Patents by Inventor Daita Kohno

Daita Kohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 7445964
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: November 4, 2008
    Assignees: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20070099409
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Application
    Filed: December 13, 2006
    Publication date: May 3, 2007
    Applicants: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • Semiconductor device and method of manufacturing the same
    Patent number: 7183639
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: February 27, 2007
    Assignees: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • Semiconductor device and method of manufacturing the same
    Publication number: 20050051886
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 10, 2005
    Applicants: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa