Abstract: The present disclosure is directed to providing a thermally conductive resin composition which can realize high thermal conduction without increasing the content of a thermally conductive filler, and also exhibits satisfactory moldability. Disclosed is a thermally conductive resin composition, comprising: a thermally conductive filler; and a binder resin, wherein the thermally conductive filler contains: a hard filler having a Mohs hardness of 5 or more; and a soft filler having a Mohs hardness of 3 or less, and wherein when the thermally conductive resin composition is solidified to stabilize its shape, the soft filler is pressed by the hard filler in the thermally conductive resin composition so that a surface of the soft filler is deformed by the hard filler in the pressed state to provide a face contact between the soft filler and the hard filler.