Patents by Inventor Daizo Miyanari

Daizo Miyanari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer separating and cleaning apparatus and process
    Patent number: 6139591
    Abstract: An individual wafer separating part separates batched wafers one by one from a slice base mounting beam, and then a shuttle conveyor transports the separated wafers one by one to an individual cleaning part so that the wafers can be cleaned individually. After the cleaning, a detecting part detects the thickness, breaking, chipping and remaining adhesives of the wafers. The wafers are classified in accordance with the results of the detection. Normal wafers are collected in wafer collecting parts, failed wafers are collected in a failed wafer collecting part, and wafers with remaining adhesives are collected into an adhesive remaining wafer collecting part.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: October 31, 2000
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Kenichi Nakaura, Satoru Minami, Daizo Miyanari