Abstract: Semiconductor light emitting elements are configured to be mounted on the substrate, a frame is configured to be vertically provided on the substrate in an annular or oval-annular shape so as to surround the semiconductor light emitting elements, and a sealing portion is configured to seal an inner wall of the frame, an upper surface of the substrate inside the frame, and the semiconductor light emitting elements. The sealing portion includes a first resin portion configured to have a concave surface having at least one rotational plane having a central axis of the frame as a rotational axis, and a second resin portion configured to cover the concave surface of the first resin portion and having a convex external surface, and the sealing portion has an external surface in which an external surface of the first resin portion and an external surface of the second resin portion are integrated.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting laminate, and an SOI substrate including an upper semiconductor layer, an interlayer insulating film, and a lower semiconductor layer. The SOI substrate includes a first wiring electrode provided on the upper semiconductor layer through an insulating film and corresponding to a p-electrode, a second wiring electrode connected to the upper semiconductor layer and corresponding to an n-electrode, an anode that is provided on the lower semiconductor layer and connected to a first wiring electrode by a first via electrode passing through the SOI substrate, a cathode that is provided on the lower semiconductor layer through an insulating film and connected to the upper semiconductor layer by a second via electrode reaching the upper semiconductor layer. The p-electrode and the n-electrode are respectively bonded to the first wiring electrode and the second wiring electrode.

Abstract: A semiconductor light emitting device includes: a light emitting element assembly including a semiconductor light emitting element including a support substrate and a light emitting semiconductor layer provided on the support substrate, and a light guide member adhered to the semiconductor light emitting element by an element adhesive layer; and a first coating film adhered to a side surface of the light emitting element assembly by a side wall adhesive layer and formed of an inorganic material, which is a light reflector configured to cover the side surface.

Abstract: A semiconductor light emitting device includes: a light emitting element assembly including a semiconductor light emitting element including a support substrate and a light emitting semiconductor layer provided on the support substrate, and a light guide member adhered to the semiconductor light emitting element by an adhesive layer; and a first coating film formed of an inorganic material, which is a light reflector configured to cover a side surface of the light emitting element assembly.

Abstract: A semiconductor light emitting device 10 includes: a resin frame 11 having an opening 20; a lead frame 12 having leads 12a and 12b exposed in the opening 20; and an LED 28 placed in the opening 20 and connected to the leads 12a and 12b. Standing parts 18a are erected on an upper surface 23a of the lead 12a. The standing parts 18a are embedded in the resin of the frame 11.

Abstract: A light-emitting device includes a substrate provided with a first wiring and a second wiring, a first element including a first electrode pad, a second element including a second electrode pad, a first wire connecting the second wiring and the first electrode pad and including a first wire horizontal part that is level with respect to a top surface of the first element, a second wire connecting the second wiring and the second electrode pad and including a second wire horizontal part that is level with respect to the top surface of the first element, and a reflective resin exposing the top surface of the first element. The reflective resin has a bulged portion in a bulged dike shape such that a surface of the reflective resin is brought into contact with at least a part of the second wire horizontal part and extends along the second wire horizontal part.