Abstract: Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.

Abstract: Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.

Abstract: Greater levels of microwave and millimeter microwave frequency power is achieved in a new power amplifier structure in which sixteen MMIC amplifiers are supported in a 4×4 row by column matrix and the output (and input) manifold is of a “crazy-H” power combining structure. Even greater output power, on the order of 100 watts at 35 GHz, is achieved by combining multiple numbers of such power amplifier units through a radial combiner.

Abstract: An umbrella-shaped matching network (10, 14, 16) for matching phase and impedance in a power amplifier (2). The matching network (10, 14, 16) employs rounded corners (22). The rounded corners (22) reduce microwave signal scattering losses, because they are less prone to signal radiation than square corner power combining networks. The matching network (10, 14, 16) includes slits (24) defining separated arms (26). The slits (24) are positioned in such a way that they provide phase and amplitude balance for the signal presented to the amplifiers (2). The slits (24) also prevent current from traveling transversely.