Patents by Inventor Daizi Sakamoto

Daizi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper-base alloys for leadframes
    Patent number: 4612167
    Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.
    Type: Grant
    Filed: March 1, 1985
    Date of Patent: September 16, 1986
    Assignee: Hitachi Metals, Ltd.
    Inventors: Rikizo Watanabe, Daizi Sakamoto