Abstract: A notch filter adaptation system for use with an active noise control system of a motor vehicle has a parameters determination module receiving data from a bus of a vehicle and employing the data to determine one or more parameters for a notch filter. The data can include vehicle type, tire diameter, tire cavity, and/or ambient temperature. The parameters can include one or more notch filter peak frequency values, one or more notch filter Q values, and/or modifications of predetermined peak frequency values and/or Q values. An active noise control module can employ the parameters to generate opposite phase noise in the vehicle according to one or more notch filters having frequency bands at least in part specified by the parameters.

Abstract: An improved hermetically sealed case for enclosing an electronic element, wherein the case has an upper portion and a lower portion connected together by atomic bonding. The upper portion includes through holes. Each hole forms a lead to provide a connection from the outside of the case to the element within the case. Each lead is arranged in the through hole to seal the hole hermetically and yet provide an electrical contact for the element. The sealed case prevents the electronic element from being deteriorated by hazardous gas generated by the conventional welding process used to seal such cases.

Abstract: An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.

Abstract: An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.