and a manufacturing method thereof, an object of the present invention is to provide a thin-film structural body which allows the thin-film member to be easily stress-controlled, and easily makes the film-thickness of the thin-film member thicker, and a manufacturing method thereof.
    Type: Application
    Filed: February 13, 2003
    Publication date: September 25, 2003
    Inventors: Kiyoshi Ishibashi, Makio Horikawa, Mika Okumura, Masaaki Aoto, Daisuku Yoshida, Hirofumi Takakura